DE102004043747A1 - Transponder manufacturing method, involves displacing and fastening antenna aerial on substrate surface by displacement of sonotrode to form antenna, and connecting end piece of aerial with connection surface of chip by thermo compression - Google Patents

Abstract

The method involves attaching an end piece (6a) of an antenna aerial (6) on a connection surface (4a) of a chip (3) by an ultrasonic sonotrode to form a heft area. The aerial is displaced and fastened on the surface of a substrate (1) by a displacement of the sonotrode to form an antenna. The end piece is connected with the surface (4a) in the area by thermo compression to form a connection between the end piece and the surface (4a). An independent claim is also included for a transponder, which is arranged on a substrate.

Description

The The invention relates to a process for the preparation of at least one a chip unit constructed on a transponder upper surface of a flat substrate according to the preamble of claim 1. Furthermore, the invention relates to a Transponder, which is arranged on a substrate, according to the preamble of claim 12.

Out DE 196 197 71 A1 a method for laying an antenna wire on a substrate by means of ultrasound is known, which additionally includes the subsequent step of connecting the antenna wire with pads of a chip unit by means of thermocompression. For this purpose, the antenna wire is led away during the laying process, inter alia, over the connection surface of the chip unit and after completion of the installation process in the region of this pad a permanent electrical contact or connection between the overlying the antenna surface and the pad itself.

One such over the pads lead away from the Antenna wire for forming a arranged on a substrate Antenna has the consequence that a from the antenna wire start or Antenna wire end extending to the pad of the chip unit Antenna wire section as for the function of the antenna unusable section is present, the to an increased Antenna wire consumption in the production of transponders and to an additional Space requirement on the substrate leads.

Of Further must during the laying process when passing the antenna wire over the pads The chip unit should be taken to ensure that the antenna wire laying ultrasonic sonotrode with a wire feeder coupled, at the transition from a surface of the substrate on the usually slightly higher first pad of the Chip unit not the antenna wire due to the through the chip unit demolished edge formed or this undesirable is arranged. The same applies to the subsequent transition from the first interface on the surface of the substrate.

As well These are the two transitional conditions on the way out of the antenna wire over the second interface to take into account. The Abreißrisiko Attempts to minimize by adding a speed of delivery of the Antenna wire during Displacement movement of the ultrasonic sonotrode is varied. A such variation of the feed rate should Consequently, a total of four times to be produced per transponder.

such Variations of the wire feed lead as well like the circumstance that due to the previously used vertical position the rod-shaped Ultrasonic sonotrode opposite the horizontally oriented substrate a limited impact energy of the sonotrode transferred to the substrate can be, to a limited displacement speed of the ultrasonic sonotrode when laying the antenna wire.

As a result, The present invention is based on the object, a method for the production of transponders, which material and space-saving as well as a fast production of the transponder allowed. It is also the object of the invention to provide a material-saving and quickly manufacturable transponder for disposal to deliver.

These Task is procedurally by the features of claim 1 and device side by the features of claim 12 solved.

• – Anheften eines ersten Endstücks (6a) eines Antennendrahts (6) auf einer ersten Anschlussfläche (4a) der Chipeinheit (3, 4a, 4b) mittels einer Ultraschallsonotrode (7) zur Bildung einer Heftstelle;
• – Verlegen und Befestigen (6) des Antennendrahts (6) beginnend von dem Endstück (6a) auf der Oberfläche des Substrats (1) durch ein parallel zu der Substratebene des Substrats (1) durchgeführtes Verschieben der Ultrallschallsonotrode (7) zur Bildung der Antenne (2), und anschließend
• – Verbinden des ersten Endstückes (6a) des Antennendrahtes (6) mit der ersten Anschlussfläche (4a) der Chipeinheit (3, 4a, 4b) in Bereich der ersten Heftstelle mittels Thermokompression, Löten oder Kleben zur Bildung einer dauerhaften, elektrischen Kontaktverbindung zwischen dem ersten Endstück (6a) und der ersten Anschlussfläche (4a).

An essential point of the invention is that, in a method for producing a transponder constructed from at least one antenna and at least one chip unit, the following steps are performed on an upper surface of a flat substrate:

• - attaching a first end piece ( 6a ) of an antenna wire ( 6 ) on a first connection surface ( 4a ) of the chip unit ( 3 . 4a . 4b ) by means of an ultrasonic sonotrode ( 7 ) to form a stapling point;
• - laying and fixing ( 6 ) of the antenna wire ( 6 ) starting from the tail ( 6a ) on the surface of the substrate ( 1 ) through a plane parallel to the substrate plane of the substrate ( 1 ) carried out moving the ultrasound sonotrode ( 7 ) for forming the antenna ( 2 ), and subsequently
• - connecting the first end piece ( 6a ) of the antenna wire ( 6 ) with the first connection surface ( 4a ) of the chip unit ( 3 . 4a . 4b ) in the region of the first stapling point by means of thermocompression, soldering or gluing to form a permanent, electrical contact connection between the first end piece ( 6a ) and the first pad ( 4a ).

