1953 U.S. NAVY ELECTRONIC MANUFACTURING DEVELOPMENT PROGRAM PROJECT TINKERTOY 47174
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As shown in this 1950s film "Project Tinkertoy"was the code-name for a development and proof of concept project undertaken by the National Bureau of Standards (NBS) to create a process for automated manufacture of electronic equipment and for demonstrating it on a pilot production line. The needs for this program came out of the new Cold War and the Korean War, where certain vital electronic components were in very short supply. The pilot plant created by Tinkertoy had to be compatible with the principles of modular design and mechanized production of electronics, or MDE and MPE. The pilot plant was up and running by 1953. An estimate of the manufacturing cost was made and found to be 44 percent lower than conventional processes. While NBS’s modular design was not used directly in industry, the modular design and mechanized production concepts became the customary way of producing electronic equipment.
The film begins with footage of the Loon Missile being launched off the submarine USS Cusk off Point Mugu, California. Modern weapons are guided electronically, fired electronically and exploded electronically. Modern warfare has developed to depend on electronics. At mark 1:05 is an electronic development plant. Present systems now with advanced techniques involve tedious hand assembly and components. These components are seen at mark 1;20. At mark 2:08 is the Navy applying electronics during WWII. The Navy went to the National Bureau of Standards, the Bureau assigned engineers and scientists to the research. Then project Tinkertoy is the codename for the work as seen at mark 3:00. These common denominators along with other research were subjected to several tests as seen at mark 3:20. High and low frequency vibration, centrifugal force, temperature tests and shock as seen at mark 3:50 and in all these, Tinkertoy passed all. At mark 6:45 is a chart which shows the component of the model. The proof of the system has been accomplish to a large scale he says as seen at mark 7:40. At mark 7:55 is the ceramic section. There are various ceramic processes here. At mark 9:10 is the automatic machine which reduces processes by manpower. At mark 9:30 is the furnace firing where all wafers are fired.
At mark 9:55 is the main production section. The wafers are dumped into the center sliding down through the feeder in a spiral movement. Also a chain carriage is seen and the wafers have silver notches which are then painted as seen at mark 10:38. The painted wafer is then processed. The second operation is seen at mark 11:00 which is performed by the wafer patterns. There are 8 possible wafer positions. From the feeders they slide down as seen at mark 12:05. The printing stencils are seen at mark 12:40 replaced. At mark 12:45 is a coding sheet. At mark 13:15after been dried, the wafers go through an electric firing furnace. At mark 13:22, they now bare completed patterns. The resistor tape as been cut and placed in the silver electrode areas at mark 15:30. They are however not finished until they are heated and to nut thinner. At mark 16:10is the automatically checking resistors. Here they are tested for individual specifications. At mark 16:40, the resistors are checked in a control panel. Meanwhile capacitors re been produced as wheel at mark 17:00. Here are the capacitors at mark 17:10. They are ready for thinning as seen t mark 17:30 in the thinning machine. Next is the capacitors assembler at mark 18;00. At mark 18:30, the slave units properly deposit the capacitors to the wafer in preparation for assembly. At mark 18:50, the components are welded together. At mark 19:10, the capacitors are tested also. A punch press is seen at mark 19:35. This is the tube socket assembler at mark 19:50. The tube socket part is seen. The flow chart is seen at mark 20:40 and it shows that all components are ready to be assembled into module. At mark 21:04 is the module assembler. Different components can be combined. Automatic soldering irons at mark 22:05. At mark 23:00 assembly is complete. Then there is the wire segment. At mark 24:03, all completed modules are tested in a machine. At mark 24:55 is a machine in a separate facility where the base plate is attached. The base plate allows for joining of the similar units of the system as seen at mark 26:18. The Navy has given the development of the system to engineers and scientists to aid in electronic mobilizations in time of need.
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