JP2011209405A - Display device and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display panel with slimmer border without limiting a function of a peripheral circuit part for driving pixels of a pixel array part.SOLUTION: As a substrate constituting a display panel 70, a bendable substrate such as a stainless substrate or a plastic substrate is used. The pixel array part 30 is mounted on a substrate body part 70. Peripheral circuit parts 80, 80, 80are disposed at substrate end parts 70, 70, 70bent at least at one side in the circumference of the pixel array part 30 to be located at the display back side. Thus, the display panel 70 with slimmer border can be provided without limiting the function of the peripheral circuit parts 80, 80, 80.

Description

  The present invention relates to a display device and an electronic device, and more particularly to a display device in which pixels including electro-optical elements are two-dimensionally arranged in a matrix (matrix shape) and an electronic device having the display device.

  In recent years, in the field of display devices that perform image display, flat type (flat panel type) display devices in which pixels (pixel circuits) are arranged in a matrix are rapidly spreading. As one of flat-type display devices, there is a display device using a so-called current-driven electro-optical element whose light emission luminance changes according to a current value flowing through the device as a light-emitting element of a pixel. As a current-driven electro-optical element, an organic EL element using a phenomenon that emits light when an electric field is applied to an organic thin film is known using electroluminescence (EL) of an organic material.

  An organic EL display device using an organic EL element as a light emitting element of a pixel has the following features. That is, since the organic EL element can be driven with an applied voltage of 10 V or less, the power consumption is low. Since the organic EL element is a self-luminous element, the image visibility is higher than that of the liquid crystal display device, and it does not require an illumination member such as a backlight. Therefore, the organic EL element can be easily reduced in weight and thickness. Furthermore, since the organic EL element has a very high response speed of about several μsec, an afterimage does not occur when displaying a moving image.

  As in the liquid crystal display device, the organic EL display device can adopt a simple (passive) matrix method and an active matrix method as its driving method. However, although the simple matrix display device has a simple structure, the light-emission period of the electro-optic element decreases with an increase in the number of scanning lines (that is, the number of pixels), thereby realizing a large and high-definition display device. There are problems such as difficult.

  For this reason, in recent years, active matrix display devices in which the current flowing through the electro-optic element is controlled by an active element provided in the same pixel as the electro-optic element, for example, an insulated gate field effect transistor, have been actively developed. ing. As the insulated gate field effect transistor, a TFT (Thin Film Transistor) is generally used. An active matrix display device can easily realize a large-sized and high-definition display device because the electro-optical element continues to emit light over a period of one display frame.

  A pixel circuit including a current-driven electro-optical element that is driven by an active matrix method includes a drive circuit for driving the electro-optical element in addition to the electro-optical element. As this driving circuit, a pixel circuit having a configuration in which an organic EL element 21 which is a current-driven electro-optical element includes a driving transistor 22, a writing transistor 23, and a storage capacitor 24 is known (for example, see Patent Document 1). reference).

Patent Document 1 discloses an organic EL display device 10 _B in which peripheral circuit units (40, 50, 60) are mounted on a display panel 70 on which a pixel array unit 30 including a large number of unit pixels 20 _b is mounted. (See paragraph No. 0027, FIG. 1, FIG. 10, etc. of Patent Document 1).

In Patent Document 1, one power supply line 32 (32) is provided for four subpixels 20 _W , 20 _R , 20 _G , and 20 _B belonging to two upper and lower rows constituting the same unit pixel 20 _{b. -1 to} 32 _-m ). Japanese Patent Application Laid-Open No. H10-260260 further describes that the display panel 70 can be narrowed because the circuit scale of the write scanning circuit 40 can be reduced by sharing one power supply line 32. (See paragraph number 0136 of Patent Document 1). Here, the “frame” refers to a region portion that does not contribute to image display around the pixel array unit 30 on the display panel 70.

JP 2009-103868 A

  As described above, the display panel is narrowed by reducing the number of circuit elements and wires constituting the peripheral circuit unit that drives each pixel of the pixel array unit and reducing the circuit scale of the peripheral circuit unit. be able to. However, since there is a limit to reducing the circuit scale by reducing the number of circuit elements and the number of wirings constituting the peripheral circuit portion, there is a limit to narrowing the display panel. In order to meet the demand for further narrowing the frame of the display panel, it is sometimes necessary to reduce the circuit scale of the peripheral circuit unit by limiting the functions of the peripheral circuit unit.

  Accordingly, the present invention provides a display device capable of further narrowing the frame of a display panel without limiting the function of the peripheral circuit unit that drives each pixel of the pixel array unit, and an electronic apparatus having the display device The purpose is to provide.

In order to achieve the above object, a display device according to the present invention comprises:
A foldable substrate;
A pixel array unit in which pixels including electro-optic elements are disposed on the substrate;
A substrate end bent at at least one side of the periphery of the pixel array portion on the substrate;
And a peripheral circuit unit that is disposed at an end of the substrate and drives each pixel of the pixel array unit.

  In the display device having the above-described configuration, the substrate is bent on at least one side of the periphery of the pixel array unit, so that an area portion that does not contribute to image display around the pixel array unit is equivalent to the bent substrate end, that is, , Can reduce the frame. At this time, the peripheral circuit portion is located on the same substrate as the pixel array portion via the bent portion. Therefore, the peripheral circuit portion and the pixel array portion can be electrically connected without a contact portion such as a terminal interposed between the peripheral circuit portion and the pixel array portion. Further, the size of the substrate end is not limited as long as it is within the range of the size of the substrate body on which the pixel array unit is mounted. Therefore, the scale of the peripheral circuit unit arranged at the end of the substrate and the function of the peripheral circuit unit is not limited.

  According to the present invention, by using a foldable substrate and disposing the peripheral circuit portion at the end of the substrate that is bent on at least one side of the periphery of the pixel array portion, the function of the peripheral circuit portion is not limited. Further, it is possible to further narrow the frame of the display panel.

