JP2557356Y2 - IC card - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card in which an IC module is bonded and embedded in a concave portion of a card base.

[0002]

2. Description of the Related Art Since the above-mentioned IC card has a larger storage capacity than a conventional magnetic card, it stores a history of deposits and savings instead of a bankbook in a banking relationship, and stores a transaction history of shopping and the like in a credit relationship. Used in

Heretofore, as the above-mentioned IC card, for example, as shown in FIGS. 6 and 7, a card in which an IC module 11 is bonded and embedded in a concave portion 2 formed in a card base material 1 is widely used. In the IC module 11, the external terminals 13 are provided on the front side of the rectangular substrate 12, the circuit patterns 14 and the die bonding pads 15 are provided on the rear side, and the external terminals 13, the substrate 12, and the circuit patterns 14 are provided.
The conductive plating 18 for electrically connecting the external terminals 13 and the circuit pattern 14 is formed on the inner surface of the plurality of through holes 17 formed through the die bonding pad 15.
Then, the IC chip 16 is die-bonded, then the IC chip 16 and the circuit pattern 14 are wire-bonded, and the periphery of the wiring portion including the IC chip 16 and the bonding wires 19 is larger than the size of the substrate 12. In a small area, resin molding is performed with an insulating resin to form a rectangular parallelepiped resin molded portion 20, and an IC having a convex cross section is formed.
This constitutes a module 11. On the other hand, the concave portion 2 of the card base 1 is provided with a substrate concave portion 2a for inserting the substrate 12 of the IC module 11 and a resin molded portion 20 for insertion at the center of the bottom surface of the substrate concave portion 2a. An annular groove 2c for accommodating the adhesive is formed in the bottom surface of the concave portion 2a for the substrate along the inner peripheral surface of the concave portion 2a. Recess 2
a, the resin-molded-portion concave portion 2b and the respective members fitted into the concave portion 2b have the same shape and dimensions (however, 0.03-0.
(There is a gap of about 05 mm).

[0004] In manufacturing an IC card,
For example, a thermosetting adhesive is dropped as an adhesive on the bottom surface of the concave portion 2a for the substrate and the concave portion 2b for the resin mold portion of the card base material 1, and then the IC module 11 is fitted and fixed by heating and pressing with a hot press or the like. . In this case, the adhesive layer 21 _1, 21 ₂ is formed as shown in FIG. 6, when the adhesive on the substrate recess 2a or resin mold portion recess 2b has been excessively dropping, the excess Since the excess flows into the annular groove 2c and is stored therein, the excess does not flow out to the external terminal 13 side through the through hole 17 and does not cause problems in appearance and IC function. .

[0005]

[Problems to be Solved by the Invention] By the way, in general, I
C in card use, but will be subjected to bending action, the bending effect is transmitted to the IC module 20 via the adhesive layer 21 _a region of the substrate recess 2a from the card substrate 1, the further bending action IC It is transmitted to the chip 16. In this case, the card base material 1 is generally set to an extremely thin thickness of 0.76 mm according to the ISO standard. Therefore, if the bending action applied to the IC card is increased, the IC chip 16 is damaged and the IC chip 16 is damaged.
The function of the C card was sometimes destroyed. Further, such a problem may be caused by an impact caused by dropping the IC card or the like.

In the present invention, the concave portion for the resin mold portion or the concave portion for the substrate of the card base material is filled with an elastic adhesive, and the bending action is dispersed and absorbed by the elastic adhesive layer. It solves the problem.

[0007]

According to the present invention, a concave portion for an IC module substrate is formed in a card base, and a concave portion for a resin mold portion of the IC module is formed on a bottom surface of the concave portion for the substrate; In an IC card in which an annular groove is formed around the recess and along the inner peripheral surface of the substrate recess, and an IC module is bonded and embedded in the substrate recess and the resin mold recess, An IC card according to claim 1, wherein an annular recess is formed on the inner peripheral surface of the recess through a step, and the annular recess is filled with an elastic adhesive. In addition, the present invention provides a concave portion for a substrate of an IC module in a card base material, and a concave portion for a resin mold portion of the IC module perforated on a bottom surface of the concave portion for the substrate to form the concave portion for the substrate and the resin mold portion. IC in recess
In an IC card in which a module is bonded and embedded, concave grooves communicating with upper rectangular portions of the resin mold concave portion are formed on the bottom surface of the substrate concave portion so as to be orthogonal to each other, and an elastic adhesive is formed on the concave groove. An IC card (Claim 2) characterized by being filled.

