JP3668330B2 - Imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an imaging apparatus that is suitable for downsizing and used in an electronic endoscope or the like.
[0002]
[Prior art]
In recent years, imaging devices (or imaging units) have been widely used for VTRs, endoscopes, and the like.
A conventional imaging unit (or imaging device) 110 is as shown in FIG. Each electric wire 112 of the cable 111 is wired by direct soldering to each land portion provided on the outer surface of the two opposing substrate surfaces on the flexible substrate 113 bent into a U shape or a U shape. . This flexible substrate 113 is mounted with an electronic component 114 and is also connected to a solid-state image sensor 115. An imaging unit having a structure similar to this structure is disclosed in, for example, Japanese Patent Laid-Open No. 4-218136.
[0003]
The key to high image quality On request Along with this, the number of wires has increased (increase in the number of wires), and the wiring space of the image pickup unit has become more necessary than before.
On the other hand, the downsizing of the imaging unit has been promoted with the reduction in the diameter of the distal end portion of the endoscope.
[0004]
Therefore, in order to secure a wiring space and shorten the overall length of the imaging unit 110 as much as possible by using the flexible substrate 113 or the TAB tape, the land portion, that is, the wiring portion 116 of the electric wire is arranged on the outer surface of the imaging unit 110 or the outer peripheral direction. It was provided.
Furthermore, in order to wire each electric wire 112 to the outer surface of the imaging unit 110, a space L2 for extending each electric wire is necessary in the insertion portion (left and right in FIG. 11) direction.
[0005]
[Problems to be solved by the invention]
Each electric wire is directly wired to each land portion on the substrate with solder or the like. However, with the recent improvement in image quality, the number of wires has increased, and the land area of the substrate has become insufficient.
[0006]
Since each electric wire is not a rigid body, when the electric wire is connected to the land portion with solder or the like, it is likely to be displaced from the position of the land portion to be originally connected.
[0007]
For this reason, in general, the area of each land portion is set to be somewhat larger than the connection area with the electric wire. For this reason, even when the electric wire is connected, even if the electric wire moves slightly, the electric wire does not protrude from the land portion.
That is, since the position of each electric wire is not fixed, the area of the land part more than a contact area is needed, and the area of a land part is enlarged with respect to a board | substrate.
[0008]
As a method of avoiding this, a method of shifting the positions of the land portions and effectively arranging the land portions with respect to the substrate can be considered. However, in this method, the lengths of the electric wires connected to the land portion cannot be made uniform. That is, the length of each electric wire bundled in the same cable must be changed. Therefore, in such a method, it is difficult to process and the manufacturing cost is increased.
[0009]
In order to reduce the area of the land part relative to the substrate, even if the area of each land part is minimized, each electric wire must be positioned, which also increases the manufacturing cost. End up.
[0010]
In the case of the wiring structure as shown in FIG. 11, in order to reduce the hard length L2, it is only necessary to remove the insulating covering tubes that cover the outer periphery of each electric wire. Is not an appropriate method.
[0011]
As a method of avoiding this, it is sufficient to incorporate an insulating member that prevents other parts from coming into contact with the part from which each of the coated tubes has been removed. However, since the member is considered to be larger than the coated tube, L2 should be reduced. Will not be able to.
[0012]
The problems of the prior art described so far are summarized as follows.
1. Since each electric wire is not a rigid body, the area of a land part is set large, and the board | substrate will become large correspondingly.
2. When the position of the land portion is shifted in order to reduce the size of the substrate, the length of the electric wire corresponding to each land portion is different, which is disadvantageous in processing and increases the manufacturing cost.
[0013]
3. If the land portion is the minimum necessary size with respect to the wire diameter, the wire is likely to be displaced from the land portion. For this reason, time must be taken for positioning. Therefore, the manufacturing cost is increased.
[0014]
4. Although each covered tube of each electric wire can be removed and the apparatus can be made small, each electric wire will conduct | electrically_connect.
When an insulating member is incorporated in order to avoid 5 and 4, the apparatus becomes large.
[0015]
The present invention has been made in view of the above-described points, and an object of the present invention is to provide an imaging apparatus that can be reduced in diameter and can be easily manufactured at low cost.