It is a front view which shows the outline of the structure of the display panel of the display apparatus which concerns on one Embodiment of this invention. It is sectional drawing which shows the display panel of the display apparatus which concerns on embodiment, (A) is sectional drawing before bending of a display panel, (B) has shown sectional drawing after bending of a display panel, respectively. It is a front view which shows the outline of the other structure of the display panel of a display apparatus. It is sectional drawing which shows the layer structure 1 of the wiring part located in the bending part in the display panel which concerns on embodiment. It is sectional drawing which shows the layer structure 2 of the wiring part located in the bending part in the display panel which concerns on embodiment. It is a wiring pattern figure which shows the layout of each wiring of a wiring part. 1 is a system configuration diagram showing an outline of a configuration of an organic EL display device to which the present invention is applied. It is a circuit diagram which shows an example of the circuit structure of the pixel of the organic electroluminescence display to which this invention is applied. It is a timing waveform diagram with which it uses for description of the basic circuit operation | movement of the organic electroluminescence display to which this invention is applied. It is operation | movement explanatory drawing (the 1) of the basic circuit operation | movement of the organic electroluminescence display to which this invention is applied. It is operation | movement explanatory drawing (the 2) of basic circuit operation | movement of the organic electroluminescence display to which this invention is applied. FIG. 10 is a characteristic diagram for explaining a problem caused by variation in threshold voltage V _th of a driving transistor. It is a characteristic view with which it uses for description of the subject resulting from the dispersion | variation in the mobility (mu) of a drive transistor. FIG. 6 is a characteristic diagram for explaining a relationship between a signal voltage V _sig of a video signal and a drain-source current I _ds of a driving transistor _{depending on} whether or not threshold correction and mobility correction are performed. It is a perspective view which shows the external appearance of the television set to which this invention is applied. It is a perspective view which shows the external appearance of the digital camera to which this invention is applied, (A) is the perspective view seen from the front side, (B) is the perspective view seen from the back side. 1 is a perspective view illustrating an appearance of a notebook personal computer to which the present invention is applied. It is a perspective view which shows the external appearance of the video camera to which this invention is applied. BRIEF DESCRIPTION OF THE DRAWINGS It is an external view which shows the mobile telephone to which this invention is applied, (A) is the front view in the open state, (B) is the side view, (C) is the front view in the closed state, (D) Is a left side view, (E) is a right side view, (F) is a top view, and (G) is a bottom view.

Hereinafter, modes for carrying out the invention (hereinafter referred to as “embodiments”) will be described in detail with reference to the drawings. The description will be given in the following order.
1. 1. Explanation about embodiment 2. Organic EL display device to which the present invention is applied 2-1. System configuration 2-2. 2. Basic circuit operation Modified example 4. Electronics

<1. Explanation about embodiment>
[Panel structure]
FIG. 1 is a front view schematically showing the structure of a display panel of a display device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a display panel of a display device according to an embodiment. 2A is a cross-sectional view before the display panel is bent, and FIG. 2B is a cross-sectional view after the display panel is bent.

  The display device 10 according to the present embodiment is characterized in that a foldable substrate is used as the substrate constituting the display panel 70. As the foldable substrate, a known substrate such as a metal substrate (metal thin plate) or a plastic substrate can be used. As the metal substrate, for example, a stainless steel substrate is preferably used from the viewpoint of corrosion resistance. From the viewpoint of insulation, a plastic substrate is preferable to a metal substrate. A thin plate such as a stainless steel substrate or a plastic substrate can be easily bent by using a known bending jig (jig).

Display panel 70 includes a substrate body 70 _A, and a four substrate end portion 70 _B to 70 _E that is bent on the back side, for example, four sides of the peripheral portion of the substrate. In FIG. 1, among the four substrate end portions 70 _B to 70 _E , the substrate end portions 70 _B and 70 _C on both the left and right sides of the substrate main body portion 70 _A and the lower substrate end portion 70 _D are indicated by alternate long and short dash lines. This is schematically shown. Incidentally, it is not shown for the upper substrate edge 70 _E.

Over substantially the entire surface of the substrate main body portion 70 _A of the display panel 70, the electro-optical element, for example, the pixel array unit 30 in which pixels 20 are formed by two-dimensionally disposed in a matrix array comprising a self-emission type electro-optical element is provided It has been. Here, organic EL elements, inorganic EL elements, LED elements, semiconductor laser elements, and the like are widely known as self-luminous electro-optical elements. These self-luminous electro-optical elements are current-driven light-emitting elements in which the light emission luminance changes according to the value of current flowing through the device.

On the other hand, the substrate end portions 70 _B and 70 _C on both the left and right sides of the substrate main body portion 70 _A and the lower substrate end portion 70 _D are peripheral circuit portions 80 _A to 80 _A for driving each pixel 20 of the pixel array portion 30. 80 _C is provided. As shown in FIG. 2, the peripheral circuit units 80 _A to 80 _C are electrically connected to the pixel array unit 30 via the wirings of the wiring unit 81. Specific examples of the peripheral circuit units 80 _A to 80 _C and details of each wiring of the wiring unit 81 will be described later.

It is hitting the manufacture of the display panel 70, as shown in FIG. 2 (A), relative to the flat foldable board (70 _A to 70 _D), each pixel 20 of the pixel array section 30 formed thereby to form a respective circuit elements of the peripheral circuit portion 80 _a to 80 _C. Furthermore, to form the respective wires of the wiring portion 81 for electrically connecting the peripheral circuit section 80 _A to 80 _C pixel array section 30 (wiring).

Thus, the pixel array section 30, the peripheral circuit portion 80 _A to 80 _C, and the wiring portion 81 is formed, the display panel 70 in the flat state, as shown in FIG. 2 (A), A bending operation is performed with a bending jig 82 arranged on the back side of the wiring portion 81 as a starting point. As shown in FIG. 2 (B), the substrate end portions 70 _B and 70 _C (70 _D ) on which the peripheral circuit portions 80 _A and 80 _B (80 _C ) are mounted by the bending work are back parts 70 _a, i.e., will be located on the display surface and the opposite side (the display back side).

  Therefore, in the display panel 70, only a part of the wiring part 81 exists as a frame around the pixel array unit 30, so that the display panel 70 can be narrowed. That is, an extra area around the pixel array unit 30 that does not contribute to image display can be minimized.

Moreover, between the pixel array portion 30 and the peripheral circuit portion 80 _A to 80 _C, while in folded condition, is electrically connected by the wiring of single wiring portion 81 formed on a substrate . Thus, for example, such is not necessary to provide a contact portion such as a pin as in the case of connecting the external substrate by using a flexible cable or the like to the substrate body 70 _A, therefore, the area for providing the contact portion Since it is not necessary to ensure, a narrower frame of the display panel 70 can be achieved.

The substrate end portions 70 _B and 70 _C (70 _D ) are not limited in size as long as they are within the size range of the substrate main body portion 70 _A on which the pixel array unit 30 is mounted. Therefore, the circuit scale of the substrate end portion 70 _B, 70 _C peripheral circuit portion 80 is arranged _{(70 D) A, 80 B} (80 C), hence, the peripheral circuit portion 80 _A, 80 _B of the (80 _C) Functions are not limited.