Due to the fact that a laying of the antenna does not start on the surface of the substrate, but on a pad of the chip module is to be produced in a variety of Transponders a material saving possible insofar as that the antenna wire section from a mounted on the surface of the substrate tail of the antenna wire to the antenna wire section, which has been led away over the terminal surface, passes. This leads to reduced costs and a saving of space on the substrate.

Of the Antenna wire with its tail becomes only on the connection surface the chip unit temporarily attached or fixed to then with the same ultrasonic sonotrode that performed the attachment process, to start a laying process. This way, during the Laying only two steps with respect to the laying plane to bridge, namely the transition from the first interface to the surface of the substrate and the second transition from the surface of the substrate to the second pad. This has the consequence that reduces the number of transitions which results in a lower number of variations in speed the antenna wire feed while the laying process leads. Thus, a faster and easier laying of the antenna wire possible.

The mostly rod-shaped trained ultrasound sonotrode can during installation and fixing of the antenna wire with an angle parallel to the laying direction moved to the substrate level, in addition to an anyway through the sonotrode generated impact energy Frictional energy at the surface of the substrate. While the impact energy for fusible substrates, e.g. Plastics, the energy for melting the substrate for a Darinverlegen the antenna wire generated, is generated by the generated friction energy frictional heat between the preferably in the ultrasonic sonotrode supplied antenna wire and the surface produced by the substrate, which also non-meltable substrates a connection with, for example, a glue wire that the Antenna wire represents, enter.

by virtue of by the inclination the ultrasonic sonotrode generates additional frictional energy an increased Shifting movement speed for the ultrasonic sonotrode and thus allowing a faster laying of the antenna wire. This has a considerable time savings compared to the previously known production methods result.

Of the between the rod-shaped trained ultrasonic sonotrode and installation direction included Angle is in a range of 70 ° -90 °, preferably from 85 ° -89 °, the Ultrasonic sonotrode turned both to the laying movement direction as well as away from this can be arranged obliquely. Prefers is a re the laying movement direction tilted back position of the rod-shaped sonotrode.

Preferably is used as the material of the substrate under the influence of friction energy selected melting material, which in combination with an adhesive wire used as an antenna wire maximum possible Laying speeds in the production of a transponder allowed.

Further Steps of the method according to the invention include bonding with or without prior attachment a second end piece of the antenna wire with a second pad of the Chip unit, around a closed, the chip unit and the antenna wire to receive a containing loop.

According to one preferred embodiment the inventive method in addition to that initial Step of inserting the chip unit into a recess formed in the substrate in such a way that the first and the second pad of the chip unit at least partly on the surface of the substrate and a chip disposed within the recess will be on. As a result, due to a formation of total two steps in relation the laying level in the course of the laying direction a variation in the speed of the feeder of the antenna wire to the surface of the substrate and / or a variation of the displacement movement of the ultrasound sonotrode overall only twice must take place. Alternatively, both the pads as well the chip above the surface plane the substrate surface lie by placing the scanned chip unit on the substrate surface becomes.

During the Laying the antenna wire in the transition from the first pad to the surface the substrate becomes the displacement movement of the ultrasonic sonotrode briefly slowed down and / or the supply of the antenna of the antenna wire briefly accelerated and possibly raised. At the transition from the surface of the substrate to the second pad is during the laying of the antenna wire a feeder of the antenna wire inside or at the ultrasonic sonotrode accelerates and / or the displacement movement of the ultrasonic sonotrode slowed down.

Alternatively, the chip unit can be arranged in such a way that its first and second connection surfaces lie with their upper-side surfaces in a common plane of the surface of the substrate, and the chip unit is arranged as a chip module within the recess. To this In this way, it is no longer necessary to vary the displacement speed of the ultrasonic sonotrode and the supply of the antenna wire during the laying of the antenna wire, since there are no steps with respect to the laying plane.

One Transponder, which is arranged on a substrate, is advantageous produced by a process with the steps described above.

