[go: nahoru, domu]

Jin et al., 2015 - Google Patents

Patterning of Aluminium thin film on polyethylene terephthalate by multi-beam picosecond laser

Jin et al., 2015

Document ID
6473548124506917146
Author
Jin Y
Perrie W
Harris P
Allegre O
Abrams K
Dearden G
Publication year
Publication venue
Optics and Lasers in Engineering

External Links

Snippet

High speed patterning of a 30 nm thick Aluminium thin film on a flexible Polyethylene Terephthalate substrate was demonstrated with the aid of Computer Generated Holograms (CGH׳ s) applied to a phase only Spatial Light Modulator. Low fluence picosecond laser …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626Energy control of the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting

Similar Documents

Publication Publication Date Title
Jin et al. Patterning of Aluminium thin film on polyethylene terephthalate by multi-beam picosecond laser
Albu et al. Periodical structures induced by femtosecond laser on metals in air and liquid environments
Lin et al. Femtosecond laser precision engineering: from micron, submicron, to nanoscale
Li et al. An optimal process of femtosecond laser cutting of NiTi shape memory alloy for fabrication of miniature devices
Kim et al. Metal thin film ablation with femtosecond pulsed laser
Kuang et al. High throughput diffractive multi-beam femtosecond laser processing using a spatial light modulator
Cheng et al. Effects of laser operating parameters on metals micromachining with ultrafast lasers
Danilov et al. Single-shot front-side nanoscale femtosecond laser ablation of a thin silver film
Allahyari et al. Femtosecond laser surface irradiation of silicon in air: Pulse repetition rate influence on crater features and surface texture
Kim et al. Ablation of polyimide thin-film on carrier glass using 355 nm and 37 ns laser pulses
Venkatakrishnan et al. Sub-micron ablation of metallic thin film by femtosecond pulse laser
Veiko et al. Picosecond laser registration of interference pattern by oxidation of thin Cr films
Oliveira et al. Sub-micron structuring of silicon using femtosecond laser interferometry
Rapp et al. Functional multilayered capacitor pixels printed by picosecond laser-induced forward transfer using a smart beam shaping technique
Dietrich et al. Investigation of increased drilling speed by online high-speed photography
Stein et al. Numerical simulation of laser ablation for photovoltaic materials
Meinertz et al. Fast fabrication of diffractive patterns on glass by excimer laser ablation
Zagoranskiy et al. Guided self-organization of nanodroplets induced by nanosecond IR laser radiation of molybdenum films on sapphire
Molotokaite et al. Picosecond laser beam interference ablation of thin metal films on glass substrate
Harrison et al. A study of stitch line formation during high speed laser patterning of thin film indium tin oxide transparent electrodes
Kovačević et al. Inducing subwavelength periodic nanostructures on multilayer NiPd thin film by low-fluence femtosecond laser beam
Lang et al. High-throughput direct laser interference patterning: new configurations and applications
Sarma et al. Effect of Laser Parameters on Laser-Induced Plasma-Assisted Ablation (LIPAA) of Glass
Regelskis et al. Ripple formation in the chromium thin film during laser ablation
Sugioka et al. Fundamentals of femtosecond laser processing