JP2007014441A - Imaging element package for electronic endoscope - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging element package for an electronic endoscope, permitting assembly of projection image quality securing members such as an optical filter and a shading mask in an electronic endoscope in such a way as not to be deteriorated with the steam of high-pressure steam sterilization by an easy process. <P>SOLUTION: The projection image quality securing members such as the optical filter 21 and the shading mask 33 for giving prescribed quality to the image of a subject projected by an objective optical system 3 on the imaging surface of the solid imaging element 11 are disposed inside a portion air-tightly enclosed by a package housing 13 and cover glass 14. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an image pickup device package for an electronic endoscope that is built in the distal end of an insertion portion of the electronic endoscope.

An image pickup device package for an electronic endoscope is generally configured as a unit independent of an objective optical system built in the distal end of an endoscope insertion portion, and an image pickup surface is arranged at a projection position of a subject by the objective optical system. The solid-state image pickup device is hermetically surrounded by a metal package housing attached to an insulating base made of an electrical insulating material that holds the solid-state image pickup device, and the window formed on the front surface of the package housing is transparent. A cover glass is attached in an airtight manner so that moisture does not enter the solid-state imaging device (for example, Patent Documents 1 and 2).
JP-A-9-163243 JP 11-47091 A

  If a light ray in the infrared region, a YAG laser beam, or the like is incident on the imaging surface of the solid-state imaging device, a noticeable defect occurs in the captured image. Therefore, the light beam in such a wavelength region is selectively selected on the way so as not to reach the imaging surface. It is necessary to cut. Further, if unnecessary light around the projection optical path with respect to the imaging surface is not blocked, flare and ghost are caused. Therefore, a light shielding mask for blocking such unnecessary light is also required.

  Therefore, in the conventional electronic endoscope, an optical filter for cutting light with an unnecessary wavelength is incorporated at a position between the objective optical system unit and the imaging unit. Specifically, as in the invention described in the cited document 2, the optical filter (22) is attached to the outer surface of the cover glass of the imaging unit, and the light shielding mask (37) is attached to the rear end portion of the objective optical system unit. It was pasted.

  However, when the endoscope is sterilized in the high-pressure steam sterilizer after the end of the endoscopy and high-pressure steam of, for example, about 130 ° C. enters the endoscope, the coating formed on the optical filter surface deteriorates. In some cases, it becomes impossible to cut a light beam having a predetermined wavelength.

  Also, the task of attaching the light-shielding mask to the rear end portion of the objective optical system unit is very complicated if it is performed in the assembly process of the objective optical system unit that uses nerves for centering accuracy of 0.01 mm units and adhesion of dust. Become.

  Accordingly, the present invention provides an imaging device for an electronic endoscope in which a projection image quality securing member such as an optical filter or a light shielding mask can be assembled to an electronic endoscope in an easy process so as not to be deteriorated by high-pressure steam sterilization steam. An object is to provide an element package.

  In order to achieve the above object, the electronic endoscope imaging device package of the present invention is built in the distal end of the insertion portion of the electronic endoscope as a unit independent of the objective optical system, and projects an object by the objective optical system. Formed on the front of the package housing, the periphery of the solid-state image sensor where the imaging surface is located is hermetically surrounded by a metal package housing attached to an insulating base made of an electrical insulating material that holds the solid-state image sensor In the imaging device package for an electronic endoscope in which a transparent cover glass is airtightly attached, the window portion is provided with a predetermined quality for an image of a subject projected on the imaging surface of the solid-state imaging device by the objective optical system. The projection image quality securing member is arranged in a portion hermetically surrounded by the package housing and the cover glass.

  The projection image quality ensuring member may be either one of a light shielding mask for blocking unnecessary light around the projection optical path of the subject image and an optical filter for cutting light with an unnecessary wavelength, The projection image quality securing member may be attached to the back surface of the cover glass in a space surrounded by the package housing.