In the present embodiment, the display panel 70, bent at four sides of the peripheral portion of the pixel array portion 30, three substrate end portion 70 _B of which, 70 _C, 70 peripheral against _D circuit unit 80 _A, 80 _B, Although the case of mounting 80 _C is given as an example, it is not limited to this panel structure. For example, as shown in FIG. 3, only the three sides of the peripheral portion of the pixel array portion 30 on which the peripheral circuit portions 80 _A , 80 _B and 80 _C are mounted may be bent. At this time, the substrate portion 70 _E remaining without being bent becomes a blank portion that occupies most of the frame, and therefore it can be said that it is preferable to bend it at four sides. In addition, the effect of narrowing the frame can be obtained by folding at least one side of the peripheral portion of the pixel array unit 30 as compared with the case of folding at four sides and three sides, as compared with the case where no folding is performed.

As described above, a foldable substrate is used as the substrate constituting the display panel 70. The peripheral circuit portions 80 _A , 80 _B , and 80 _C are arranged on the substrate end portions 70 _B , 70 _C , and 70 _{D that} are bent on at least one side of the periphery of the pixel array unit 30, thereby restricting the frame size. It is possible to mount circuits having various functions as the peripheral circuit portions 80 _A , 80 _B , and 80 _C without being limited to the above. Therefore, it is possible to further narrow the frame of the display panel 70 without limiting the functions of the peripheral circuit portions 80 _A , 80 _B , 80 _C. In particular, by bending the four sides of the peripheral portion of the pixel array section 30, a display device can be realized in which the frame is substantially eliminated and the entire display surface of the display panel 70 is used as a display area.

By the way, in order to bend the substrate at the wiring portion 81 between the pixel array portion 30 and the peripheral circuit portions 80 _A , 80 _B , 80 _C , measures against disconnection and short-circuiting of the wiring at the wiring portion 81 located in the bent portion are provided. It is necessary to take. Hereinafter, specific examples of the layer structure of the bent portion in which measures against disconnection and short circuit are taken will be described.

(Layer structure 1 of wiring part)
FIG. 4 is a cross-sectional view showing the layer structure 1 of the wiring portion located in the bent portion. This layer structure 1 is based on the assumption that an insulating substrate 71 such as a plastic substrate is used as the substrate constituting the display panel 70. When forming the display panel 70 using an insulating substrate 71, the wiring portion 81, it is preferable to so as to form each wiring 81 _A directly on the insulating substrate 71. That is, the wirings of the pixel array unit 30 and the peripheral circuit units 80 _A , 80 _B , and 80 _C are formed on the substrate via the insulating film 72, but the insulating film 72 is formed for the wiring unit 81. Try to leave out.

Thus, by forming each wiring 81 _A of the wiring part 81 directly on the insulating substrate 71, the thickness of the wiring part 81 can be reduced by the amount that the insulating film 72 does not exist. As a result, when the insulating substrate 71 is bent at the wiring portion 81, the insulating substrate 71 can be easily bent by the thin thickness.

(Layer structure of wiring part 2)
FIG. 5 is a cross-sectional view showing the layer structure 2 of the wiring portion located in the bent portion. This layer structure 2 is based on the assumption that a conductive substrate 73 such as a stainless steel substrate is used as the substrate constituting the display panel 70. When the display panel 70 is configured using the conductive substrate 73, the insulating film 74 is formed on the conductive substrate 73, the lower layer wiring 81 _B is formed thereon, and each of the wiring portions 81 is formed thereon. The wiring 81 _A is formed.

When the conductive substrate 73 is used, as a matter of course, it is necessary to interpose the insulating film 74 between the conductive substrate 73 and each wiring 81 _A of the wiring portion 81. At this time, by forming the lower layer wiring 81 _B on the insulating film 74, the wiring unit 81 is removed in the process of removing the insulating film 72 of the pixel array unit 30 and the peripheral circuit units 80 _A , 80 _B , and 80 _C. The lower layer wiring 81 _B can prevent the insulating film 74 from being removed.

That is, the lower layer wiring 81 _B formed on the insulating film 72 is removed together with the insulating film 72 of the pixel array unit 30 and the peripheral circuit units 80 _A , 80 _B , and 80 _C. It works to prevent it. Since the lower layer wiring 81 _B exists, the insulating film 74 can be reliably interposed between the conductive substrate 73 and each wiring 81 _A of the wiring portion 81, so that each wiring 81 _A of the wiring portion 81 can be interposed. Can be prevented from short-circuiting with the conductive substrate 73 in advance.

(Layout of each wiring in the wiring section)
Incidentally, in the display panel 70, the wiring portion 81 located in the bent portion between the pixel array portion 30 and the peripheral circuit portion _{80 A, 80 B, 80 C} , so that the plurality of wires running in parallel. At this time, depending on layout restrictions, it may be necessary to bend the wiring pattern at the bent portion.

In this way, when the parallel wiring patterns are bent at the bent portion, as shown in FIG. 6A, the wiring widths are different (for example, w ₁ / w ₂ ) and the wiring intervals (for example, p ₁ / p _If layout is performed in ₂ ), a force will be applied to the wiring pattern in one place when it is bent. This causes disconnection. Therefore, as shown in FIG. 6B, each wiring of the wiring portion 81 is formed so that the wiring width and the wiring interval are uniform at the bent portion.

In this way, by forming each wiring of the wiring part 81 so as to have the same width (w ₀ ) and the same interval (p ₀ ) in the bent part, a plurality of parallel wiring patterns are bent in the bent part. Even in this case, the force applied to each wiring when the substrate is bent can be dispersed. Thereby, when the substrate is bent, disconnection of each wiring of the wiring portion 81 can be avoided, so that the display panel 70 with high reliability can be formed.

Here, the case where both the conditions of the same width (w ₀ ) and the same interval (p ₀ ) are satisfied in the bent portion is described as an example, but the present invention is not limited to this. That is, even when a configuration satisfying either one of the same width (w ₀ ) and the same interval (p ₀ ) is adopted, a corresponding effect can be obtained.

<2. Organic EL Display Device to which the Present Invention is Applied>
A display device capable of forming a display panel using a bendable substrate is, for example, a flat panel type (planar type) display device using a self-luminous light emitting element as an electro-optical element of the pixel 20. Hereinafter, an organic EL display device using an organic EL element as a self-luminous light emitting element will be described.

[2-1. System configuration]
FIG. 7 is a system configuration diagram showing an outline of the configuration of an active matrix organic EL display device to which the present invention is applied.

As shown in FIG. 7, the organic EL display device 10 _A according to the present application example includes a plurality of pixels 20 including the organic EL element, a pixel array section 30 in which the pixel 20 is formed by two-dimensionally disposed in a matrix array, And a peripheral circuit unit disposed around the pixel array unit 30. The peripheral circuit unit includes a write scanning circuit 40, a power supply scanning circuit 50, a signal output circuit 60, and the like, and drives each pixel 20 of the pixel array unit 30.

Here, when the organic EL display device 10 _A supports color display, one pixel is composed of a plurality of sub-pixels (sub-pixels), and each of the sub-pixels corresponds to the pixel 20. More specifically, in a display device for color display, one pixel includes a sub-pixel that emits red light (R), a sub-pixel that emits green light (G), and a sub-pixel that emits blue light (B). It consists of three sub-pixels of a pixel.