Further advantageous embodiments emerge from the dependent claims.

advantages and expediencies are the following description in conjunction with the drawings refer to. Hereby show:

1 in a plan view of a arranged on a substrate transponder;

2 in a perspective schematic representation of fragmentary parts of the transponder whose manufacturing process steps according to the invention are indicated;

3 in a schematic representation of a further transponder whose manufacturing process steps according to the invention are indicated,

4 in a schematic side view of a representation of an ultrasonic sonotrode during the application of the manufacturing method according to the invention.

In 1 is in a plan view on a substrate 1 arranged transponder, which consists of an antenna 2 and a chip unit 3 . 4a and 4b exists. The chip unit 3 . 4a , and 4b consists of the actual chip 3 and the attached pads 4a and 4b , to each of which an end piece of an antenna wire of the antenna 2 takes you.

In 2 In a schematic perspective view, a detail of a transponder with a substrate is shown, in which the various production method steps according to the invention are shown as indicated.

The substrate 1 has a recess 5 on, which is designed in their dimensions such that they are the chip 3 can record. The chip 3 has a first connection surface on the upper side 4a and 4b on that on a surface of the substrate 1 lie as soon as the entire chip unit is arranged in and on the substrate.

First, an end piece according to the invention 6a of the antenna wire 6 on the first connection surface 4a Briefly attached by means of the ultrasonic sonotrode, not shown here. Subsequently, a laying of the antenna wire 6 on the surface of the substrate 1 as indicated by an arrow instead.

After the antenna wire 6 is laid in the desired antenna shape by means of the ultrasonic sonotrode and connected to the surface of the substrate, a connection step for permanent electrical contacting of the tail 6a with the first interface 4a and in addition another end piece of the antenna wire, not shown here 6 with the second interface 4b the chip unit performed. Such a bonding process can be performed by thermocompression or by soldering or gluing with conductive adhesives.

After the initial step of attaching the tail 6a of the antenna wire 6 on the first connection surface 4a has been performed, the ultrasonic sonotrode shifts in the laying direction, which is indicated by the arrow. At the transition from the first pad 4a to the surface of the substrate 1 During the laying process, there is a brief slowing down of the displacement movement speed of the ultrasonic sonotrode or an acceleration of the feeding of the antenna wire 6 instead, to the best possible concern or merge the antenna wire 6 with the surface of the substrate 1 in the step area, ie in the transition area of the pad 4a to the surface of the substrate 1 to reach.

Likewise, this must be done at the transition from the surface of the substrate 1 to the second pad 4b the chip unit are taken into account.

In 3 In a schematic perspective representation, a detail of a transponder arranged on the substrate is shown, in which the production method steps according to the invention are also reproduced as indicated. Essentially, the method steps correspond to those in 3 embodiment shown to those as in 2 have already been described, with the exception that the chip unit is not arranged within a recess arranged in the substrate, but as a chip module on the surface of the substrate 1 is attached.

The chip module has the top side of the chip 3 and on the left and right sides the connection surfaces 4a and 4b on. Again, there is a laying of the antenna wire 6 and an initial attachment of the tail 6a of the antenna wire 6 as well as one off closing connecting the end pieces with the pads instead.

In 4 is shown in a schematic side view of an ultrasonic sonotrode during the manufacturing process according to the invention. As can be seen from the illustration, the ultrasonic sonotrode is 7 with the centrally supplied from top to bottom antenna wire, which is not shown in this illustration, with an angle 8th relative to the horizontal, ie the surface of the substrate 1 arranged tilted backwards relative to the laying direction. With this angle the ultrasound sonotrode becomes 7 moved during the laying process of the antenna wire on the substrate and the pads of the chip unit. In this way, besides one by the ultrasound from the ultrasonic sonotrode 7 impact energy transferred to the substrate 10 additionally a friction energy 11 generated at the surface of the substrate, the vector-wise to a common component 9 added.

The impact energy is especially in fusible substrates, such as Plastics, for melting the substrate and for embedding the Antenna wire used in the molten area. The friction energy on the other hand, due to the generated frictional heat between the antenna wire and the surface the substrate even in non-meltable substrates to a compound of a glue wire and the substrate.

Provided Both energies will be applied to fusible substrates advantageous an increased Movement speed of the ultrasonic sonotrode for routing reaches the antenna wire, which leads to a faster production of transponders leads.

The Use of glue wire allows the laying of a wire on metallic, non-metallic and non-melting substances.

Advantageous the ultrasound sonotrode not only the laying process, but also the attachment process.