[0016]
[Means for Solving the Problems]
A first imaging device of the present invention includes an objective optical system, a solid-state imaging device disposed at an imaging position of the objective optical system, The tip side is Connected to the solid-state image sensor In addition, the rear end side is bent so as to form a space for placing electronic components inside A substrate, One end side is connected to the outer land portion of the flexible substrate, and has a terminal protruding to the rear end side. A connecting member; and a cable connected to the terminal and transmitting a signal from the solid-state imaging device.
A second imaging device of the present invention includes an objective optical system, a solid-state imaging device disposed at an imaging position of the objective optical system, The tip side is Connected to the solid-state image sensor In addition, the rear end side is bent so as to form a space for placing electronic components inside A substrate, One end side is connected to the outer land portion of the flexible substrate, It comprises a connecting member having a terminal on the side face to face, and a cable that is connected to the terminal and transmits a signal from the solid-state imaging device.
[0017]
Thereby, the wiring space of the cable side wiring part of the board can be reduced, and the diameter of the endoscope front end part can be reduced.
[0018]
L1≈L2 for the hard length L1 (FIG. 1) and L2 (FIG. 11) behind the substrate. The reason is that in the case of the conventional example, since each electric wire is wired to the outside of the imaging unit, each electric wire must be spread out and a hard length is required. There is not much difference from the case of the present invention in which wiring is performed through a connector.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be specifically described below with reference to the drawings.
(First embodiment)
1 to 4 relate to a first embodiment of the present invention, FIG. 1 shows an image pickup apparatus of the first embodiment, FIG. 2 shows a video scope incorporating the first embodiment, FIG. 3 shows the electrical connection state of the exterior metal of the video scope, and FIG. 4 shows a part of the imaging apparatus in the modification.
[0020]
As shown in FIG. 2, the video scope 1 includes an elongated (long) insertion portion 2 having flexibility, an operation portion 3 connected to the rear end of the insertion portion 2, and extends from the operation portion 3. The flexible universal cord portion 4 and a scope connector portion 5 provided at the end of the universal cord portion 4 are configured.
[0021]
The insertion portion 2 includes a hard tip constituent portion 6, a bendable bending portion 7 provided at the rear end of the tip constituent portion 6, and a flexible extending from the rear end of the curved portion 7 to the front end of the operation portion 3. And a flexible tube portion 8 having a property.
The operation section 3 is provided with an angle knob 9, and the bending section 7 can be bent by operating the angle knob 9.
[0022]
A light guide that transmits illumination light is inserted into the insertion portion 2, and the rear end side of the light guide is inserted into the universal cord portion 4 from the operation portion 3, and enters the light guide incident end portion 11 of the scope connector portion 5. It is fixed.
[0023]
By connecting the light guide incident end 11 to a light source device (FIG. 3 shows a part of the housing 12 of the light source device), the illumination light supplied from the lamp inside the light source device is transmitted to Transmit to the end face on the tip side. An illumination window to which the illumination lens system 13 is attached is provided in front of the end face, and illumination light is emitted from the illumination window.
[0024]
An object lens system 16 constituting the imaging unit 15 of the first embodiment (of the imaging device of the present invention) is attached to an observation window adjacent to the illumination window, such as an affected part illuminated by the emitted illumination light. Thus, an optical image is formed at the image formation position. A solid-state imaging device 17 (see FIG. 1A) is disposed at this imaging position and performs photoelectric conversion.
[0025]
The solid-state imaging device 17 is connected to the tip of a signal cable 21 via a signal processing circuit unit 18 and a connector 19, and the signal cable 21 passes through the insertion unit 2, the operation unit 3, and the universal cord unit 4 in the same manner as the light guide. It is inserted and connected to the electrical contact part 22 of the scope connector part 5.
[0026]
As shown in FIG. 3, this electrical contact portion 22 is further connected to a video processor (not shown) via an external cable 23, converts a signal photoelectrically converted by the solid-state image sensor 17 into a standard video signal, and a monitor (not shown). Output to.
[0027]
That is, as shown in FIG. 2, the scope connector portion 5 is provided with the light guide incident end portion 11, the electrical contact portion 22, and the like on the connector main body 24.
In addition, a treatment instrument insertion port 200 is provided near the front end of the operation unit 3, and communicates with the channel 25 (see FIG. 3) inside the treatment instrument insertion port 200.