  However, one pixel is not limited to a combination of RGB three primary color subpixels, and one pixel may be configured by adding one or more color subpixels to the three primary color subpixels. Is possible. More specifically, for example, at least one sub-pixel that emits white light (W) is added to improve luminance to form one pixel, or at least one that emits complementary color light to expand the color reproduction range. It is also possible to configure one pixel by adding subpixels.

The pixel array section 30 corresponds to the pixel array section 30 in the embodiments described above, the substrate can be bent, i.e., formed on the substrate main body portion 70 _A of the foregoing embodiments. The pixel array unit 30 includes scanning lines 31 _{-1 to} 31 _-m and a power supply line 32 _-1 along the row direction (the arrangement direction of the pixels in the pixel row) with respect to the arrangement of the pixels 20 in m rows and n columns. ˜32 _−m are wired for each pixel row. Further, signal lines 33 _{-1 to} 33 _-n are wired for each pixel column along the column direction (pixel arrangement direction of the pixel column).

Here, the scanning lines 31 _{-1 to} 31 _-m , the power supply lines 32 _{-1 to} 32 _-m , and the signal lines 33 _{-1 to} 33 _-n correspond to the respective wirings of the wiring unit 81 in the above-described embodiment. To do. The write scanning circuit 40, the power supply scanning circuit 50, and the signal output circuit 60 corresponds to the peripheral circuit portion 80 _A, 80 _B, 80 _C in the foregoing embodiments.

The scanning lines 31 _{-1 to} 31 _-m are respectively connected to the output ends of the corresponding rows of the writing scanning circuit 40. The power supply lines 32 _{-1 to} 32 _-m are respectively connected to the output ends of the corresponding rows of the power supply scanning circuit 50. The signal lines 33 _{-1 to} 33 _-n are respectively connected to the output ends of the corresponding columns of the signal output circuit 60.

The write scanning circuit 40 is configured by a shift register or the like that sequentially shifts (transfers) the start pulse sp in synchronization with the clock pulse ck. The writing scanning circuit 40 sequentially supplies the writing scanning signals WS (WS _{1 to} WS _m ) to the scanning lines 31 _{-1 to} 31 _-m when writing video signals to the respective pixels 20 of the pixel array unit 30. As a result, the pixels 20 of the pixel array unit 30 are scanned sequentially (line-sequential scanning) in units of rows.

The power supply scanning circuit 50 includes a shift register that sequentially shifts the start pulse sp in synchronization with the clock pulse ck. The power supply scanning circuit 50 can be switched between the first power supply potential V _ccp and the second power supply potential V _ini that is lower than the first power supply potential V _ccp in synchronization with the line sequential scanning by the write scanning circuit 40. Power supply potential DS (DS _{1 to} DS _m ) is supplied to power supply lines 32 _{-1 to} 32 _-m . As will be described later, light emission / non-light emission control of the pixel 20 is performed by switching V _ccp / V _ini of the power supply potential DS.

The signal output circuit 60 includes a signal voltage V _sig and a reference voltage V _{ofs of} a video signal corresponding to luminance information supplied from a signal supply source (not shown) (hereinafter may be simply referred to as “signal voltage”). And are selectively output. Here, the reference voltage V _ofs is a voltage serving as a reference for the signal voltage V _sig of the video signal (for example, a voltage corresponding to the black level of the video signal), and is used in threshold correction processing described later.

The signal voltage V _sig / reference voltage V _ofs output from the signal output circuit 60 is scanned by the write scanning circuit 40 with respect to each pixel 20 of the pixel array unit 30 via the signal lines 33 _{-1 to} 33 _-n . Writing is performed in units of selected pixel rows. In other words, the signal output circuit 60 adopts a line sequential writing driving form in which the signal voltage V _sig is written in units of rows (lines).

  As described above, the display panel 70 on which the pixel array unit 30, the write scanning circuit 40, the power supply scanning circuit 50, and the signal output circuit 60 are mounted is formed of a foldable substrate, and one point around the pixel array unit 30. It is bent at the portion indicated by the chain line. Thereby, the display panel 70 can be narrowed without limiting the functions of the write scanning circuit 40, the power supply scanning circuit 50, and the signal output circuit 60. The functions of the write scanning circuit 40, the power supply scanning circuit 50, and the signal output circuit 60 will be described later.

(Pixel circuit)
FIG. 8 is a circuit diagram showing a specific circuit configuration of the pixel (pixel circuit) 20.

  As shown in FIG. 8, the pixel 20 includes an organic EL element 21 that is a current-driven electro-optical element whose emission luminance changes according to a current value flowing through the device, and a current flowing through the organic EL element 21. And a drive circuit for driving the organic EL element 21. The organic EL element 21 has a cathode electrode connected to a common power supply line 34 that is wired in common to all the pixels 20 (so-called solid wiring).

  The drive circuit that drives the organic EL element 21 has a drive transistor 22, a write transistor 23, and a storage capacitor 24. N-channel TFTs can be used as the driving transistor 22 and the writing transistor 23. However, the combination of the conductivity types of the drive transistor 22 and the write transistor 23 shown here is merely an example, and is not limited to these combinations.

The drive transistor 22 has one electrode (source / drain electrode) connected to the anode electrode of the organic EL element 21 and the other electrode (drain / source electrode) connected to the power supply line 32 (32 _{-1 to} 32 _-m ). It is connected.

The write transistor 23 has one electrode (source / drain electrode) connected to the signal line 33 (33 _{-1 to} 33 _-n ) and the other electrode (drain / source electrode) connected to the gate electrode of the drive transistor 22. ing. The gate electrode of the writing transistor 23 is connected to the scanning line 31 (31 _{−1 to} 31 _−m ).

  In the driving transistor 22 and the writing transistor 23, one electrode is a metal wiring electrically connected to the source / drain region, and the other electrode is a metal wiring electrically connected to the drain / source region. Say. Further, depending on the potential relationship between one electrode and the other electrode, if one electrode becomes a source electrode, it becomes a drain electrode, and if the other electrode also becomes a drain electrode, it becomes a source electrode.

  The storage capacitor 24 has one electrode connected to the gate electrode of the drive transistor 22, and the other electrode connected to the other electrode of the drive transistor 22 and the anode electrode of the organic EL element 21.

  The drive circuit of the organic EL element 21 is not limited to a circuit configuration including two transistors, the drive transistor 22 and the write transistor 23, and one capacitive element of the storage capacitor 24. For example, a circuit configuration in which one electrode is connected to the anode electrode of the organic EL element 21 and the other electrode is connected to a fixed potential, so that an auxiliary capacitor that compensates for the insufficient capacity of the organic EL element 21 is provided as necessary. It is also possible to adopt.

In the pixel 20 configured as described above, the writing transistor 23 becomes conductive in response to a high active writing scanning signal WS applied to the gate electrode from the writing scanning circuit 40 through the scanning line 31. Thereby, the write transistor 23 samples the signal voltage V _sig of the video signal or the reference voltage V _ofs supplied from the signal output circuit 60 through the signal line 33 and writes it in the pixel 20. The written signal voltage V _sig or reference voltage V _ofs is applied to the gate electrode of the driving transistor 22 and held in the holding capacitor 24.

When the potential DS of the power supply line 32 (32 _{-1 to} 32 _-m ) is at the first power supply potential V _ccp , the driving transistor 22 has a saturation region in which one electrode is a drain electrode and the other electrode is a source electrode. Works with. As a result, the drive transistor 22 is supplied with current from the power supply line 32 and drives the organic EL element 21 to emit light by current drive. More specifically, the drive transistor 22 operates in the saturation region, thereby supplying the organic EL element 21 with a drive current having a current value corresponding to the voltage value of the signal voltage V _sig held in the storage capacitor 24. The organic EL element 21 is caused to emit light by current driving.

Further, when the power supply potential DS is switched from the first power supply potential V _ccp to the second power supply potential V _ini , the drive transistor 22 operates as a switching transistor with one electrode serving as a source electrode and the other electrode serving as a drain electrode. As a result, the drive transistor 22 stops supplying the drive current to the organic EL element 21 and puts the organic EL element 21 into a non-light emitting state. That is, the drive transistor 22 also has a function as a transistor that controls light emission / non-light emission of the organic EL element 21.

  By the switching operation of the drive transistor 22, a period during which the organic EL element 21 is in a non-light emitting state (non-light emitting period) is provided, and the ratio (duty) of the light emitting period and the non-light emitting period of the organic EL element 21 can be controlled. . By this duty control, afterimage blurring caused by light emission of pixels over one display frame period can be reduced, so that the quality of moving images can be particularly improved.

Of the first and second power supply potentials V _ccp and V _ini selectively supplied from the power supply scanning circuit 50 through the power supply line 32, the first power supply potential V _ccp is a drive current for driving the organic EL element 21 to emit light. The power supply potential is supplied to the driving transistor 22. The second power supply potential V _ini is a power supply potential for applying a reverse bias to the organic EL element 21. The second power supply potential V _ini is a potential lower than the reference voltage V _ofs , for example, a potential lower than V _ofs −V _th when the threshold voltage of the driving transistor 22 is V _th , preferably V _ofs −V _th. Is set to a sufficiently lower potential.

[2-2. Basic circuit operation]
Next, the basic circuit operation of the organic EL display device 10 _{A having} the above configuration will be described with reference to the operation explanatory diagrams of FIGS. 10 and 11 based on the timing waveform diagram of FIG. In the operation explanatory diagrams of FIGS. 10 and 11, the write transistor 23 is illustrated by a switch symbol for simplification of the drawing. Further, the equivalent capacitance 25 of the organic EL element 21 is also illustrated.

In the timing waveform diagram of FIG. 9, the potential of the scanning line 31 (writing scanning signal) WS, the potential of the power supply line 32 (power supply potential) DS, the potential of the signal line 33 (V _sig / V _ofs ), Changes in the gate potential V _g and the source potential V _s are shown.

(Light emission period of the previous display frame)
In the timing waveform diagram of FIG. 9, the light emission period of the organic EL element 21 in the previous display frame is before time t ₁₁ . During the light emission period of the previous display frame, the potential DS of the power supply line 32 is at the first power supply potential (hereinafter referred to as “high potential”) V _ccp , and the writing transistor 23 is in a non-conductive state.

At this time, the drive transistor 22 is designed to operate in a saturation region. As a result, as shown in FIG. 10A, the drive current (drain-source current) I _ds corresponding to the gate-source voltage V _gs of the drive transistor 22 is organic from the power supply line 32 through the drive transistor 22. It is supplied to the EL element 21. Therefore, the organic EL element 21 emits light with a luminance corresponding to the current value of the drive current I _ds .

(Threshold correction preparation period)
At time t _11, it enters a new display frame of line sequential scanning (current display frame). Then, as shown in FIG. 10B, the second power supply in which the potential DS of the power supply line 32 is sufficiently lower than V _ofs −V _{th with} respect to the reference voltage V _ofs of the signal line 33 from the high potential V _ccp. The potential (hereinafter referred to as “low potential”) V _ini is switched.

Here, the threshold voltage of the organic EL element 21 is V _thel , and the potential (cathode potential) of the common power supply line 34 is V _cath . At this time, if the low potential V _ini is V _ini <V _thel + V _cath , the source potential V _s of the drive transistor 22 becomes substantially equal to the low potential V _ini , so that the organic EL element 21 is in a reverse bias state and is quenched. To do.

Next, at time t ₁₂ , the potential WS of the scanning line 31 transitions from the low potential side to the high potential side, so that the writing transistor 23 becomes conductive as illustrated in FIG. At this time, since the reference voltage V _ofs is supplied from the signal output circuit 60 to the signal line 33, the gate potential V _g of the drive transistor 22 becomes the reference voltage V _ofs . Further, the source potential V _s of the drive transistor 22 is at a potential V _ini that is sufficiently lower than the reference voltage V _ofs .

At this time, the gate-source voltage V _gs of the driving transistor 22 becomes V _ofs −V _ini . Here, if V _ofs −V _ini is not larger than the threshold voltage V _th of the drive transistor 22, threshold correction processing described later cannot be performed, so that a potential relationship of V _ofs −V _ini > V _th is set. There is a need.

In this way, the process of fixing the gate potential V _g of the driving transistor 22 to the reference voltage V _ofs and fixing (determining) the source potential V _s to the low potential V _ini is a threshold correction process described later. This is preparation processing (threshold correction preparation) before performing (threshold supplement operation). Therefore, the reference voltage V _ofs and the low potential V _ini become the initialization potentials of the gate potential V _g and the source potential V _s of the driving transistor 22.

(Threshold correction period)
Next, when the potential DS of the power supply line 32 is switched from the low potential V _ini to the high potential V _ccp at time t ₁₃ as shown in FIG. 10D, the gate potential V _g of the driving transistor 22 is maintained. In this state, the threshold correction process is started. That is, the source potential V _s of the drive transistor 22 starts to increase toward the potential obtained by subtracting the threshold voltage V _th of the drive transistor 22 from the gate potential V _g .

