File:B-ad-bcbprocessflow.png
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DescriptionB-ad-bcbprocessflow.png | Schematic process flow of dry etch and photosensitive BCB wafer bonding technique. |
Date | (UTC) |
Source | J. Oberhammer and F. Niklaus and G. Stemme, Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities (2003) |
Author | Fraunhofer ENAS, D. Neumann |
Permission (Reusing this file) |
This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Germany license. Attribution: Fraunhofer ENAS
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current | 11:54, 10 April 2011 | 635 × 850 (27 KB) | Enaswiki (talk | contribs) | {{Information |Description ={{en|1=Schematic process flow of dry etch and photosensitive BCB wafer bonding technique}} |Source ={{own}} |Author =Enaswiki |Date = |Permission ={{cc-by-sa-3.0-de|Fraunhofer |
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