[0028]
An imaging unit 15 shown in FIG. Hereinafter, a specific configuration of the imaging unit 15 will be described with reference to FIG. FIG. 1A shows the imaging unit 15 in a longitudinal section in the longitudinal direction of the tip component portion 6, and FIG. 1B shows a view of the vicinity of the upper surface of the connector from the P direction in FIG. FIG. 1C is a cross-sectional view taken along line QQ in FIG.
The imaging unit 15 includes an objective lens system 16, a solid-state imaging device 17, a signal processing circuit unit 18, a connector 19, and a cable 21.
[0029]
The objective lens system 16 is divided into a front group lens 31 and a rear group lens 32. The front group lens 31 is attached to the front group lens frame 33, and the rear group lens 32 is attached to the rear group lens frame 34. The front group lens frame 33 and the rear group lens frame 34 are formed of a metal body. Both lens frames 33 and 34 are connected via an insulating member 35.
[0030]
The inner surface of the insulating member 35 is formed without any step by processing from one direction over the entire length in order to reduce the deviation of the optical axes of the lens groups 31 and 32.
The objective lens system 16 is fixed to the distal end component 6 through a fixing frame member 36. Like the inner surface of the insulating member 35, the inner surface of the fixing frame member 36 is formed without any step by processing from one direction over the entire length.
[0031]
The front lens group frame 33 and the insulating member 35 are fitted to the fixing frame member 36 and removed. Attached Yes. Further, the front group lens frame 33 and the rear group lens frame 34 are fitted to the insulating member 35.
[0032]
Light-receiving surface of solid-state image sensor 17 150 A cover glass 38 is positioned and affixed thereon. On the light receiving surface side of the cover glass 38, a notch 39 for preventing adhesive oozing is provided all around or partially.
[0033]
The side surface of the cover glass 38 has at least one cover glass side reference surface 40 for positioning the center of the light receiving surface of the optical axis of the objective lens system 16.
At the rear end of the rear lens group frame 34, at least one lens frame side reference surface 41 (see FIG. 1C) that matches the cover glass side reference surface 40 is provided in the same manner.
[0034]
The cover glass side surface (including the reference surface) and the rear lens group frame 34 are, for example, hermetically fixed with an epoxy-based or silicon-based adhesive 42.
One end of a foldable flexible substrate 30 is wired to the electrode portion 43 of the solid-state imaging device 17 by a bump or the like. Electronic components such as an IC chip 44 and a capacitor 45 are mounted on the flexible substrate 30, and a circuit is formed with a pattern made of copper foil or the like.
[0035]
The flexible substrate 30 has a belt shape and is provided with circuit patterns on both sides. Further, in order to reduce the mounting space, the flexible substrate 30 is bent in a U-shape at both ends in the longitudinal direction with the side where the electronic component is disposed inside.
In other words, at a distance of about 1/3 from both ends in the longitudinal direction, the central portion (referred to as the central portion) is bent by 90 °, and the two bent portions are folded in a U shape. Is done. The length of the central portion of the U-shaped flexible substrate 30 substantially matches the size of the solid-state imaging device 17 in the height direction.
[0036]
As shown in FIGS. 1A and 1B, the cable wiring land portions 46 provided on the flexible substrate 30 are respectively provided on the outer side of the U-shape, that is, on the outer surfaces of two opposed bent portions. (In the specific example of FIG. 1A, the land portions 46 are provided on the upper surface of the upper bent portion and the lower surface of the lower bent portion, respectively).
A connector 19 having a board side terminal 48 connected to the land portion 46 of the flexible board 30 at one end and a cable side terminal 49 connected to each electric wire 37 of the cable 21 at the other end is adjacent to the flexible board 30. It is provided behind. That is, each electric wire 37 of the cable 21 is structured to be connected to the flexible substrate 30 via the connector 19 as a connecting member.
[0037]
The connector 19 has a substantially square plate shape with a substantially small thickness. A plurality of board-side terminals 48 are extended in a substantially L-shape on one side at positions closer to the upper part and closer to the lower part. When viewed from above, a U-shape is formed, and a cable-side terminal 49 is extended on the other surface along the line at the left and right positions.
[0038]
In other words, the shape of the board-side terminal 48 of the connector 19 is matched to the U-shape of the flexible board 30, and the connector 19 also serves as a jig when the flexible board 30 is bent into a U-shape. Yes.