Here, for convenience, the initialization potential V _ofs of the gate electrode of the drive transistor 22 is used as a reference, and the source potential V _s is changed toward the potential obtained by subtracting the threshold voltage V _th of the drive transistor 22 from the initialization potential V _ofs . The processing is called threshold correction processing. As the threshold correction process proceeds, the gate-source voltage V _gs of the drive transistor 22 eventually converges to the threshold voltage V _th of the drive transistor 22. A voltage corresponding to the threshold voltage V _th is held in the holding capacitor 24.

In the period for performing the threshold correction process (threshold correction period), the organic EL element 21 is cut off in order to prevent current from flowing exclusively to the storage capacitor 24 side and not to the organic EL element 21 side. As described above, the potential V _cath of the common power supply line 34 is set.

Then, the potential WS of the scanning line 31 at time t ₁₄ is makes a transition to the low potential side, as shown in FIG. 11 (A), the writing transistor 23 is nonconductive. At this time, the gate electrode of the driving transistor 22 is electrically disconnected from the signal line 33 to be in a floating state. However, since the gate-source voltage V _gs is equal to the threshold voltage V _th of the drive transistor 22, the drive transistor 22 is in a cutoff state. Accordingly, the drain-source current I _ds does not flow through the driving transistor 22.

(Signal writing & mobility correction period)
Next, at time t ₁₅ , as shown in FIG. 11B, the potential of the signal line 33 is switched from the reference voltage V _ofs to the signal voltage V _sig of the video signal. Subsequently, at time t ₁₆ , the potential WS of the scanning line 31 transitions to the high potential side, so that the writing transistor 23 becomes conductive as shown in FIG. 11C, and the signal voltage V _{sig of the} video signal. Are sampled and written into the pixel 20.

By writing the signal voltage V _sig by the writing transistor 23, the gate potential V _g of the driving transistor 22 becomes the signal voltage V _sig . When the drive transistor 22 is driven by the signal voltage V _sig of the video signal, the threshold voltage V _th of the drive transistor 22 is canceled with the voltage corresponding to the threshold voltage V _th held in the holding capacitor 24. Details of the principle of threshold cancellation will be described later.

At this time, the organic EL element 21 is in a cutoff state (high impedance state). Therefore, the current (drain-source current I _ds ) flowing from the power supply line 32 to the drive transistor 22 in accordance with the signal voltage V _sig of the video signal flows into the equivalent capacitor 25 of the organic EL element 21, and the equivalent capacitor 25 is charged. Is started.

As the equivalent capacitance 25 of the organic EL element 21 is charged, the source potential V _s of the driving transistor 22 rises with time. At this time, the pixel-to-pixel variation in the threshold voltage V _th of the drive transistor 22 has already been canceled, and the drain-source current I _ds of the drive transistor 22 depends on the mobility μ of the drive transistor 22. The mobility μ of the driving transistor 22 is the mobility of the semiconductor thin film constituting the channel of the driving transistor 22.

Here, it is assumed that the ratio of the holding voltage V _gs of the holding capacitor 24 to the signal voltage V _sig of the video signal, that is, the write gain G is 1 (ideal value). Then, the source potential V _s of the drive transistor 22 rises to the potential of V _ofs −V _th + ΔV, so that the gate-source voltage V _gs of the drive transistor 22 becomes V _sig −V _ofs + V _th −ΔV.

That is, the increase ΔV of the source potential Vs of the driving transistor 22 is subtracted from the voltage (V _sig −V _ofs + V _th ) held in the holding capacitor 24, in other words, the charge stored in the holding capacitor 24 is discharged. This means that negative feedback has been applied. Therefore, the increase ΔV of the source potential V _s becomes a feedback amount of negative feedback.

Thus, the drain flowing through the driving transistor 22 - gate with the feedback amount ΔV corresponding to the source current I _ds - by applying the negative feedback to the source voltage V _gs, the drain of the driving transistor 22 - the source current I _ds The dependence on mobility μ can be negated. This canceling process is a mobility correction process for correcting the variation of the mobility μ of the driving transistor 22 for each pixel.

More specifically, since the drain-source current I _ds increases as the signal amplitude V _in (= V _sig −V _ofs ) of the video signal written to the gate electrode of the drive transistor 22 increases, the feedback amount of negative feedback The absolute value of ΔV also increases. Therefore, mobility correction processing according to the light emission luminance level is performed.

Furthermore, when a constant signal amplitude V _in of the video signal, since the greater the absolute value of the feedback amount ΔV of the mobility μ is large enough negative feedback of the drive transistor 22, to remove the variation of the mobility μ for each pixel Can do. Therefore, it can be said that the feedback amount ΔV of the negative feedback is a correction amount for mobility correction. Details of the principle of mobility correction will be described later.

(Light emission period)
Next, when the potential WS of the scanning line 31 shifts to the low potential side at time t ₁₇ , the writing transistor 23 is turned off as illustrated in FIG. As a result, the gate electrode of the driving transistor 22 is electrically disconnected from the signal line 33 and is in a floating state.

Here, when the gate electrode of the drive transistor 22 is in a floating state, the storage capacitor 24 is connected between the gate and the source of the drive transistor 22, thereby interlocking with the fluctuation of the source potential V _s of the drive transistor 22. Thus, the gate potential V _g also varies. Thus, the operation in which the gate potential V _g of the driving transistor 22 varies in conjunction with the variation in the source potential V _s is a bootstrap operation by the storage capacitor 24.

The gate electrode of the drive transistor 22 is in a floating state, and at the same time, the drain-source current I _{ds of the} drive transistor 22 starts to flow through the organic EL element 21, so that the anode of the organic EL element 21 corresponds to the current I _ds. The potential increases.

When the anode potential of the organic EL element 21 exceeds V _thel + V _cath , the drive current starts to flow through the organic EL element 21, so that the organic EL element 21 starts to emit light. The increase in the anode potential of the organic EL element 21 is none other than the increase in the source potential V _s of the drive transistor 22. When the source potential V _s of the driving transistor 22 rises, the gate potential V _g of the driving transistor 22 also rises in conjunction with the bootstrap operation of the storage capacitor 24.

At this time, when it is assumed that the bootstrap gain is 1 (ideal value), the increase amount of the gate potential V _g becomes equal to the increase amount of the source potential V _s . Therefore, during the light emission period, the gate-source voltage V _gs of the drive transistor 22 is kept constant at V _sig −V _ofs + V _th −ΔV. At time t18, the potential of the signal line 33 is switched from the signal voltage V _{sig of the} video signal to the reference voltage V _ofs .

In the series of circuit operations described above, processing operations for threshold correction preparation, threshold correction, signal voltage V _sig writing (signal writing), and mobility correction are executed in one horizontal scanning period (1H). Further, the signal writing and mobility correction processing operations are executed in parallel during the period of time t ₆ -t ₇ .

