GB9722305D0 - Method and apparatus - Google Patents
Method and apparatusInfo
- Publication number
- GB9722305D0 GB9722305D0 GBGB9722305.1A GB9722305A GB9722305D0 GB 9722305 D0 GB9722305 D0 GB 9722305D0 GB 9722305 A GB9722305 A GB 9722305A GB 9722305 D0 GB9722305 D0 GB 9722305D0
- Authority
- GB
- United Kingdom
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9722305.1A GB9722305D0 (en) | 1997-10-23 | 1997-10-23 | Method and apparatus |
AU95479/98A AU9547998A (en) | 1997-10-23 | 1998-10-16 | Soldering method and apparatus |
PCT/GB1998/003095 WO1999021676A1 (en) | 1997-10-23 | 1998-10-16 | Soldering method and apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9722305.1A GB9722305D0 (en) | 1997-10-23 | 1997-10-23 | Method and apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
GB9722305D0 true GB9722305D0 (en) | 1997-12-17 |
Family
ID=10820916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB9722305.1A Ceased GB9722305D0 (en) | 1997-10-23 | 1997-10-23 | Method and apparatus |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU9547998A (en) |
GB (1) | GB9722305D0 (en) |
WO (1) | WO1999021676A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10308817A1 (en) * | 2003-02-27 | 2004-09-09 | Endress + Hauser Gmbh + Co. Kg | Printed circuit board and method for fixing wired components on the printed circuit board |
EP1878527A1 (en) * | 2006-07-10 | 2008-01-16 | Linde Aktiengesellschaft | Process and apparatus for reflow soldering with two different gases |
DE102013217952B3 (en) | 2013-09-09 | 2014-11-06 | Ersa Gmbh | Device for supplying a hot gas stream |
JP7426771B2 (en) * | 2018-04-11 | 2024-02-02 | 太陽誘電株式会社 | Manufacturing method of multilayer ceramic capacitor |
US10868401B1 (en) * | 2020-03-04 | 2020-12-15 | Onanon, Inc. | Robotic wire termination system |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1008311A (en) * | 1973-08-22 | 1977-04-12 | William S. Fortune | Directed heated air flow apparatus |
ATE90247T1 (en) * | 1987-08-31 | 1993-06-15 | Siemens Ag | SOLDERING HEAD FOR SOLDERING OR SOLDERING COMPONENTS BY HEATING BY HOT GAS, ESPECIALLY FOR SURFACE MOUNT COMPONENTS (SMD). |
KR910005959B1 (en) * | 1988-01-19 | 1991-08-09 | 니혼 덴네쯔 게이기 가부시끼가이샤 | Reflow soldering device |
US4971554A (en) * | 1988-08-30 | 1990-11-20 | Semiconductor Equipment Corporation | Multi-nozzle surface mount rework system |
US5560531A (en) * | 1994-12-14 | 1996-10-01 | O.K. Industries, Inc. | Reflow minioven for electrical component |
DE19527398A1 (en) * | 1995-07-27 | 1997-01-30 | Philips Patentverwaltung | Process for soldering components on a carrier film |
-
1997
- 1997-10-23 GB GBGB9722305.1A patent/GB9722305D0/en not_active Ceased
-
1998
- 1998-10-16 WO PCT/GB1998/003095 patent/WO1999021676A1/en active Application Filing
- 1998-10-16 AU AU95479/98A patent/AU9547998A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1999021676A1 (en) | 1999-05-06 |
AU9547998A (en) | 1999-05-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |