JPH05291864A - Sample-and hold circuit element mount circuit and its manufacture - Google Patents
Sample-and hold circuit element mount circuit and its manufactureInfo
- Publication number
- JPH05291864A JPH05291864A JP9054892A JP9054892A JPH05291864A JP H05291864 A JPH05291864 A JP H05291864A JP 9054892 A JP9054892 A JP 9054892A JP 9054892 A JP9054892 A JP 9054892A JP H05291864 A JPH05291864 A JP H05291864A
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- wave element
- substrate
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、弾性表面波素子実装回
路とその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface acoustic wave element mounting circuit and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】移動体通信の発展にともない、各種移動
体通信機器の送受信の段間フィルタやアンテナフィルタ
などとして使用される弾性表面波素子の性能において、
低損失化、小型軽量化などが要求されるようになってき
た。2. Description of the Related Art With the development of mobile communication, in the performance of surface acoustic wave elements used as an interstage filter for transmitting and receiving of various mobile communication devices and an antenna filter,
There has been a demand for lower loss, smaller size and lighter weight.
【０００３】以下に、従来の弾性表面波素子実装回路の
製造方法について説明する。図６は、従来の弾性表面波
素子実装回路の製造方法による、弾性表面波素子実装回
路の構成の概略を示す側面図である。図６において、６
１は弾性表面波素子、６２は電極パッド、６３はセラミ
ック基板、６４は電極パタ−ン、６５は金属ワイヤ、６
６は蓋、６７は接着剤、６８絶縁性接着剤である。A conventional method of manufacturing a surface acoustic wave device mounted circuit will be described below. FIG. 6 is a side view showing an outline of the configuration of a surface acoustic wave element mounting circuit according to a conventional method for manufacturing a surface acoustic wave element mounting circuit. In FIG. 6, 6
1 is a surface acoustic wave element, 62 is an electrode pad, 63 is a ceramic substrate, 64 is an electrode pattern, 65 is a metal wire, 6
6 is a lid, 67 is an adhesive, and 68 is an insulating adhesive.
【０００４】従来の弾性表面波素子実装回路の製造方法
では、セラミック基板６３上に弾性表面波素子６１を接
着固定し、弾性表面波素子６１上に外部導体と電気的導
通を図るために形成された電極パッド６２と、セラミッ
ク基板６３上に形成された電極パタ−ン６４とを、アル
ミニウムや金などの金属ワイヤ６５により接続し導通を
図っていた。さらに、セラミックや金属からなる蓋６６
を絶縁性接着剤６６によりセラミック基板６３と接着
し、気密を保持していた。In the conventional method of manufacturing a surface acoustic wave element mounted circuit, the surface acoustic wave element 61 is adhered and fixed on the ceramic substrate 63, and is formed on the surface acoustic wave element 61 for electrical conduction with an external conductor. The electrode pad 62 and the electrode pattern 64 formed on the ceramic substrate 63 are connected to each other by a metal wire 65 such as aluminum or gold to achieve conduction. Furthermore, a lid 66 made of ceramic or metal
Was adhered to the ceramic substrate 63 with an insulating adhesive 66 to maintain airtightness.
【０００５】また別の実装方法として、フェイスダウン
方式による実装方法がある。図７に示すように、弾性表
面波素子７１の電極パッド７２とセラミック基板７３上
の電極７４とを接続する半田層７５を備えた弾性表面波
素子７１において、弾性表面波素子７１の基板を介し
て、弾性表面波素子の電極パッド部７２にレーザ光を照
射することにより接続部を加熱し、セラミック基板７３
に実装するという方法がある（特開平２−１０４１１９
号）。Another mounting method is a face-down mounting method. As shown in FIG. 7, in a surface acoustic wave element 71 having a solder layer 75 for connecting the electrode pad 72 of the surface acoustic wave element 71 and the electrode 74 on the ceramic substrate 73, the surface of the surface acoustic wave element 71 is interposed. Then, the connection portion is heated by irradiating the electrode pad portion 72 of the surface acoustic wave element with laser light, and the ceramic substrate 73
There is a method of mounting the device in Japanese Patent Laid-Open No. 2-104119.
issue).