[Division threshold correction]
Here, the case where the driving method in which the threshold value correction process is executed only once is described as an example, but this driving method is only an example and is not limited to this driving method. For example, in addition to the 1H period in which the threshold correction process is performed together with the mobility correction and the signal writing process, the so-called divided threshold is executed by dividing the threshold correction process over a plurality of horizontal scanning periods preceding the 1H period and performing the threshold correction process a plurality of times. It is also possible to adopt a driving method for performing correction.

  According to this division threshold correction driving method, even if the time allotted to one horizontal scanning period is shortened due to the increase in the number of pixels accompanying high definition, sufficient time is provided for a plurality of horizontal scanning periods as the threshold correction period. Therefore, the threshold value correction process can be performed reliably.

[Principle of threshold cancellation]
Here, the principle of threshold cancellation (that is, threshold correction) of the drive transistor 22 will be described. The drive transistor 22 operates as a constant current source because it is designed to operate in the saturation region. As a result, the organic EL element 21 is supplied with a constant drain-source current (drive current) I _ds given by the following equation (1) from the drive transistor 22.
I _ds = (1/2) · μ (W / L) C _ox (V _gs −V _th ) ² (1)
Here, W is the channel width of the driving transistor 22, L is the channel length, and C _ox is the gate capacitance per unit area.

FIG. 12 shows the characteristics of the drain-source current I _ds versus the gate-source voltage V _gs of the driving transistor 22.

As shown in this characteristic diagram, when the cancellation process for the variation of the threshold voltage V _th of the driving transistor 22 for each pixel is not performed, the drain corresponding to the gate-source voltage V _gs when the threshold voltage V _th is V _th1. - source current I _ds becomes I _ds1.

On the other hand, when the threshold voltage V _th is _{V th2 (V th2> V th1} ), the same gate - drain corresponding to the source voltage V _gs - source current I _{ds I ds2 (I ds2 <I ds1} ) become. That is, when the threshold voltage V _th of the drive transistor 22 varies, the drain-source current I _ds varies even if the gate-source voltage V _gs is constant.

On the other hand, in the pixel (pixel circuit) 20 having the above configuration, as described above, the gate-source voltage V _gs of the driving transistor 22 at the time of light emission is V _sig −V _ofs + V _th −ΔV. Therefore, when this is substituted into the equation (1), the drain-source current I _ds is expressed by the following equation (2).
I _ds = (1/2) · μ (W / L) C _ox (V _sig −V _ofs −ΔV) ² (2)

That is, the term of the threshold voltage V _th of the drive transistor 22 is canceled, and the drain-source current I _ds supplied from the drive transistor 22 to the organic EL element 21 does not depend on the threshold voltage V _th of the drive transistor 22. . As a result, even if the threshold voltage V _th of the drive transistor 22 varies from pixel to pixel due to variations in the manufacturing process of the drive transistor 22 and changes over time, the drain-source current I _ds does not vary. 21 emission luminance can be kept constant.

[Principle of mobility correction]
Next, the principle of mobility correction of the drive transistor 22 will be described. FIG. 13 shows a characteristic curve in a state where a pixel A having a relatively high mobility μ of the drive transistor 22 and a pixel B having a relatively low mobility μ of the drive transistor 22 are compared. When the driving transistor 22 is composed of a polysilicon thin film transistor or the like, it is inevitable that the mobility μ varies between pixels like the pixel A and the pixel B.

A case where the signal amplitude V _in (= V _sig −V _ofs ) of the same level is written to both the pixels A and B, for example, in the gate electrode of the driving transistor 22 in a state where the mobility μ varies between the pixels A and B. Think. In this case, if no not corrected mobility mu, drain flows to the pixel A having the high mobility mu - source current I _ds1 'and the drain flowing through the pixel B having the low mobility mu - source current I _ds2' and There will be a big difference between the two. As described above, when a large difference occurs between the pixels in the drain-source current I _ds due to the variation of the mobility μ from pixel to pixel, the uniformity of the screen is impaired.

Here, as is clear from the transistor characteristic equation of the equation (1) described above, the drain-source current I _ds increases when the mobility μ is large. Therefore, the feedback amount ΔV in the negative feedback increases as the mobility μ increases. As shown in FIG. 13, the feedback amount ΔV ₁ of the pixel A having a high mobility μ is larger than the feedback amount ΔV ₂ of the pixel B having a low mobility.

Therefore, by applying negative feedback to the gate-source voltage Vgs with a feedback amount ΔV corresponding to the drain-source current I _ds of the driving transistor 22 by mobility correction processing, negative feedback is increased as the mobility μ increases. It will be. As a result, variation in mobility μ for each pixel can be suppressed.

Specifically, when applying a correction of the feedback amount [Delta] V ₁ at the pixel A having the high mobility mu, drain - source current I _ds larger drops from I _ds1 'to I _ds1. On the other hand, since the feedback amount [Delta] V ₂ small pixels B mobility μ is small, the drain - source current I _ds becomes lowered from I _ds2 'to I _ds2, not lowered so much. Consequently, the drain of the pixel A - drain-source current I _ds1 and the pixel B - to become nearly equal to the source current I _ds2, variations among the pixels of the mobility μ is corrected.

In summary, when there are a pixel A and a pixel B having different mobility μ, the feedback amount ΔV1 of the pixel A having a high mobility μ is larger than the feedback amount ΔV2 of the pixel B having a low mobility μ. That is, the larger the mobility μ, the larger the feedback amount ΔV, and the larger the amount of decrease in the drain-source current I _ds .

Therefore, the drain of the driving transistor 22 - with the feedback amount ΔV corresponding to the source current I _ds, the gate - by applying the negative feedback to the source voltage V _gs, the drain of pixels having different mobilities mu - source current I _ds The current value is made uniform. As a result, variation in mobility μ for each pixel can be corrected. That is, the process of applying negative feedback to the gate-source voltage V _gs of the drive transistor 22 with the feedback amount ΔV corresponding to the current (drain-source current I _ds ) flowing through the drive transistor 22 is the mobility correction process.

Here, in the pixel (pixel circuit) 20 shown in FIG. 8, the relationship between the signal voltage V _sig of the video signal and the drain-source current I _ds of the driving transistor 22 _{depending on} the presence or absence of threshold correction and mobility correction is shown in FIG. Will be described.

In FIG. 14, (A) does not perform both threshold correction and mobility correction, (B) does not perform mobility correction, and performs only threshold correction, (C) performs threshold correction and mobility correction. Each case is shown. As shown in FIG. 14A, when neither threshold correction nor mobility correction is performed, the drain-source current I is attributed to variations in threshold voltage V _th and mobility μ between the pixels A and B. A large difference is generated between the pixels A and B in _ds .

