CN101793840A - Diamond cutting parameter measurement method and measuring device - Google Patents
Diamond cutting parameter measurement method and measuring device Download PDFInfo
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- CN101793840A CN101793840A CN 201010136202 CN201010136202A CN101793840A CN 101793840 A CN101793840 A CN 101793840A CN 201010136202 CN201010136202 CN 201010136202 CN 201010136202 A CN201010136202 A CN 201010136202A CN 101793840 A CN101793840 A CN 101793840A
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Abstract
The invention relates to a diamond cutting parameter measurement method and a measuring device. The measuring method includes the following steps that: standard samples with corresponding sizes are chosen according to the diameters of sample holders, the measuring results of the standard samples with different sizes are taken as correction coefficients for measurement, a sample holder with a corresponding diameter is chosen according to the size of a diamond to be measured, the diamond to be measured is placed on the chosen sample holder which is then placed in a cutting parameter measuring instrument, and the images of the different sides of the sample holder and the diamond are acquired; by processing, analyzing and calculating each image, key characteristic points in the images, which are related to diamond cutting, are found, the position coordinates of the key characteristic points are calculated, cutting parameters are calculated, and the cutting parameters of the diamond to be measured are corrected. The special-purposed device comprises a light source, the rotatable sample holders, a camera lens and an image acquisition system. The invention can accurately measure the cutting parameters of diamonds with different sizes, measurement is quick, and use is convenient.
Description
Technical field
The invention belongs to the diamond cutting parameter measurement field, be specifically related to a kind of diamond cutting parameter measurement method and measurement mechanism.
Background technology
In jewel or diamond assessment classification, cut is a very important assessment factor, and the cut quality has very big influence to the market price of diamond, but the cut parameter of accurately measuring diamond is again the comparison difficulty.The surveying work of diamond cutter parameter mainly is to measure the data such as physical dimension, facet angle and facet relative scale of cutting the good finished product diamond of mill, according to different evaluation criterias jewel is carried out cut grading then.
Existing cut measurement mainly contains three kinds: the one, reach by magnifier, microscope by visual, estimate the cut parameter by observing the image that diamond manifested, this method simple and fast, and can be used for measuring the cut of inlaying diamond, but the measurement data accuracy is low, and is subjected to the influence of gauger's level; The 2nd, the diamond side projection is thrown on the screen that is carved with scale, manually to carry out reading then and calculate the cut parameter, this method detects accurately relatively poor, and measurement needs the time longer; The 3rd, to test by computer automatic measuring system, this method mainly is to calculate diamond by computer image processing technology to cut parameter, this method can obtain in detail more in the less time and cut data more accurately.
Yet present stage adopts the third method to measure the diamond cutter parameter, because single instrument can only be measured the diamond cutter ratio of certain size scope, off-limits diamond can't be measured, the analyser that evaluation department must purchase different size could satisfy daily need of work, the efficient of measuring different size diamond cutter parameter is low, degree of accuracy is low, and increased user's acquisition cost, in addition, owing to adopt fixing camera, the ratio of imaging is non-adjustable, for the diamond of different size, measuring error is bigger.
Summary of the invention
The objective of the invention is to solve that present single instrument can only be tested among a small circle the size diamond, efficiency of measurement is low, error is big, the imaging ratio is non-adjustable causes measuring coarse defective, and provide a kind of analyser that need not to change different size just can measure the parameter and the high a kind of diamond cutting parameter measurement method and the measurement mechanism of measuring accuracy of the diamond cutter of size on a large scale.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of diamond cutting parameter measurement method, comprise following steps: the platform diameter is selected the standard model of corresponding size per sample, the measurement result of gathering the different size standard model is as the correction coefficient of measuring, select the sample stage of respective diameters according to tested diamond size, tested diamond is placed on inserts the cutting parameter measurement instrument on the selected sample stage, the different side images of collected specimens platform and diamond, by each image is handled, analyze and calculate, find out key feature point relevant in the image with diamond cutter, and calculate the position coordinates of key feature point, calculate the cut parameter by position coordinates, choose the correction coefficient corresponding tested diamond cutter parameter is proofreaied and correct with the sample stage diameter.