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、従来の
弾性表面波素子の実装方法の前者では、弾性表面波素子
の共振周波数あるいは通過帯域周波数が高くなり、電極
指幅あるいは櫛形電極指部の部分が相対的に小さくなっ
ても、金属ワイヤの大きさまたはワイヤボンディング精
度によって決定される前記弾性表面波素子上の電極パッ
ド部の大きさは不変であり、弾性表面波素子の大きさを
決定する大きな要因となっていた。従って、周波数帯が
ＧＨｚ帯となり、電極指幅がサブミクロンオーダーにな
った場合においても、弾性表面波素子自体の大きさは電
極パッド部の大きさによって制約を受けていた。また、
金属ワイヤにより弾性表面波素子とセラミック基板上の
電極とを接続していたため、弾性表面波素子に比べセラ
ミック基板が大きくなり、小型軽量化を困難にするとい
う致命的な問題点を有していた。However, in the former method of mounting the conventional surface acoustic wave device, the resonance frequency or the pass band frequency of the surface acoustic wave device becomes high, and the electrode finger width or the comb-shaped electrode finger portion is Even if it becomes relatively small, the size of the electrode pad portion on the surface acoustic wave element, which is determined by the size of the metal wire or the wire bonding accuracy, is invariable, and the size that determines the size of the surface acoustic wave element is large. It was a factor. Therefore, even when the frequency band is the GHz band and the electrode finger width is on the submicron order, the size of the surface acoustic wave element itself is restricted by the size of the electrode pad portion. Also,
Since the surface acoustic wave element and the electrode on the ceramic substrate were connected by the metal wire, the ceramic substrate was larger than the surface acoustic wave element, and there was a fatal problem that it was difficult to reduce the size and weight. ..
【０００７】また、従来の弾性表面波素子の実装方法の
後者においては、金属ワイヤの接続工程が不要となり、
弾性表面波素子の小型化が可能になるなどの利点があ
る。しかしながら、金属層間に半田層を用いているた
め、半田層を溶融する際のフラックスの弾性表面波素子
の櫛形電極部におよぼす影響は否めず、また半田飛沫が
弾性表面波素子の櫛形電極部に付着するなどの問題が生
じる。さらに、局所的にかなり高温に加熱するため電極
パッドのＡｌ合金が半田層中に溶解し、電極が損傷を受
けるなどの問題がある。さらに、素子を基板に実装する
際の半田リフローに対する信頼性、また端子一つ一つを
順次加熱接着していくため、量産性やコストにおいても
問題があった。In the latter of the conventional methods of mounting a surface acoustic wave element, the metal wire connection step is not required,
There are advantages such as downsizing of the surface acoustic wave element. However, since a solder layer is used between the metal layers, there is an undeniable effect that the flux when melting the solder layer affects the comb-shaped electrode portion of the surface acoustic wave element, and the solder droplets do not spread on the comb-shaped electrode portion of the surface acoustic wave element. Problems such as adhesion occur. Furthermore, since the Al alloy of the electrode pad is locally heated to a considerably high temperature, the Al alloy is dissolved in the solder layer, and the electrode is damaged. Further, there are problems in reliability with respect to solder reflow when mounting the element on the substrate, and since each terminal is sequentially heat-bonded, there is a problem in mass productivity and cost.