On the other hand, when only threshold correction is performed, as shown in FIG. 14B, although the variation in the drain-source current I _ds can be reduced to some extent, the variation in mobility μ for each of the pixels A and B is reduced. The difference in the drain-source current I _ds between the pixels A and B due to this remains. Then, by performing both the threshold correction and the mobility correction, as shown in FIG. 14C, the threshold voltage V _th and the mobility μ between the pixels A and B caused by the variations of the pixels A and B are obtained. The difference between the drain-source currents I _ds can be almost eliminated. Therefore, the luminance variation of the organic EL element 21 does not occur at any gradation, and a display image with good image quality can be obtained.

  Further, the pixel 20 shown in FIG. 8 has the function of bootstrap operation by the storage capacitor 24 described above in addition to the correction functions of threshold correction and mobility correction. Obtainable.

That is, even if the source potential V _s of the drive transistor 22 changes with the change in IV characteristics of the organic EL element 21 with time, the gate-source potential V of the drive transistor 22 is caused by the bootstrap operation by the storage capacitor 24. _gs can be kept constant. Therefore, the current flowing through the organic EL element 21 does not change and is constant. As a result, since the light emission luminance of the organic EL element 21 is kept constant, even if the IV characteristic of the organic EL element 21 changes with time, it is possible to realize image display without luminance deterioration associated therewith.

<3. Modification>
In the above application example, the case where the present invention is applied to an organic EL display device using an organic EL element as the electro-optical element of the pixel 20 has been described as an example. However, the present invention is not limited to this application example. Specifically, the present invention relates to a display device using a current-driven electro-optical element (light-emitting element) such as an inorganic EL element, an LED element, or a semiconductor laser element whose emission luminance changes according to the current value flowing through the device. Applicable to all.

<4. Electronic equipment>
The display device according to the present invention described above can be applied to display devices of electronic devices in various fields that display video signals input to electronic devices or video signals generated in electronic devices as images or videos. Is possible. As an example, the present invention can be applied to various electronic devices shown in FIGS. 15 to 19 such as a digital camera, a notebook personal computer, a mobile terminal device such as a mobile phone, and a display device such as a video camera.

  As described above, the display device according to the present invention can be used as a display device in electronic devices of various fields. As is clear from the description of the above-described embodiment, the display device according to the present invention can further reduce the frame of the display panel without limiting the function of the peripheral circuit unit that drives each pixel of the pixel array unit. Can do. Therefore, by using the display device according to the present invention as the display device in various electronic devices, the display device can be made compact while maintaining the image quality.

  The display device according to the present invention includes a module-shaped one having a sealed configuration. For example, a display module formed by attaching a facing portion such as transparent glass to the pixel array portion 30 is applicable. The transparent facing portion may be provided with a color filter, a protective film, and the like, and further the above-described light shielding film. Note that the display module may be provided with a circuit unit for inputting / outputting a signal and the like from the outside to the pixel array unit, an FPC (flexible printed circuit), and the like.

  Specific examples of electronic devices to which the present invention is applied will be described below.

  FIG. 15 is a perspective view showing an appearance of a television set to which the present invention is applied. The television set according to this application example includes a video display screen unit 101 including a front panel 102, a filter glass 103, and the like, and is manufactured by using the display device according to the present invention as the video display screen unit 101.

  16A and 16B are perspective views showing the external appearance of a digital camera to which the present invention is applied. FIG. 16A is a perspective view seen from the front side, and FIG. 16B is a perspective view seen from the back side. The digital camera according to this application example includes a light emitting unit 111 for flash, a display unit 112, a menu switch 113, a shutter button 114, and the like, and is manufactured by using the display device according to the present invention as the display unit 112.

  FIG. 17 is a perspective view showing the appearance of a notebook personal computer to which the present invention is applied. A notebook personal computer according to this application example includes a main body 121 including a keyboard 122 that is operated when characters and the like are input, a display unit 123 that displays an image, and the like, and the display device according to the present invention is used as the display unit 123. It is produced by this.

  FIG. 18 is a perspective view showing the appearance of a video camera to which the present invention is applied. The video camera according to this application example includes a main body part 131, a lens 132 for photographing an object on the side facing forward, a start / stop switch 133 at the time of photographing, a display part 134, etc., and the display part 134 according to the present invention. It is manufactured by using a display device.

  FIG. 19 is an external view showing a mobile terminal device to which the present invention is applied, for example, a mobile phone, (A) is a front view in an open state, (B) is a side view thereof, and (C) is closed. (D) is a left side view, (E) is a right side view, (F) is a top view, and (G) is a bottom view. A cellular phone according to this application example includes an upper casing 141, a lower casing 142, a connecting portion (here, a hinge portion) 143, a display 144, a sub-display 145, a picture light 146, a camera 147, and the like. Then, by using the display device according to the present invention as the display 144 or the sub display 145, the mobile phone according to this application example is manufactured.

DESCRIPTION OF SYMBOLS 10 ... Display apparatus, _10A ... Organic EL display apparatus, 20 ... Pixel, 21 ... Organic EL element, 22 ... Drive transistor, 23 ... Write transistor, 24 ... Retention capacity, 30 ... Pixel array part, 40 ... Write scanning circuit, 50 ... power supply scanning circuit, 60 ... signal output circuit, 70 ... display panel, 70 _A ... substrate body, 70 _B, 70 _C, 70 _D ... substrate end portion, 71 ... insulating substrate, 72, 74 ... insulating film 73 ... conductive substrate, 81 ... wiring part, 80 (80 _A , 80 _B , 80 _C ) ... peripheral circuit part,

Claims (6)

A foldable substrate;
A pixel array unit in which pixels including electro-optic elements are disposed on the substrate;
A substrate end bent at at least one side of the periphery of the pixel array portion on the substrate;
A display device comprising: a peripheral circuit unit disposed at an end of the substrate and driving each pixel of the pixel array unit. The wiring of the wiring part that electrically connects the pixel array part and the peripheral circuit part is formed with the same width in a bent part between the pixel array part and the peripheral circuit part. The display device described. The wiring of the wiring part that electrically connects the pixel array part and the peripheral circuit part is formed at the same interval in a bent part between the pixel array part and the peripheral circuit part. The display device according to claim 2. The substrate is an insulating substrate;
4. The wiring according to claim 1, wherein each wiring of a wiring part that electrically connects the pixel array part and the peripheral circuit part is directly formed on the insulating substrate. 5. Display device. The substrate is a conductive substrate;
2. Each wiring of a wiring part that electrically connects the pixel array part and the peripheral circuit part is formed on a lower layer wiring formed on the conductive substrate via an insulating film. The display device according to claim 3. A foldable substrate;
A pixel array unit in which pixels including electro-optic elements are disposed on the substrate;
A substrate end bent at at least one side of the periphery of the pixel array portion on the substrate;
An electronic apparatus having a display device that includes a peripheral circuit unit that is disposed at an end portion of the substrate and drives each pixel of the pixel array unit.

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