The inclined Sonotrode can be heated thermally be to reduce the substrate load and increase the To achieve installation speed of fusible substrate materials. Likewise, a control of an indentation depth of the antenna wire in the substrate by means of the ultrasonic sonotrode conceivable by that of the ultrasonic sonotrode by means of the impact energy on the surface of the Substrates exercised Power changed becomes. This has a different strength connection of the antenna wire with the substrate and also with the pads of the chip unit result.

All Features disclosed in the application documents are considered to be essential to the invention as long as they are individually or in combination with respect to State of the art are new.

1

substratum

2

antenna

3

chip

4a, 4b

Connection surfaces of chip unit

5

recess

6

antenna wire

6a

Tails of the antenna wire

7

ultrasonic sonotrode

8th

angle

9 10, 11

energy vectors

Claims (12)

Method of making one from at least one antenna ( 2 ) and at least one chip unit ( 3 . 4a . 4b ) constructed transponder on an upper surface of a flat substrate ( 1 ), characterized by the following steps: - attaching a first end piece ( 6a ) of an antenna wire ( 6 ) on a first connection surface ( 4a ) of the chip unit ( 3 . 4a . 4b ) by means of an ultrasonic sonotrode ( 7 ) to form a stapling point; - laying and fixing ( 6 ) of the antenna wire ( 6 ) starting from the tail ( 6a ) on the surface of the substrate ( 1 ) through a plane parallel to the substrate plane of the substrate ( 1 ) carried out moving the ultrasound sonotrode ( 7 ) for forming the antenna ( 2 ), and then - connecting the first end piece ( 6a ) of the antenna wire ( 6 ) with the first connection surface ( 4a ) of the chip unit ( 3 . 4a . 4b ) in the region of the stapling point by means of thermocompression, soldering or gluing to form a permanent, electrical contact connection between the first end piece ( 6a ) and the first pad ( 4a ). A method according to claim 1, characterized in that the rod-shaped ultrasound sonotrode ( 7 ) for generating shock and friction energy ( 10 . 11 ) while laying and fixing the aerial wire ( 6 ) with an angle ( 8th ) to the laying direction parallel to the substrate plane at the surface of the substrate ( 1 ) is moved. Method according to claim 1 or 2, characterized in that the angle ( 8th ) is selected from a range of 70 ° -90 °, preferably 85 ° -89 °. Method according to claim 2 or 3, characterized in that the material of the substrate ( 1 ) under the influence of friction energy ( 11 ) melting material is selected. Method according to one of the preceding claims, characterized in that as an antenna wire ( 6 ) a glue wire is selected. Method according to one of the preceding claims, characterized by the step of connecting and optionally adhering a second end piece of the antenna wire to and with a second connection surface ( 4b ) of the chip unit ( 3 . 4a . 4b ). Method according to one of the preceding claims, characterized by the initial step of inserting the chip unit ( 3 . 4a . 4b ) in a substrate ( 1 ) formed recess ( 5 ) such that the first and second pads ( 4a . 4b ) of the chip unit ( 3 . 4a . 4b ) at least partially on the surface of the substrate ( 1 ) and a chip ( 4c ) within the recess ( 5 ) is arranged. Method according to one of the preceding claims, characterized in that during the laying of the antenna wire ( 6 ) at the transition from the first pad ( 4a ) to the surface of the substrate ( 1 ) the displacement movement of the ultrasonic sonotrode ( 7 ) is slowed down for a short time or a supply of the antenna wire ( 6 ) is accelerated for a short time. Method according to one of the preceding claims, characterized in that during the laying of the antenna wire ( 6 ) at the transition from the surface of the substrate ( 1 ) to the second pad ( 4b ) a feed of the antenna wire ( 6 ) within or at the ultrasonic sonotrode ( 7 ) is accelerated or the displacement movement of the ultrasonic sonotrode is slowed down. Method according to one of claims 1-6, characterized by the step of inserting the chip unit ( 3 . 4a . 4b ) in a substrate ( 1 ) formed recess such that the first and the second pad ( 4a . 4b ) of the chip unit ( 3 . 4a . 4b ) with their top surfaces in a common plane with the surface of the substrate ( 1 ) and the chip unit ( 3 . 4a . 4b ) is arranged as a chip module within the recess. Method according to one of claims 1-6, characterized by the step of arranging the chip unit ( 3 . 4a . 4b ) on the surface of the substrate ( 1 ) such that the first and second pads ( 4a . 4b ) of the chip unit ( 3 . 4a . 4b ) with their upper-side surfaces above the surface of the substrate ( 1 ) lie. Transponder on a substrate ( 1 ), characterized in that the transponder has been produced by means of a method according to one of the preceding claims.