[0008]

According to the first aspect of the present invention, an elastic adhesive layer is formed in the annular recess, and the elastic adhesive layer abuts and surrounds the outer peripheral surface of the upper part of the resin mold portion of the IC module.
Regardless of the direction of impact due to bending or dropping applied to the IC card, it can be properly dispersed and absorbed, so that the IC chip may be damaged and damaged.
Function is not destroyed. Further, since the step portion is formed immediately below the annular concave portion, the elastic adhesive does not flow into the bottom surface side of the resin mold portion concave portion,
The problem of the generation of waviness on the back surface of the card substrate caused by the elastic adhesive is also avoided. According to the invention of claim 2, I
Since the tip portions of the elastic adhesive layers formed orthogonal to each other are in contact with the four corners above the resin mold portion of the C module, the direction of the impact due to bending or dropping applied to the IC card Can be dispersed and absorbed by any of the adhesive layers at the four corners.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. 1 and 2. The structure of an IC module 11 is the same as that of the prior art shown in FIG. External terminals 13 formed by patterning are provided on the front side of a rectangular substrate 12 made of epoxy resin, and a circuit pattern 14 and die bonding pads 15 are provided on the back side of the substrate 12. A conductive plating 18 for conducting the external terminal 13 and the circuit pattern 14 is formed on an inner surface of a plurality of through holes 17 formed through the external terminal 13, the substrate 12, and the circuit pattern 14, and then the die bonding pad 15 is formed. The IC chip 16 is die-bonded, then wire-bonded between the IC chip 16 and the circuit pattern 14, and the periphery of the wiring portion including the IC chip 16 and the bonding wires 19 is smaller than the size of the substrate 12. The resin module is molded with an insulating resin, for example, an epoxy resin in the range, and a rectangular parallelepiped resin molded portion 20 is formed.
1.

On the other hand, an IC module 1
A recess for bonding and embedding 1 is formed in the following order. That is, after forming the substrate concave portion 2a for inserting the substrate 12 on the front surface side of the card base 1, the resin mold portion 20 is inserted into the center of the bottom surface of the substrate concave portion 2a. Along with forming the resin mold portion recess 2b,
An annular groove 2c for accommodating an adhesive is formed in the bottom surface of the substrate recess 2a along the inner peripheral surface of the recess 2a. Further, an annular concave portion 23 having a width of 0.05 to 1.5 mm is formed on the inner peripheral surface of the resin mold portion concave portion 2b via a step portion 22. In this case, the recess and the groove are formed by cutting using an end mill or the like.

In manufacturing an IC card,
For example, an acrylic adhesive is dropped and applied as a cold-setting adhesive on the bottom surface of the resin mold portion concave portion 2b of the card base 1, and the bottom surface of the annular concave portion 23, that is, the step portion 22 and the inside of the annular concave portion 23 are formed. After dropping and applying, for example, a urethane-based adhesive as an elastic adhesive to at least one of the peripheral surfaces, the IC module 11 is inserted and pressed, and the IC module 11 is pressed and bonded at room temperature for several hours. In this case, when the elastic adhesive is excessively applied to the annular concave portion 23, the excessive amount flows into the annular groove portion 2c and is stored.

The sectional structure of the IC card thus manufactured is as shown in FIG.
The outer peripheral surface of the upper part of the elastic adhesive layer 2 has an annular shape.
4 for abutment. And this IC
In the card, even when a large bending force or impact force is applied in various directions, the bending force and the like are dispersed and absorbed by the elastic adhesive layer 24, so that the IC chip 16 is not damaged. In addition, the presence of the step 22 prevents the elastic adhesive from flowing into the bottom surface of the resin mold concave portion 2b, so that no wavy is generated on the back surface of the card substrate 1.