[0039]
The board-side terminal 48 of the connector 19 and the land part 46 of the flexible board 30 are connected by, for example, laser soldering. Between the connector 19 and the flexible substrate 30, an epoxy-based or silicon-based adhesive 42 or the like is filled, and the bent flexible substrate 30 is fixed.
[0040]
The connector 19 may have another shape which is not substantially square as shown in FIG. 1, and even if it is not a one-body structure, the connector 19 has a two-body structure of the first connector 51 and the second connector 52 as shown in FIG. The connector 53 may be used. 4A shows the vicinity of the flexible substrate 30 and the connector 53 viewed from the side, and FIG. 4B shows the flexible substrate 30 and the connector 53 viewed from the R direction of FIG. 4A.
[0041]
As can be seen from FIG. 4, the flexible substrate 30 is bent differently from FIG. In FIG. 1, the flexible substrate 30 is bent in a U shape in a longitudinal section, but in FIG. 4, the flexible substrate 30 is bent in a U shape in a section perpendicular to the longitudinal direction.
[0042]
In this modification, a land portion is provided at the rear end of the flexible substrate 30, and the first connector 51 and the second connector 52 are connected by the solder 54 to the first connector 51 and the second connector 52. The engaging part which consists of the recessed part and convex part of the connector 52 of this is engaged, and it is united. Similar to the connector 19, the connector 53 also serves as a bending jig for the flexible substrate 30.
[0043]
As shown in FIG. 1, each electric wire 37 of the cable 21 is connected to a cable side terminal 49 located on the opposite side of the board side terminal 48 by soldering.
The cable 21 may be wired to the connector 19 after the connector 19 is connected to the flexible board 30, or conversely, after the connector 19 and the cable 21 are wired first, the connector 19 may be fixed to the flexible board 30.
[0044]
The electrical component from the solid-state imaging device 17 to the cable wiring portion is covered with a shield frame 55 on the entire circumference. The shield frame 55 is fixed to the rear group lens frame 34 of the metal body. The shield frame 55 and the rear lens group frame 34 are electrically connected. The outer side of the shield frame 55 is covered with a second insulating member 56.
[0045]
Since the cable 21 is wired to the flexible board 30 via the connector 19, the wiring space d1 in the thickness direction of the flexible board wiring portion 57 is slightly larger than the board-side terminal 48, and the wiring space d2 of the conventional example of FIG. It can be made smaller (about the outer skin of the electric wire 112). That is, d1 <d2.
[0046]
Next, the exterior metal of the video scope 1 will be described with reference to FIG.
FIG. 3 shows the electrical connection state of the chassis or exterior metal of the video scope 1 in a state where the high-frequency treatment instrument 61 is used.
[0047]
The high-frequency treatment instrument 61 connected to the high-frequency power supply 59 is inserted into the treatment instrument channel 25 from the treatment instrument insertion port 200, and a loop of the excision wire is hooked on a polyp or the like in the body cavity of the patient 62. The patient plate 63 is in contact with the body of the patient 62 over a wide area.
[0048]
In general, the length of the cable 21 from the imaging device is considerably longer than the entire length of the video scope 1 in consideration of repairability. The margin is wound and stored in the scope connector 5.
[0049]
When a current flows through the cable 21, noise is generated from the cable 21, and a strong magnetic field is generated particularly in the portion where the cable 21 is wound. strong. That is, the scope connector unit 5 is most likely to generate noise.
[0050]
On the other hand, the exterior metal (chassis) of the video scope 1 is roughly divided into four. That is, there are four parts: an insertion portion exterior metal 65, an operation portion exterior metal 66, a universal cord portion exterior metal 67, and a scope connector portion exterior metal 68. The surface of each exterior metal is generally covered with an insulating resin.
However, a part of the exterior metal may be partially exposed on the outer surface of the scope.
[0051]
Fig. 3 shows a picture that is quite extreme. The insertion portion exterior metal 65 is covered with an insulating resin member 69, but each exterior metal in other portions is exposed.
The electrical connection between the exterior metals is as follows.
[0052]
The insertion portion exterior metal 65, the operation portion exterior metal 66, and the universal cord portion exterior metal 67 are electrically connected, and are floating (not connected) from the GND 70 of the electric circuit (not shown) of the imaging device. Is indicated by ×). Further, it is electrically floating from the housing 12 of the light source device and the housing of the video processor (not shown).