【０００８】本発明は、従来の問題点を解決するもので
あり、弾性表面波素子の小型軽量化を実現し、従来必要
であった弾性表面波素子の実装工程におけるワイヤボン
ディングの工程を不要とするとともに、弾性表面波素子
自体に悪影響をおよぼさない信頼性の高い、量産性ある
いはコスト的にも優れた弾性表面波素子実装回路とその
製造方法を提供することを目的とする。The present invention solves the problems of the prior art, realizes the reduction in size and weight of the surface acoustic wave element, and eliminates the wire bonding step required in the mounting step of the surface acoustic wave element. In addition, it is an object of the present invention to provide a highly reliable surface acoustic wave element mounting circuit that does not adversely affect the surface acoustic wave element itself, is excellent in mass productivity, and a manufacturing method thereof.
【０００９】[0009]
【課題を解決するための手段】この目的を達成するため
に、本発明の弾性表面波素子実装回路の製造方法は、弾
性表面波素子の電極パッド部に金またはアルミニウムか
らなるバンプを形成し、さらにバンプに導電性接着剤を
転写塗布し、弾性表面波素子と、電極パターンが形成さ
れた基板とを向い合わせ、位置合わせを行なった後導電
性接着剤を加熱硬化させ、弾性表面波素子を基板に固着
することにより導通を図り、さらに弾性表面波素子の周
囲あるいはその一部を、絶縁性接着剤により、弾性表面
波素子の櫛形電極部が基板に接触しないだけの空隙を設
けて、基板と接着する方法である。In order to achieve this object, a method of manufacturing a surface acoustic wave device-mounted circuit according to the present invention comprises forming bumps made of gold or aluminum on electrode pad portions of the surface acoustic wave device, Further, a conductive adhesive is transfer-coated on the bumps, the surface acoustic wave element and the substrate on which the electrode pattern is formed are faced to each other, and after alignment, the conductive adhesive is heat-cured to fix the surface acoustic wave element. The surface of the surface acoustic wave device is electrically connected by being fixed to the substrate, and a gap is provided around the surface acoustic wave device or a part thereof by an insulating adhesive so that the comb-shaped electrode portion of the surface acoustic wave device does not contact the substrate. It is a method of bonding with.
【００１０】[0010]
【作用】前記弾性表面波素子実装回路の製造方法によ
り、弾性表面波素子の電極パッド部の極小化を図り、弾
性表面波素子自体の大きさを小さくするとともに、従来
必要であった弾性表面波素子の実装工程におけるワイヤ
ボンディングの工程を割愛し、信頼性の高い、量産性あ
るいはコスト的にも優れた弾性表面波素子実装回路を得
ることができる。According to the method of manufacturing the surface acoustic wave element mounting circuit, the electrode pad portion of the surface acoustic wave element is minimized to reduce the size of the surface acoustic wave element itself, and the surface acoustic wave which has been conventionally required. By omitting the wire bonding step in the element mounting step, it is possible to obtain a highly reliable surface acoustic wave element mounting circuit which is excellent in mass productivity and cost.
【００１１】[0011]
【実施例】（実施例１）以下、本発明の第１の実施例に
ついて、図面を参照しながら詳細に説明する。図１
（ａ）は、本発明の第１の実施例における弾性表面波素
子実装回路の構成の概略を示す上面図であり、同図
（ｂ）は、同じく本発明の第１の実施例における弾性表
面波素子実装回路の構成の概略を示す側面図である。図
１において、１１は弾性表面波素子、１２は電極パッ
ド、１３セラミック基板、１４は電極パタ−ン、１５は
導電性バンプ、１６は絶縁性接着剤である。(Embodiment 1) Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings. Figure 1
FIG. 1A is a top view showing a schematic configuration of a surface acoustic wave device mounting circuit according to a first embodiment of the present invention, and FIG. 1B is also a surface acoustic wave according to a first embodiment of the present invention. It is a side view which shows the outline of a structure of a wave element mounting circuit. In FIG. 1, 11 is a surface acoustic wave element, 12 is an electrode pad, 13 a ceramic substrate, 14 is an electrode pattern, 15 is a conductive bump, and 16 is an insulating adhesive.
【００１２】本実施例では、弾性表面波素子１１に圧電
基板として３６゜Ｙ−Ｘタンタル酸リチウムを用い、そ
のチップサイズは１．１ｍｍ×１．８ｍｍであった。従
来の実装方法では金属ワイヤにより外部導体との導通を
図っていたため、電極パッド１２の大きさは２５０μｍ
×２５０μｍであったが、本実施例ではその大きさを１
００μｍ×１００μｍまで縮小することができた。ま
た、セラミック基板１３として３．５ｍｍ×３．５ｍ
ｍ、厚さ４６０μｍのアルミナ基板を用い、その上に厚
さ５μｍのＡｕ厚膜からなる電極１４をスクリーン印刷
により形成した。導電性バンプ１５は２層からなってお
り、電極パッド１２にＡｕバンプを形成し、さらに前記
ＡｕバンプにＡｇ−Ｐｄ合金を含む熱硬化性のエポキシ
系導電性接着剤を転写塗布し、弾性表面波素子１１とセ
ラミック基板１３を向い合わせ、位置合わせを行なった
後、１２０℃で加熱接着し導通を図った構成となってい
る。接着後のバンプ径は約８０μｍ、高さは約５０μｍ
であり、弾性表面波素子１１の櫛形電極部が基板１３に
接触しないだけの空隙を設けることができる。また、数
個の導電性バンプ１５だけでは弾性表面波素子１１とセ
ラミック基板１３との接着強度が微弱であるため、さら
に熱硬化性のシリコン系絶縁性接着剤１６を、弾性表面
波素子１１の周囲の一部に弾性表面波の伝搬部に接触し
ないように塗布し、１００℃で硬化させ、弾性表面波素
子１１とセラミック基板１３との接着強度を補強した構
成となっている。なお、本実施例で用いた接着剤は、い
ずれも後工程での２５０℃、３分の半田リフローに対し
ても、十分な耐熱性を示した。In this example, 36 ° Y-X lithium tantalate was used as the piezoelectric substrate for the surface acoustic wave element 11, and the chip size was 1.1 mm × 1.8 mm. In the conventional mounting method, the size of the electrode pad 12 is 250 μm because the metal wire is used to establish continuity with the outer conductor.
However, in the present embodiment, the size is 1
It was possible to reduce the size to 00 μm × 100 μm. Also, as the ceramic substrate 13, 3.5 mm × 3.5 m
An electrode 14 made of an Au thick film having a thickness of 5 μm was formed on the alumina substrate having a thickness of m and a thickness of 460 μm by screen printing. The conductive bump 15 is composed of two layers. An Au bump is formed on the electrode pad 12, and a thermosetting epoxy-based conductive adhesive containing Ag-Pd alloy is transfer-coated on the Au bump to form an elastic surface. The wave element 11 and the ceramic substrate 13 are faced to each other, aligned, and then heat-bonded at 120 ° C. for conduction. Bump diameter after bonding is about 80 μm, height is about 50 μm
Therefore, it is possible to provide a gap in which the comb-shaped electrode portion of the surface acoustic wave element 11 does not contact the substrate 13. In addition, since the bonding strength between the surface acoustic wave element 11 and the ceramic substrate 13 is weak with only a few conductive bumps 15, a thermosetting silicon-based insulating adhesive 16 is further applied to the surface acoustic wave element 11. It is applied so that it does not come into contact with the surface acoustic wave propagation portion, and is hardened at 100 ° C. to reinforce the adhesive strength between the surface acoustic wave element 11 and the ceramic substrate 13. The adhesives used in this example all showed sufficient heat resistance against solder reflow at 250 ° C. for 3 minutes in the subsequent step.
【００１３】本実施例では、弾性表面波素子１１とセラ
ミック基板１３との接着を補強するために熱硬化性シリ
コン系絶縁性接着剤１６を用いたが、絶縁性接着剤１６
として融点が２８０℃程度の低融点ガラスを用いてもよ
い。In this embodiment, the thermosetting silicon-based insulating adhesive 16 is used to reinforce the adhesion between the surface acoustic wave element 11 and the ceramic substrate 13, but the insulating adhesive 16
Alternatively, a low melting point glass having a melting point of about 280 ° C. may be used.
【００１４】また、図４に示すように、セラミック基板
４３上に、金属またはセラミックからなる蓋４７をシリ
コン系の絶縁性接着剤４６により接着し、弾性表面波素
子４１の気密を保持することにより、デバイスの信頼性
をさらに向上させることができる。このときのデバイス
の高さは１．５ｍｍであった。Further, as shown in FIG. 4, a lid 47 made of metal or ceramic is adhered on the ceramic substrate 43 with a silicon-based insulating adhesive 46 to keep the surface acoustic wave element 41 airtight. , The reliability of the device can be further improved. The height of the device at this time was 1.5 mm.
【００１５】また、弾性表面波素子の基板裏面からの不
要反射波の影響をなくすため、基板裏面に凹凸加工を施
す、または図５に示すように、基板裏面に吸音材５７を
設けることにより、周波数特性に優れた弾性表面波素子
を得ることができる。Further, in order to eliminate the influence of unnecessary reflected waves from the back surface of the surface acoustic wave device, unevenness is applied to the back surface of the substrate, or as shown in FIG. 5, a sound absorbing material 57 is provided on the back surface of the substrate. It is possible to obtain a surface acoustic wave device having excellent frequency characteristics.
【００１６】さらに、セラミック基板１３上に、あらか
じめインピーダンス整合回路を形成することにより、従
来必要であった外付けのインピーダンス整合回路を不要
のものとすることができる。Further, by forming the impedance matching circuit on the ceramic substrate 13 in advance, the externally required impedance matching circuit which has been conventionally required can be eliminated.
【００１７】以上のように、弾性表面波素子の電極パッ
ド部に金またはアルミニウムからなるバンプを形成し、
さらに前記バンプに導電性接着剤を転写塗布し、弾性表
面波素子と、電極パターンが形成された基板とを向い合
わせ、位置合わせを行なった後導電性接着剤を加熱硬化
させ、弾性表面波素子を基板に固着することにより導通
を図り、さらに弾性表面波素子の周囲あるいはその一部
を、絶縁性接着剤により、弾性表面波素子の櫛形電極部
が基板に接触しないだけの空隙を設けて、基板と接着す
ることにより、従来必要であったワイヤボンディングの
工程を不要とし、弾性表面波素子実装回路の小型化を図
るとともに、信頼性、量産性、コスト性に優れた弾性表
面波素子実装回路を実現し、弾性表面波素子実装回路の
実装面積を極小化することができる。As described above, the bumps made of gold or aluminum are formed on the electrode pad portions of the surface acoustic wave element,
Further, a conductive adhesive is transferred and applied to the bumps, the surface acoustic wave element and the substrate on which the electrode pattern is formed are faced to each other, and after alignment, the conductive adhesive is heat-cured to obtain a surface acoustic wave element. To achieve electrical continuity by fixing the surface acoustic wave element to the substrate, and further by surrounding the surface acoustic wave element or a part thereof with an insulating adhesive to provide a gap so that the comb-shaped electrode portion of the surface acoustic wave element does not contact the substrate, By bonding to the substrate, the wire bonding process, which was necessary in the past, is not required, and the surface acoustic wave element mounting circuit is miniaturized, and the surface acoustic wave element mounting circuit is excellent in reliability, mass productivity, and cost efficiency. And the mounting area of the surface acoustic wave element mounting circuit can be minimized.
【００１８】（実施例２）以下に、本発明の第２の実施
例について、図面を参照しながら詳細に説明する。図２
は、本発明の第２の実施例における弾性表面波素子実装
回路の構成の概略を示す上面図である。図２において、
２１は受信用アンテナフィルタ、２２は受信段間フィル
タ、２３は局部発振フィルタ、２４は第１中間周波フィ
ルタであり、すべて弾性表面波を利用したデバイスであ
る。また、２５はアンプ、２６はミキサ、２７はセラミ
ック基板、２８は電極である。(Second Embodiment) A second embodiment of the present invention will be described below in detail with reference to the drawings. Figure 2
[FIG. 6] is a top view showing a schematic configuration of a surface acoustic wave device mounting circuit according to a second embodiment of the present invention. In FIG.
Reference numeral 21 is a receiving antenna filter, 22 is a receiving interstage filter, 23 is a local oscillation filter, and 24 is a first intermediate frequency filter, all of which are devices using surface acoustic waves. Further, 25 is an amplifier, 26 is a mixer, 27 is a ceramic substrate, and 28 is an electrode.
【００１９】本実施例では、セラミック基板２７として
１０．０ｍｍ×１０．０ｍｍ、厚さ６１０μｍのアルミ
ナ基板を用い、その上に厚さ５μｍのＡｕ厚膜からなる
電極２８をスクリーン印刷により形成した。弾性表面波
素子２１、２２、２３、２４をセラミック基板２７上
に、本発明の第１の実施例と同様に、導電性バンプを用
いて実装し、さらにアンプ２５およびミキサ２６を同一
セラミック基板２７上に一体に実装し、セラミック基板
２７上の配線電極と導通を図りモジュールを構成した。
なお、セラミック基板２７上には弾性表面波素子と他の
素子とのインピーダンス整合を図るための整合回路も同
時に形成されている。前記構成により、携帯電話等で用
いられる受信部の高周波回路をハイブリッド化し、超小
型の高周波受信モジュールを実現することができた。In this embodiment, an alumina substrate having a size of 10.0 mm × 10.0 mm and a thickness of 610 μm is used as the ceramic substrate 27, and an electrode 28 made of an Au thick film having a thickness of 5 μm is formed thereon by screen printing. The surface acoustic wave elements 21, 22, 23, and 24 are mounted on the ceramic substrate 27 by using conductive bumps as in the first embodiment of the present invention, and the amplifier 25 and the mixer 26 are mounted on the same ceramic substrate 27. It was mounted integrally on the above, and the module was constructed by establishing electrical connection with the wiring electrodes on the ceramic substrate 27.
A matching circuit for impedance matching between the surface acoustic wave element and another element is also formed on the ceramic substrate 27 at the same time. With the above configuration, the high frequency circuit of the receiving section used in a mobile phone or the like can be hybridized to realize a microminiature high frequency receiving module.
【００２０】本実施例では高周波受信部について示した
が、同様にして、高周波送信部、あるいは弾性表面波素
子を入・出力帯域通過フィルタとして用いたアンテナ共
用器、または弾性表面波素子を振動子として用いた電圧
制御発振器についても超小型のモジュールが実現できる
ことは言うまでもない。In the present embodiment, the high frequency receiving section is shown, but similarly, the high frequency transmitting section or an antenna duplexer using a surface acoustic wave element as an input / output band pass filter or a surface acoustic wave element is a vibrator. It goes without saying that the voltage-controlled oscillator used as can also be realized as an ultra-small module.
【００２１】以上のように、弾性表面波素子の電極パッ
ド部に金またはアルミニウムからなるバンプを形成し、
さらにバンプに導電性接着剤を転写塗布し、弾性表面波
素子と、電極パターンが形成された回路基板とを向い合
わせ、位置合わせを行なった後導電性接着剤を加熱硬化
させ、弾性表面波素子を回路基板に固着することにより
導通を図り、さらに弾性表面波素子の周囲あるいはその
一部を、絶縁性接着剤により、弾性表面波素子の櫛形電
極部が回路基板に接触しないだけの空隙を設けて、回路
基板と接着することを特徴とする弾性表面波素子と、他
の能動素子あるいは受動素子とを、回路基板上に一体に
集積化することにより、従来個別に実装していた素子を
一体化し、回路基板上での実装面積を大幅に縮小するこ
とができる。As described above, bumps made of gold or aluminum are formed on the electrode pad portions of the surface acoustic wave element,
Further, a conductive adhesive is transferred and applied to the bumps, the surface acoustic wave element and the circuit board on which the electrode pattern is formed are faced to each other, and after alignment, the conductive adhesive is heat-cured to obtain the surface acoustic wave element. Is secured to the circuit board for electrical continuity, and a gap is provided around the surface acoustic wave element or part of it so that the comb-shaped electrodes of the surface acoustic wave element do not contact the circuit board. The surface acoustic wave element, which is characterized by being bonded to the circuit board, and other active elements or passive elements are integrally integrated on the circuit board, so that the elements individually mounted conventionally are integrated. Therefore, the mounting area on the circuit board can be significantly reduced.
【００２２】本実施例では、第１の実施例と同様、弾性
表面波素子２１、２２、２３、２４とセラミック基板２
７との接着を補強するために熱硬化性シリコン系絶縁性
接着剤を用いたが、絶縁性接着剤として融点が２８０℃
程度の低融点ガラスを用いてもよい。In this embodiment, as in the first embodiment, the surface acoustic wave elements 21, 22, 23, 24 and the ceramic substrate 2 are arranged.
Although a thermosetting silicone-based insulating adhesive was used to reinforce the adhesion with 7, the melting point of the insulating adhesive was 280 ° C.
A low melting point glass may be used.
【００２３】また、回路基板金属またはセラミックから
なる蓋をシリコン系の絶縁性接着剤により接着し、弾性
表面波素子の気密を保持することにより、デバイスの信
頼性をさらに向上させることができる。Further, the reliability of the device can be further improved by adhering the lid made of the circuit board metal or ceramic with the silicon-based insulating adhesive to keep the surface acoustic wave element airtight.
【００２４】また、弾性表面波素子の基板裏面からの不
要反射波の影響をなくすため、基板裏面に凹凸加工を施
す、または、弾性表面波素子の基板裏面に吸音材を設け
ることにより、周波数特性に優れた弾性表面波素子実装
回路を得ることができる。Further, in order to eliminate the influence of unnecessary reflected waves from the back surface of the surface acoustic wave element substrate, unevenness is applied to the back surface of the substrate, or a sound absorbing material is provided on the back surface of the substrate of the surface acoustic wave element to obtain frequency characteristics. It is possible to obtain an excellent surface acoustic wave element mounting circuit.
【００２５】（実施例３）以下に、本発明による第３の
実施例について、図面を参照しながら詳細に説明する。
図３は、本発明による第３の実施例における弾性表面波
素子実装回路の構成の概略を示す側面図である。図３に
おいて、３１は弾性表面波素子、３２は電極パッド、３
３はセラミック基板、３４は電極、３５は導電性バン
プ、３６は絶縁性接着剤である。(Third Embodiment) A third embodiment of the present invention will be described in detail below with reference to the drawings.
FIG. 3 is a side view showing the outline of the configuration of the surface acoustic wave device mounting circuit according to the third embodiment of the present invention. In FIG. 3, 31 is a surface acoustic wave element, 32 is an electrode pad, 3
3 is a ceramic substrate, 34 is an electrode, 35 is a conductive bump, and 36 is an insulating adhesive.