Next, another embodiment will be described with reference to FIGS. 3 to 5. The structure of the IC module 11 is the same as that of the embodiment shown in FIG. Are different. That is, after forming the concave portion 2a for the substrate on the front surface side of the card base material 1, the concave portion 2b for the resin mold portion is formed in the center of the bottom surface of the concave portion 2a for the substrate to leave the concave portion 2a for the substrate in an annular shape. In the annular recess,
A plurality of grooves 25 having a depth of 0.05 to 0.1 mm starting from the inner peripheral wall and reaching the concave portion 2b for the resin mold portion are formed. Four corners A, B, C, D above the recess 2b
And each of these corners has
The concave grooves 25, 25 of the book communicate with each other orthogonally.

When manufacturing an IC card,
An acrylic adhesive, for example, is dropped and applied as a cold-setting adhesive on the bottom surface of the resin mold concave portion 2b of the card base 1, and an urethane adhesive, for example, is dropped as an elastic adhesive in the groove 25. After application, the same operation as in the embodiment of FIG. 1 is performed to manufacture an IC card. In some cases, it is also possible to use only an elastic adhesive without using two types of adhesives.

The cross-sectional structure of the IC card manufactured in this manner is as shown in FIG. 3, and an elastic adhesive in which all four corners of the upper part of the resin mold part 20 are formed orthogonal to each other. It is in contact with the layer 24. In this IC card, even when a large bending force or an impact force is applied in various directions, the bending force or the like is not applied to the elastic resin agent layers 24 orthogonal to each other at any one of the corners of the resin mold 20. , 24, the IC chip 16 is not damaged.

[0016]

According to the present invention (claim 1), in an IC card in which an IC module is bonded and embedded in a concave portion formed in a card base material, a step portion is provided on the inner peripheral surface of the resin module portion concave portion of the card base material. An annular concave portion is formed, and an elastic adhesive layer is formed in the annular concave portion to abut and surround the upper portion of the resin mold portion, so that bending force and impact force applied to the IC card in various directions can be accurately dispersed. Since it can be absorbed, the IC function does not fall into failure due to the damage of the IC chip.
It is also possible to avoid the problem of the occurrence of ripples due to the adhesive on the back surface of the card substrate. The present invention (claim 2)
Then, a concave groove is formed in the concave portion for the substrate formed in the card base material so as to be orthogonal to each other and communicated with each upper corner of the concave portion for the resin mold portion, and the elastic adhesive layer is formed in the concave groove. To make contact with the upper corner of the resin mold part.
Since the bending force and the impact force in various directions applied to the C card can be accurately dispersed and absorbed, the problem that the IC function becomes defective can be surely solved.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of one embodiment of the present invention.

FIG. 2 is a plan view of the card base according to the embodiment in FIG. 1;

FIG. 3 is a longitudinal sectional view of another embodiment.

FIG. 4 is a plan view of a card base according to the embodiment in FIG. 3;

FIG. 5 is a sectional view taken along line 5-5 in FIG. 4;

FIG. 6 is a longitudinal sectional view of a conventional example.

FIG. 7 is a plan view of a card base according to a conventional example.

DESCRIPTION OF SYMBOLS 1 Card base material 2 Depression 2a Substrate depression 2b Resin molded part depression 2c Annular groove 11 IC module 12 Substrate 13 External terminal 14 Circuit pattern 15 Die bonding pad 16 IC chip 17 Through hole 18 Conductive plating 19 Bonding Wire 20 Resin molded part 21 ₁ Adhesive layer 21 ₂ Adhesive layer 22 Step 23 Annular recess 24 Elastic adhesive layer 25 Groove A Corner B Corner C Corner D Corner

Claims (2)

(57) [Scope of request for utility model registration] An IC module substrate concave portion is formed in a card base material, and a resin mold portion concave portion of the IC module is provided on a bottom surface of the substrate concave portion. In an IC card in which an annular groove is formed along the inner peripheral surface of the concave portion, and an IC module is bonded and embedded in the concave portion for the substrate and the concave portion for the resin mold portion, a step portion is formed on the inner peripheral surface of the concave portion for the resin mold portion. An IC card, wherein an annular concave portion is formed through the substrate, and an elastic adhesive is filled in the annular concave portion. 2. A recess for a substrate of an IC module is formed in a card base material, and a recess for a resin mold portion of the IC module is formed on the bottom surface of the recess for the substrate. In an IC card in which an IC module is bonded and embedded, a groove communicating with an upper rectangular portion of the resin mold concave portion is formed on the bottom surface of the substrate concave portion so as to be orthogonal to each other. An IC card filled with an adhesive.