[0053]
The scope connector part exterior metal 68 is electrically floating from the exterior part metal of the insertion part exterior metal 65, the operation part exterior metal 66, and the universal cord part exterior metal 67, and the patient circuit such as the electrical circuit of the imaging apparatus. It is electrically connected to the GND 70. Further, it floats electrically from the housing 12 of the light source device and the housing of the video processor.
[0054]
Next, the operation will be described.
The object image is imaged on the solid-state imaging device 17 arranged at the imaging position by the objective lens system 16 forming the imaging unit 15 and converted into an electric signal. Then, the signal is amplified by the signal processing circuit 18 in the imaging unit 15, sent to the video processor via the cable 21, subjected to signal processing, converted into a standard video signal, and displayed on a monitor (not shown).
[0055]
When the imaging unit 15 mounts an electronic component such as an IC chip 44 on the belt-shaped flexible substrate 30 and then bends it in a U shape by the connector 19, each substrate-side terminal 48 is connected to each land portion 46 of the flexible substrate 30. It can be positioned so as to match easily. Therefore, in this state, the board-side terminals 48 can be easily connected to the land portions 46 by fixing with the adhesive 42 and then soldering with laser light.
[0056]
In this case, the connector 19 is formed with board-side terminals 48 at predetermined intervals (vertical direction in FIG. 1B, x direction in FIG. 1C), and the size of the terminals 48 is also reduced. Even if the width of the land portion 46 is reduced, it can be sufficiently soldered. In addition, the thickness of the board-side terminal 48 (y direction in FIG. 1C) can be reduced, and when soldered, the portion protruding from the flexible board 30 can be reduced. That is, the wiring space d1 in FIG.
[0057]
Further, the inner lead at one end of the flexible substrate 30 can be easily connected to the electrode portion 43 of the solid-state imaging device 17 by bump connection. This bump connection may be performed before the connection between the flexible substrate 30 and the connector 19. The vicinity of the bump connection is sealed with an insulating resin.
[0058]
Moreover, since the cable side terminal 49 of the connector 19 protrudes to the cable 21 side, it can be easily connected without requiring wiring for routing the electric wires 37 of the cable 21 so much. That is, the hard length of the imaging unit 15 can be sufficiently connected in a short state.
[0059]
Next, the operation of FIG. 3 will be described. The scope connector section 5 is the place where radiation noise is most likely to occur in the scope. Since the electrical connection state of the connector part exterior metal 68 is as described in the configuration section, the generated noise flows to the electric circuit GND 70 through the connector part exterior metal 68. That is, noise emission can be prevented.
[0060]
As shown in FIG. 3, when the high frequency treatment instrument 61 is passed through the treatment instrument insertion port 200 of the scope and the high frequency treatment is performed, the high frequency current 60 leaks from the high frequency treatment instrument 61 to the insertion portion exterior metal 65.
[0061]
However, since the insertion portion exterior metal 65, the operation portion exterior metal 66, and the universal cord portion exterior metal 67 are electrically connected but are electrically floating from other portions, the operator's hand is, for example, the operation portion exterior metal 66. Is electrically connected, but is floating electrically from other parts, so if the part other than the operator's hand does not touch any other metal body, the operator will not be electrocuted, Safety is ensured.
[0062]
If the outer metal of the insertion portion outer metal 65, the operation portion outer metal 66, and the universal cord portion outer metal 67 falls on the GND 70 of the electric circuit, like the scope connector portion outer metal 68, in the case of the above case, The surgeon may be electrocuted.
[0063]
Although FIG. 3 shows an example in which only the scope connector part exterior metal 68 is electrically floating from other exterior metals, the structure is not limited to the scope connector part exterior metal 68. Both the universal cord portion exterior metal 67 and the scope connector portion exterior metal 68 may be used.
[0064]
That is, the part of the exterior metal part after the universal cord part (excluding the insertion part and the operation part) that is likely to radiate noise is connected to the GND of the patient circuit to reduce noise radiation, while the exterior metal part on the front side of the operation part The part is secured from the ground to ensure safety.
[0065]
By aligning the cover glass side reference surface 40 of the solid-state imaging device 17 with the lens side reference surface 41 provided at the rear end of the rear group lens frame 34, the optical axis and the center of the light receiving surface can be aligned only by adjustment in the x-axis direction. Easy to do.