Described Flame Image Process and analytical procedure comprise gradation conversion, two-value conversion, edge transition, and the key feature point calculating method is that angle point is sought method or fitting a straight line method.
Described two-value conversion is divided into determines segmentation threshold and two steps of image binaryzation.
Gained cut parameter is left in the independent database,, calculate the diamond cutter rank automatically according to the cut grading standard.
A kind of special measurement device of diamond cutting parameter measurement method, at least comprise light source, shooting and image capturing system, and be positioned between the two rotatable sample platform, shooting and image capturing system comprise pick-up lens, image processing module and connected cut data computation module and Database Systems, pick-up lens is varifocal pick-up lens, and the rotatable sample platform is made up of sample stage, the platform rotating driving device of a plurality of different-diameters.
Described light source is made up of LED luminotron and collimation lens set; Collimation lens set is made up of a plurality of lens; The varifocal imaging camera lens is made up of imaging lens group and camera.
Described platform rotating driving device is made up of stepper motor, stepper motor driver and interface conversion circuit, and stepper motor driver is by the motion of interface conversion circuit control step motor.
The present invention adopts the sample stage of a plurality of diameters, select the sample platform of respective diameters according to tested diamond size, can collect the image of suitable enlargement factor, and adopt varifocal pick-up lens, can select the shooting focal length according to the size of measurand, improve the Flame Image Process degree of accuracy, thereby improved the cutting parameter measurement precision; And when measuring the tested diamond of different size scope, need not change testing tool, only need choose the respective diameters sample stage puts into testing tool, can test the diamond of different size size, has improved work efficiency, has saved the expense of purchasing a plurality of testing tools; The diamond cutter parameter of the various criterion size that same testing tool tested, the correction coefficient as test has further improved measuring accuracy.
Description of drawings
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention, needed accompanying drawing is done at length and is introduced in will describing embodiment below, and apparently, the accompanying drawing in describing below only is specific embodiments more of the present invention.
Fig. 1 is a kind of diamond cutting parameter measurement method process flow diagram of the present invention;
Fig. 2 is an image processing step process flow diagram in a kind of diamond cutting parameter measurement method of the present invention;
Fig. 3 is the employed measurement mechanism synoptic diagram of diamond cutting parameter measurement method of the present invention;
Wherein:
The 1-light source, 2-rotatable sample platform, 3-pick-up lens, 4-image capturing system, 5-collimation lens set, 6-brace table.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described.
Fig. 1 is a kind of diamond cutting parameter measurement method process flow diagram of the present invention, at first with the sample measurement result of a plurality of various criterion sizes as the correction coefficient of measuring, proofread and correct tested diamond cutter parameter, according to tested diamond size size, select the sample stage of respective diameters, diamond is placed on the sample stage, sample stage is put into testing tool, collected specimens platform and diamond be the image of ipsilateral not, by Flame Image Process and analysis module the image of gathering is handled, calculate key feature point with the diamond cutter parameter correlation, position coordinates by key feature point calculates the cut parameter, gather the sample stage image of different-diameter, calculate the reference dimension that its enlargement factor is calculated as Flame Image Process.
In image acquisition and the processing module, gather and handle the not image of ipsilateral of several samples,, adopt image process method, obtain measuring relevant key feature point with diamond cutter for every width of cloth image.Further, respectively image is carried out gray scale processing, two-value conversion and edge transition, ask the key feature point with reference to figure 2.
Concrete image processing method is:
1, because image capture module collects is several coloured images, each pixel of image is made up of red (R), green (G), blue (B) three values, the tristimulus values of each pixel of coloured image (R, G B) obtain brightness value Y according to following formula:
Y＝0.299R+0.587G+0.114B
The brightness value of all positions has just formed gray level image, and coloured image is become gray-scale map.
2, luminance picture is converted to bianry image, just object is split from background.This process was divided into for two steps: determine segmentation threshold and image binaryzation, at first obtain the intensity profile histogram of luminance picture, adopt alternative manner to calculate binary-state threshold T then.