  In addition, the projection image quality ensuring member may be a light shielding mask for blocking unnecessary light around the projection optical path of the subject image and an optical filter for cutting light with an unnecessary wavelength. The filter may be attached to the back surface of the cover glass in a space surrounded by the package housing, and the light shielding mask may be attached to the back surface of the optical filter.

  Further, the optical filter may have a surface coated with a coating for cutting light in a specific wavelength region.

  According to the present invention, a projection image quality securing member such as an optical filter or a light shielding mask for imparting a predetermined quality to an image of a subject projected on an imaging surface of a solid-state imaging device by an objective optical system is provided in a package housing. And the cover glass can be assembled to the electronic endoscope in an easy process so as not to deteriorate due to the steam of high-pressure steam sterilization.

  The solid-state imaging device is held around the solid-state imaging device that is built into the distal end of the insertion part of the electronic endoscope as a unit independent of the objective optical system, and the imaging surface is arranged at the projection position of the subject by the objective optical system. Imaging for an electronic endoscope, which is hermetically surrounded by a metal package housing attached to an insulating base made of an electrical insulating material, and a transparent cover glass is hermetically attached to the window formed on the front surface of the package housing. In the element package, the projection image quality securing member for giving a predetermined quality to the image of the subject projected on the imaging surface of the solid-state imaging element by the objective optical system is hermetically surrounded by the package housing and the cover glass Place in.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 2 shows the distal end portion of the insertion portion 1 of the electronic endoscope. An observation window 2 is disposed on the distal end surface of the flexible insertion portion 1, and an objective optical system 3 is disposed on the inner side. It is arranged in a state of being housed in the objective optical system unit frame 4.

  An imaging element package 10, which is a unit independent of the objective optical system 3, is disposed behind the objective optical system 3, and the imaging surface 11 a of the solid-state imaging element 11 housed therein is an objective optical system 3. The image sensor package 10 is arranged so as to be positioned on the projection plane of the subject.

  The solid-state imaging device 11 is disposed in a space that is held by the insulating base 12 and is hermetically sealed by the package housing 13 and the cover glass 14, and is connected to a plurality of connection terminals 15 that extend rearward from the insulating base 12. A signal line 5a of a signal cable 5 inserted and disposed in the insertion portion 1 is connected.

  FIG. 1 is an enlarged side sectional view showing an image pickup device package 10. Reference numeral 12 denotes a block-like insulating base made of an electric insulating material such as ceramic, and a solid-state image pickup device 11 is bonded to the front side thereof. It is fixed and held.

  Reference numeral 16 denotes a bonding wire connected to the internal circuit of the solid-state imaging device 11, which is electrically connected to the connection terminal 15 via a conductor (not shown) embedded in the front-rear direction in the insulating base 12. ing.

  The second half of the insulating base 12 is formed with a thin outer periphery compared to the first half, and a metal annular member 17 is perfectly disposed in the part, and the insulating base 12 is hermetically sealed with an inorganic adhesive. It is joined (joining part A).

  Reference numeral 13 denotes a metal package housing provided in a state of airtightly surrounding the solid-state image pickup device 11 so that vapor or the like does not enter the solid-state image pickup device 11 even during high-temperature high-pressure steam sterilization. It arrange | positions in the state surrounding 12 circumference | surroundings, and the rear-end part is welded airtightly to the rear-end outer edge part of the annular member 17 (weld part B).

  The flat cover glass 14 formed in a circular shape with transparent optical glass is airtightly joined to a window portion formed at the center position of the front end of the package housing 13 with an inorganic adhesive. As shown in FIG. 3 which is an exploded perspective view, an optical filter 21 having a coating for cutting a specific wavelength such as a light beam having a wavelength near the infrared region and a YAG laser beam is provided. Attached to the back surface of the cover glass 14. However, the optical filter 21 may have other characteristics. The optical filter 21 is formed in a circular flat plate shape that is slightly smaller than the cover glass 14.