[0066]
In the picture of this embodiment (FIG. 1C), there is only one reference plane, but two planes may be used as shown in the text of the configuration. In that case, the optical axis and the center of the light receiving surface are uniquely positioned.
[0067]
Since the cover glass 38 of the solid-state imaging device 17 is directly bonded and fixed to the rear group lens frame 34, the entire length of the imaging unit 15 can be shortened. Further, since it is no longer necessary to attach a separate glass member on the cover glass 38, the cover glass 38 is no longer provided with a reference surface.
[0068]
Since the notch 39 is provided on the light receiving surface side of the cover glass 38, when the cover glass 38 is positioned and bonded on the light receiving surface, the seepage of the adhesive does not flow out to the side surface of the cover glass. It has become. It is possible to prevent the adhesive from adhering to the cover glass side reference surface 40.
[0069]
The hard length L1 behind the substrate in the first embodiment is not different from the hard length L2 in the conventional example (FIG. 11). In the case of the conventional example, since each electric wire 112 is wired outside the imaging unit, a space for expanding each electric wire 112 is necessary, but in the case of the first embodiment, this is unnecessary. Accordingly, a space for the connector 19 is required, so that L1≈L2 in the end.
[0070]
As described above, according to the present embodiment, by adopting the connector 19, it is possible to make the imaging unit 15 easily manufactured, and the hard length (in the optical axis direction) of the imaging unit 15 is kept almost the same as the conventional example. The height or width direction (in the direction orthogonal to the optical axis) of the imaging unit 15 can be reduced as it is.
Therefore, it is possible to provide the imaging unit 15 at a low cost, and it is possible to reduce the diameter of the tip configuration unit 6 that houses the imaging unit 15.
[0071]
(Second Embodiment)
FIG. 5 shows a connector 71 according to the second embodiment. The connector 71 is embedded in the upper and lower and left and right side surfaces of the connector main body 72, or the terminal 73 penetrates through the inside.
That is, the connector 71 has a structure in which the board side and the cable side terminals are directly connected without being connected via the pattern.
[0072]
The lengths of the terminals 73 protruding from the connector main body 72 toward the cable side or the board side, for example, s1 and s2, may be the same length or different lengths.
Also, the intervals between the terminals 73, for example, T1 and T2, may be the same interval or different intervals.
[0073]
The cross-sectional shape of the connector main body 72 may not be rectangular but may be irregular, circular, or polygonal. Further, the thickness of the terminal 73 may be changed at each terminal 73 according to the magnitude of the current flowing through the terminal 73.
The material of the connector main body 72 may be an insulator, and may be, for example, a ceramic or an electrically insulating resin.
[0074]
Further, each terminal 73 may be detachable from the connector main body 72. In this way, when the terminal 73 is disconnected, it can be repaired by replacing only the terminal 73.
[0075]
Moreover, you may bend like the terminal shown with the code | symbol 74 of FIG. In this way, a complicated wiring pattern on the flexible substrate 30 can be dealt with. Further, it can be used to connect to an electrode portion or a conductor portion of an electronic component mounted on the flexible substrate 30.
[0076]
The other structure is the same as that of the first embodiment. The operation and effect of the present embodiment are the same as those of the first embodiment.
[0077]
(Third embodiment)
FIG. 6 shows a cable connecting portion in the third embodiment. In the connector 19 of the first embodiment, the board-side terminal 48 and the cable-side terminal 49 are metal terminals, whereas the connector 75 in this embodiment has the board-side terminal 48 as in the first embodiment. However, the cable side terminal is not a metal terminal but only the circuit pattern 76 (the cable side terminal is formed by the circuit pattern).
[0078]
The cable 21 is fixed by a cable base 77, each electric wire (in the present embodiment, the coaxial cable 37) is electrically connected to the solder protrusion 81, and is wired to the circuit pattern 76 via an anisotropic conductive sheet 78.
As shown in FIG. 7, the cable 21 is cut perpendicular to the longitudinal direction, and the overall shield 21a and the overall covering 21b are stripped about 1 mm from the cut surface.
[0079]
Next, as shown in FIG. 8, the coaxial cable 37 is tight, that is, has an inner diameter that can be fixed so as not to move relative to each other, and a metal cable base 77 having a length of about 2 mm is attached to the strip portion of the cable 21. The coaxial cable 37 is covered so as to cover it by pushing it in from the direction indicated by the arrow.