3, utilize threshold value that luminance picture is become bianry image, brightness value is set to background value 1 more than or equal to the value of the pixel of threshold value T, is set to object value 0 less than the pixel of threshold value T.Be shown below:
(x is that ((x is that (bright-dark degree that chooses according to the image of gathering of T value dynamically determines for x, the y) value in position in the bianry image after the threshold process y) to b for x, brightness value y) in the position y) to g in the formula.
4, from bianry image, extract the edge, form the edge contour image.This system only need extract the exterior contour of sample, therefore utilizes eight edge following algorithms [3] that connect, and from the bottom of two-value, outer boundaries is followed the tracks of.
5, ask key feature to put employed algorithm and have two kinds: angle point finding method and line fitting method.Can utilize Corner Detection Algorithm to obtain for the unique point of vertex (vertices), girdle and bizet, but then need to obtain the fitting a straight line of sample stage earlier and the fitting a straight line of bizet is tried to achieve for two unique points on the table top.After these unique points of being obtained, utilize cartesian geometry knowledge to calculate needed ratio and angle.
6, calculate the position coordinates of these key feature points, calculate diamond the girdle diameter, complete dark than, crown height ratio, Guan Jiao, booth deeply than cut ratio and inclined to one side circularity such as, booth angle, the wide ratio of platform, waist thickness rate, vertex (vertices) compare, cut supplemental characteristics such as symmetric parameter such as the end is inclined to one side, platform is inclined to one side, platform inclines.
7, select correction coefficient to proofread and correct according to measured diamond size size, obtain the high diamond cutter parameter of degree of accuracy; Cut grading standard by in the database that is provided with calculates the diamond cutter rank automatically.
Fig. 3 is the employed measurement mechanism synoptic diagram of diamond cutting parameter measurement method of the present invention, comprise light source 1, rotatable sample platform 2, pick-up lens 3 and image capturing system 4, rotatable sample platform 2 is between light source 1 and pick-up lens 3, and pick-up lens 3 is connected with image capturing system 4.Pick-up lens 3 is varifocal pick-up lens, rotatable sample platform 2 is made up of placement example platform, the platform rotating driving device of a plurality of different-diameters, and described image capturing system 4 comprises image processing module and connected cut data computation module, Database Systems.Light source 1, rotatable sample platform 2, camera 3 are placed on the brace table 6, handled easily.
In the concrete measurement mechanism:
1, the Lights section:
Be made up of led light source and collimation lens set, the light collimation lens set is made up of a plurality of lens, and with the light conversion parallel rays that LED sends, parallel rays helps system and obtains side projection image accurately.
2, sample stage:
Form by sample stage, stepper motor, motor driver and interface conversion circuit.Sample stage is used to place the reference dimension of sample and conduct calculating; Stepper motor, motor driver and interface conversion circuit are used for the mechanism that system rotates sample, can collect the not projected image of ipsilateral face by rotating sample with regard to system; Interface conversion circuit uses the I/O interface of USB, for stepper motor provides pulse signal, and the motion of control step motor.The stepper motor revolution moves an angle, just obtains the key feature point of one group of diamond image.
3, camera:
Form by imaging lens group and camera.Imaging lens group is made up of a plurality of lens, with the side projection imaging of sample; Camera is varifocal camera, selects suitable focal length according to measured diamond size, after the images acquired, by interface the view data of gathering is sent to image capture module.
4, image capturing system:
Be used for the image of gathering is handled, calculate key feature point data and cut parameter, the correcting measuring parameter is determined the diamond cutter rank.
Through the experiment with measuring of diamond cutter parameter repeatedly, adopt diamond cutter parameter test method of the present invention and special measurement device, can measure the girdle diameter (comprising mean value and scope) of diamond and complete dark, measuring error is less than ± 0.002mm; Can calculate the weight of diamond according to the physical dimension of measuring; Measure diamond complete dark than, the wide ratio of platform, booth deeply than, vertex (vertices) than ratio parameters such as, asterism ratio, following central plane compare, measuring error is less than ± 0.02%; Also can measure Guan Jiao and booth angle, measuring error is less than ± 0.1 °; Measure the main symmetry parameter of diamond; Inclined to one side circularity, the end that can measure diamond, is inclined to one side, table top is eccentric and symmetry parameter such as table top inclination, and measuring error is less than ± 0.05%.