  Further, on the back surface of the optical filter 21, a light shielding mask 22 for blocking unnecessary light around the projection optical path of the subject image projected onto the imaging surface 11 a of the solid-state imaging device 11 by the objective optical system 3 is attached. ing. The light shielding mask 22 of this embodiment is made of a thin metal plate (for example, about 0.05 mm), but may have other configurations.

  Since the optical filter 21 and the light shielding mask 22 are bonded to the cover glass 14 when the cover glass 14 is in a single state before the cover glass 14 is bonded to the package housing 13, an assembling process is very difficult. It will be simple and easy. In addition, the cover glass 14, the optical filter 21, and the light shielding mask 22 may each have an outer edge formed in a rectangular shape as shown in FIG.

  After the image pickup device package 10 is completed, as shown in FIG. 1, an airtight space in which the optical filter 21 and the light shielding mask 22 are surrounded by the solid base image pickup device 11, the insulating base 12, the package housing 13, and the cover glass 14. Therefore, even if high-pressure steam sterilization is performed, the steam does not touch the optical filter 21, so that a functional deterioration due to coating deterioration or the like does not occur.

  In addition, this invention is not limited to the said Example, For example, as shown in FIG. 5, only the optical filter 21 is stuck and arrange | positioned on the back surface of the cover glass 14, or as shown in FIG. Even if only the light-shielding mask 22 is disposed on the back surface of the cover glass 14, individual effects are produced for each.

It is side surface sectional drawing of the image pick-up element package for electronic endoscopes of the 1st Example of this invention. It is side surface schematic sectional drawing of the front-end | tip part of the insertion part of the electronic endoscope of the Example of this invention. 1 is a partially exploded perspective view of an image pickup device package for an electronic endoscope according to a first embodiment of the present invention. It is a partial exploded perspective view of the modification of the image pick-up element package for electronic endoscopes of the 1st Example of this invention. It is side surface sectional drawing of the image pick-up element package for electronic endoscopes of the 2nd Example of this invention. It is side surface sectional drawing of the image pick-up element package for electronic endoscopes of the 3rd Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insertion part 2 Imaging surface 3 Objective optical system 4 Objective optical system unit frame 10 Imaging device package 11 Solid-state imaging device 11a Imaging surface 12 Insulation base | substrate 13 Package housing 14 Cover glass 21 Optical filter (projection image quality ensuring member)
22 Shading mask (projected image quality assurance member)

Claims (6)

The solid-state imaging device is built around the distal end of the insertion portion of the electronic endoscope as a unit independent of the objective optical system, and the periphery of the solid-state imaging device in which the imaging surface is arranged at the projection position of the subject by the objective optical system. An electronic endoscope in which a transparent cover glass is hermetically attached to a window formed on the front surface of the package housing, which is hermetically surrounded by a metal package housing attached to an insulating base made of an electrically insulating material to be held. In the mirror image sensor package,
A projection image quality securing member for giving a predetermined quality to an image of a subject projected on the imaging surface of the solid-state imaging device by the objective optical system is in a portion enclosed in an airtight manner by the package housing and the cover glass. An image pickup device package for an electronic endoscope, characterized by being arranged in the above.   2. The projection image quality ensuring member is either one of a light shielding mask for blocking unnecessary light around a projection optical path of the subject image, and an optical filter for cutting light having an unnecessary wavelength. Imaging device package for electronic endoscope.   The image pickup device package for an electronic endoscope according to claim 2, wherein the projection image quality ensuring member is attached to the back surface of the cover glass in a space surrounded by the package housing.   2. The electronic endoscope according to claim 1, wherein the projection image quality ensuring member is a light shielding mask for blocking unnecessary light around a projection optical path of the subject image, and an optical filter for cutting light having an unnecessary wavelength. Mirror image sensor package.   5. The electronic endoscope according to claim 4, wherein the optical filter is attached to a back surface of the cover glass in a space surrounded by the package housing, and the light shielding mask is attached to the back surface of the optical filter. Image sensor package.   The image pickup device package for an electronic endoscope according to any one of claims 2 to 5, wherein the optical filter has a surface coated with a coating for cutting light in a specific wavelength region.

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