[0080]
In this way, as shown in FIG. 8, the cable base 77 is in pressure contact with and electrically connected to the cable base 77 at the portion where the general shield 21a is inserted between the overall cover 21b and the coaxial cable 37. Installed.
[0081]
The front end surface of the cable base 77 is arranged to be about 0.5 mm above the cut surface of the coaxial cable 37. A transparent insulating resin 79 is poured into the stepped portion and cured. Thereafter, the conductive hole 80 is formed by irradiating laser light toward the coaxial core wire 37a.
A solder layer 81 is formed in the conductive hole 80, and a solder protrusion 81 is formed so as to protrude above the tip end surface of the cable base 77.
[0082]
That is, as shown in FIG. 8, the solder protrusion 81 that is electrically connected to the coaxial core wire 37 a is disposed in each conductive hole 80 on the front end surface covered with the transparent insulating resin 79. The cable base 77 is electrically connected to the general shield 21a.
[0083]
Returning to FIG. 6, the cable 21 having the end face formed in this manner is connected to the circuit pattern 76 of the connector 75 through the anisotropic conductive film 78 having conductivity only in the thickness direction.
[0084]
The anisotropic conductive film 78 can be electrically connected and bonded by raising the temperature to around 180 ° C. and applying pressure and / or ultrasonic vibration between the solder protrusion 81 and the corresponding circuit pattern 76. The rest of the configuration is almost the same as that of the first embodiment. The operation is also almost the same as that of the first embodiment.
[0085]
According to the present embodiment, in addition to the effects of the first embodiment, the size (hard length) of the imaging unit in the optical axis direction can be further reduced.
Further, by using the pipe-shaped cable cap 77 on the cable end face, the position of each core wire is accurately determined, and the cable connection work is stabilized.
The position of the anisotropic conductive sheet 78 is not limited to the cable side. It may be on the substrate side or may be adopted on both the substrate side and the cable side.
[0086]
FIG. 9 shows each electric wire of the endoscope apparatus 85 as a whole. In this endoscope apparatus 85, for example, the video scope (electronic endoscope) 1 according to the third embodiment, the light source device 86 to which the video scope 1 is connected, and the electrical contact portion 22 of the video scope 1 are connected in signal. The video processor 88 is connected via a cable 87.
[0087]
The imaging unit 15 including the solid-state imaging device 17 and the like is connected to the electrical contact unit 22 via the cable 21. A switch 89 provided in the operation unit 3 is also connected to the electrical contact unit 22 via the remote control cable 90, provided on the front end side of the scope connector unit 5, and connected to the first electrical circuit 91 in the light source device 86. The electrical contact 91 is also connected to the electrical contact portion 22 via the control signal cable 92. The electrical contact portion 22 connected to these cables is connected to a signal connection cable 87 via an electrical connector 93, and this signal connection cable 87 is connected to a second electrical circuit 94 of the video processor 88.
[0088]
FIG. 10 is a detailed view of part C of FIG. Each electric wire disposed in the video scope 1 is connected to the contact pin (male) 95 by solder 102. The cable 21 includes a plurality of drive signal cables 96 (one in FIG. 10) and a plurality of output signal cables 97 (one in FIG. 10).
[0089]
An electromagnetic absorber 98 made of ferrite that absorbs electromagnetic waves is provided on at least the drive signal cable 96 and the control signal cable 92.
Incidentally, the control signal cable 92 is a signal line for controlling the amount of light from the light source device 86 supplied to the video scope 1, for example.
[0090]
The electromagnetic absorber 98 is fixed to each cable with an insulating adhesive 99 such as silicon.
The insulating adhesive 99 filled on the back side of the substrate 100 ensures watertightness between the contact pins (male) 95 and the substrate 100.
[0091]
The wiring portion of the electrical connector 22 is covered and shielded by the metal body 101.
The contact pins (male) 95 are connected to contact pins (female) 103, respectively. The contact pin (female) 103 is fixed to the substrate 104 of the electrical connector 93.
[0092]
With the configuration as described above, unnecessary radiation noise generated from the video processor 88 can be blocked from propagating through the electromagnetic absorber 98, a reliable shield can be performed, and unnecessary radiation noise of the entire apparatus can be reduced.
[0093]
In the first embodiment and the like, the flexible substrate 30 is described as the substrate on which the imaging device is formed. However, the substrate is not limited to the flexible substrate 30 and may be a rigid substrate.
[0094]
[Appendix]
1. An objective optical system;
A solid-state imaging device disposed at an imaging position of the objective optical system;
A substrate connected to the solid-state image sensor and on which electronic components are mounted;
A cable for transmitting a signal from the solid-state imaging device;
A connection member having a terminal connected to the land of the substrate and a terminal to which the cable is connected;
An imaging apparatus comprising:
[0095]
2. The imaging apparatus according to appendix 1, wherein the substrate is a flexible substrate.
[0096]
3. An objective optical system;
A holding member for holding the objective optical system;
A solid-state image sensor with a cover glass disposed at the imaging position of the objective optical system;
In an imaging apparatus having
An imaging apparatus, wherein a reference surface for performing optical adjustment between the objective optical system and the solid-state imaging device is provided on the holding member and the cover glass.
[0097]
4). A long insertion part having an imaging means at the tip part;
An operation unit connected to a proximal end of the insertion unit;
A flexible cord portion extended from the operation portion;
A light source device that supplies illumination light emitted from the distal end of the insertion portion, and a connector portion that connects the cord to a video processor that performs signal processing on the imaging means,
In an endoscope having an exterior metal that is not electrically connected to the exterior metal of the light source device and the video processor,
An electronic endoscope characterized in that an exterior metal other than the insertion portion and the operation portion is insulated from the insertion portion and the operation portion and is electrically connected to the ground of the electric circuit.
[0098]
5. The electronic endoscope according to appendix 4, wherein an exterior metal of the connector portion is electrically connected to the GND.
[0099]
【The invention's effect】
As described above, according to the present invention, the board-side terminal set to match the land of the board can be easily connected to the land, the size of the image pickup device can be reduced, and the connection of the cable can be reduced. Therefore, the hard length is small and the cost can be reduced.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an imaging apparatus according to a first embodiment of the present invention.
FIG. 2 is a perspective view showing a video scope incorporating the first embodiment.
FIG. 3 is a schematic diagram showing an electrical connection state of an exterior metal of a video scope.
FIG. 4 is a diagram illustrating a part of an imaging apparatus according to a modification.
FIG. 5 is a perspective view showing a connector according to a second embodiment of the present invention.
FIG. 6 is a view showing the vicinity of a connection portion between a connector and a cable according to a third embodiment of the present invention.
FIG. 7 is an explanatory diagram for attaching a cable cap to an end of the cable on the connector connection side.
FIG. 8 is a perspective view showing a structure of a connector connecting side of a cable.
FIG. 9 is an overall configuration diagram of an endoscope apparatus.
FIG. 10 is a cross-sectional view showing a structure of a connection portion between an electrical contact portion and a signal connection cable.
FIG. 11 is a diagram illustrating a schematic structure of a conventional imaging apparatus.
[Explanation of symbols]
1 ... Video scope
2 ... Insertion section
6 ... tip component
15 ... Imaging unit
16 ... Objective lens system
17 ... Solid-state imaging device
18 ... Signal processing circuit
19 ... Connector
21 ... Signal cable
31 ... Front lens group
32 ... Rear lens group
38 ... cover glass
32 ... Adhesive
37 ... Electric wire
44 ... IC chip
45 ... Capacitor
46 ... Land
48 ... Board side terminal
49 ... Cable side terminal
55 ... Shield frame
57 ... Flexible substrate wiring part

Claims (2)

An objective optical system;
A solid-state imaging device disposed at an imaging position of the objective optical system;
The tip side connected to the solid-state imaging device, a flexible substrate is bent so as to form a space for the rear end side to place the electronic component on the inside,
One end side is connected to the outer land portion of the flexible substrate, and a connection member having a terminal protruding to the rear end side ,
A cable connected to the terminal and transmitting a signal from the solid-state imaging device;
An imaging apparatus comprising: An objective optical system;
A solid-state imaging device disposed at an imaging position of the objective optical system;
The tip side connected to the solid-state imaging device, a flexible substrate is bent so as to form a space for the rear end side to place the electronic component on the inside,
One end side is connected to the outer land portion of the flexible substrate, and a connection member having a terminal on the side surface facing the flexible substrate ,
A cable connected to the terminal and transmitting a signal from the solid-state imaging device;
An imaging apparatus comprising:

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