This measurement mechanism is linked to each other with jewel optics effect emulation system, can generate the three-dimensional model of this diamond, and then simulate the optical effect of this diamond, thereby, estimate the rank of diamond cutter from the quality of the angle analysis cut of optical effect.
The cut supplemental characteristic that measurement mechanism is tested out and classification results are connected (ODBC) by exploitation formula database and are saved in independent database or the appraising datum and go, for the convenience of operating, database management function is worked out out diamond cutter ranked data base management system separately, can inquire about, safeguard and be output into the diamond cutter data outside file, the printing, import other value parameters of diamond again, a diamond cutter classification certificate management system can be generated, and printing diamond classification certificate can be called out.
This system can be widely used in the identification experiment chamber and be used to carry out the diamond cutter classification, also can be used for man of added diamond factory and carries out quality inspection in process of production, and the retailer can be used as the particularly means of high-level naked brill of a kind of sales promotion diamond.
Diamond cutting percentage measuring method of the present invention and special measurement device combine the advantage of computer image processing technology, have certainty of measurement height, fast, the automaticity advantages of higher of speed.
Claims (10)
1. diamond cutting parameter measurement method, it is characterized in that, the platform diameter is selected the standard model of corresponding size per sample, with the measurement result of different size standard model as the correction coefficient of measuring, select the sample stage of respective diameters according to tested diamond size, tested diamond is placed on inserts the cutting parameter measurement instrument on the selected sample stage, the different side images of collected specimens platform and diamond, by each image is handled, analyze and calculate, find out key feature point relevant in the image with diamond cutter, and calculate the position coordinates of key feature point, calculate the cut parameter by position coordinates, choose the correction coefficient corresponding tested diamond cutter parameter is proofreaied and correct with the sample stage diameter.
2. diamond cutting parameter measurement method according to claim 1 is characterized in that: described Flame Image Process and analytical procedure comprise gradation conversion, two-value conversion, edge transition.
3. diamond cutting parameter measurement method according to claim 2 is characterized in that: described key feature point calculating method is that angle point is sought method or fitting a straight line method.
4. diamond cutting parameter measurement method according to claim 2 is characterized in that: described two-value conversion is divided into determines segmentation threshold and two steps of image binaryzation.
5. diamond cutting parameter measurement method according to claim 1 is characterized in that: gained cut parameter is left in the independent database, according to the cut grading standard, calculate the diamond cutter rank automatically.
6. the special measurement device of the described diamond cutting parameter measurement method of claim 1, at least comprise light source, shooting and image capturing system, and be positioned between the two rotatable sample platform, it is characterized in that: shooting and image capturing system comprise pick-up lens, image processing module and connected cut data computation module and Database Systems, pick-up lens is varifocal pick-up lens, and the rotatable sample platform is made up of sample stage, the platform rotating driving device of a plurality of different-diameters.
7. diamond cutting parameter measurement device according to claim 6 is characterized in that: described light source is made up of LED luminotron and collimation lens set.
8. diamond cutting parameter measurement device according to claim 7 is characterized in that: described collimation lens set is made up of a plurality of lens.
9. diamond cutting parameter measurement device according to claim 6 is characterized in that: described varifocal imaging camera lens is made up of imaging lens group and camera.
10. diamond cutting parameter measurement device according to claim 6, it is characterized in that: described platform rotating driving device is made up of stepper motor, stepper motor driver and interface conversion circuit, and stepper motor driver is by the motion of interface conversion circuit control step motor.
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Cited By (12)
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| CN102175686A (en) * | 2011-01-10 | 2011-09-07 | 国家黄金钻石制品质量监督检验中心 | Method for measuring cutting ratio of imbue diamond |
| CN102476333A (en) * | 2010-11-25 | 2012-05-30 | 义乌市亦和自动化装备有限公司 | Cut tangent plane processing method |
| WO2012172571A1 (en) * | 2011-06-15 | 2012-12-20 | Titan Industries Ltd | Automation system for diamond bagging |
| CN105681769A (en) * | 2016-04-08 | 2016-06-15 | 杭州康永生物技术有限公司 | Data collector of detection cup |
| CN107621465A (en) * | 2017-10-20 | 2018-01-23 | 中国地质大学（武汉） | A kind of diamond identity identifying method |
| CN107807129A (en) * | 2017-11-29 | 2018-03-16 | 周大生珠宝股份有限公司 | Diamond lamp source diamond measuring instrument and diamond measuring method |
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| CN111267250A (en) * | 2020-03-30 | 2020-06-12 | 南京宝光检测技术有限公司 | Method for matching diamond center line and turntable center line based on symmetric rotation |
| CN111323086A (en) * | 2020-04-21 | 2020-06-23 | 深圳钻邦客网络科技有限公司 | Diamond detection equipment |
| CN111337497A (en) * | 2020-03-30 | 2020-06-26 | 南京宝光检测技术有限公司 | Method for rapidly measuring cutting proportion based on standard round drill type diamond key surface |
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| CN112819809A (en) * | 2021-02-24 | 2021-05-18 | 中国地质大学（北京） | Method for quantifying mineral particle morphology in rock |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102476333A (en) * | 2010-11-25 | 2012-05-30 | 义乌市亦和自动化装备有限公司 | Cut tangent plane processing method |
| CN102175686A (en) * | 2011-01-10 | 2011-09-07 | 国家黄金钻石制品质量监督检验中心 | Method for measuring cutting ratio of imbue diamond |
| WO2012172571A1 (en) * | 2011-06-15 | 2012-12-20 | Titan Industries Ltd | Automation system for diamond bagging |
| CN105681769A (en) * | 2016-04-08 | 2016-06-15 | 杭州康永生物技术有限公司 | Data collector of detection cup |
| CN107621465A (en) * | 2017-10-20 | 2018-01-23 | 中国地质大学（武汉） | A kind of diamond identity identifying method |
| CN107621465B (en) * | 2017-10-20 | 2019-12-17 | 中国地质大学（武汉） | Diamond identity identification method |
| CN107807129A (en) * | 2017-11-29 | 2018-03-16 | 周大生珠宝股份有限公司 | Diamond lamp source diamond measuring instrument and diamond measuring method |
| CN109738447B (en) * | 2018-12-14 | 2021-12-21 | 惠州锂威新能源科技有限公司 | Automatic deviation rectifying method and device for battery pole piece protective adhesive |
| CN109738447A (en) * | 2018-12-14 | 2019-05-10 | 惠州锂威新能源科技有限公司 | A kind of automatic correction method and device of battery pole piece protective glue |
| CN111267250A (en) * | 2020-03-30 | 2020-06-12 | 南京宝光检测技术有限公司 | Method for matching diamond center line and turntable center line based on symmetric rotation |
| CN111337497A (en) * | 2020-03-30 | 2020-06-26 | 南京宝光检测技术有限公司 | Method for rapidly measuring cutting proportion based on standard round drill type diamond key surface |
| CN111267250B (en) * | 2020-03-30 | 2021-12-17 | 南京宝光检测技术有限公司 | Method for matching diamond center line and turntable center line based on symmetric rotation |
| CN111323086A (en) * | 2020-04-21 | 2020-06-23 | 深圳钻邦客网络科技有限公司 | Diamond detection equipment |
| CN112819810A (en) * | 2021-02-24 | 2021-05-18 | 中国地质大学（北京） | Sand particle roundness calculation method |
| CN112819809A (en) * | 2021-02-24 | 2021-05-18 | 中国地质大学（北京） | Method for quantifying mineral particle morphology in rock |
| CN112819809B (en) * | 2021-02-24 | 2023-06-16 | 中国地质大学（北京） | Method for quantifying morphology of mineral particles in rock |
| CN112819810B (en) * | 2021-02-24 | 2023-06-20 | 中国地质大学（北京） | Sand particle roundness calculation method |
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Application publication date: 20100804 |