【００２６】本実施例では、本発明の第１の実施例と同
様の実装方法により、弾性表面波素子３１をセラミック
基板３３上に実装した。次に、弾性表面波素子３１の気
密性を保持するため、セラミック基板３３上を弾性表面
波素子３１全体を覆うように、同じくシリコン系の絶縁
性接着剤３６により被覆封止した構成となっている。In this embodiment, the surface acoustic wave element 31 is mounted on the ceramic substrate 33 by the same mounting method as that of the first embodiment of the present invention. Next, in order to maintain the airtightness of the surface acoustic wave element 31, the surface of the ceramic substrate 33 is covered and sealed with a silicon-based insulating adhesive 36 so as to cover the entire surface acoustic wave element 31. There is.
【００２７】本実施例では、弾性表面波素子３１とセラ
ミック基板３３との接着を補強するために熱硬化性シリ
コン系絶縁性接着剤を用いたが、絶縁性接着剤として融
点が２８０℃程度の低融点ガラスを用いてもよい。さら
に、セラミック基板３３上に、外部回路とのインピーダ
ンス整合回路を印刷により形成することにより、従来必
要であった外付けの整合回路を不要とし、より一層回路
基板上での実装面積を縮小することができる。In this embodiment, a thermosetting silicon type insulating adhesive is used to reinforce the adhesion between the surface acoustic wave element 31 and the ceramic substrate 33, but the melting point of the insulating adhesive is about 280 ° C. Low melting point glass may be used. Further, by forming an impedance matching circuit with an external circuit on the ceramic substrate 33 by printing, an external matching circuit which is conventionally required is unnecessary, and the mounting area on the circuit board can be further reduced. You can
【００２８】以上のように、弾性表面波素子の電極パッ
ド部に金またはアルミニウムからなるバンプを形成し、
さらに前記バンプに導電性接着剤を転写塗布し、弾性表
面波素子と、電極パターンが形成された基板とを向い合
わせ、位置合わせを行なった後導電性接着剤を加熱硬化
させ、弾性表面波素子を基板に固着することにより導通
を図り、さらに絶縁性接着剤により、弾性表面波素子の
櫛形電極部に絶縁性接着剤が接触しないようにして、周
囲を覆うことにより弾性表面波素子を保持するととも
に、弾性表面波の櫛形電極部の気密を保持することによ
り、信頼性に優れた超小型の弾性表面波素子実装回路を
得ることができる。As described above, bumps made of gold or aluminum are formed on the electrode pad portions of the surface acoustic wave element,
Further, a conductive adhesive is transferred and applied to the bumps, the surface acoustic wave element and the substrate on which the electrode pattern is formed are faced to each other, and after alignment, the conductive adhesive is heat-cured to obtain a surface acoustic wave element. Is secured to the substrate for electrical continuity, and the insulating adhesive prevents the insulating adhesive from coming into contact with the comb-shaped electrode portion of the surface acoustic wave element and covers the periphery to hold the surface acoustic wave element. At the same time, by maintaining the airtightness of the surface acoustic wave comb-shaped electrode portion, it is possible to obtain a highly reliable microminiature surface acoustic wave element mounting circuit.
【００２９】[0029]
【発明の効果】以上のように本発明は、弾性表面波素子
の電極パッド部に金またはアルミニウムからなるバンプ
を形成し、さらにバンプに導電性接着剤を転写塗布し、
弾性表面波素子と、電極パターンが形成された基板とを
向い合わせ、位置合わせを行なった後導電性接着剤を加
熱硬化させ、弾性表面波素子を基板に固着することによ
り導通を図り、さらに弾性表面波素子の周囲あるいはそ
の一部を、絶縁性接着剤により、弾性表面波素子の櫛形
電極部が基板に接触しないだけの空隙を設けて、基板と
接着した構成を有することにより、弾性表面波素子の実
装工程におけるワイヤボンディングの工程を省略し、弾
性表面波素子自体の大きさを小さくするとともに、回路
基板上での実装面積を極小化することができる。また、
弾性表面波素子の信頼性にも優れ、保持強度も十分に提
供できる。さらに、弾性表面波素子裏面に凹凸加工を施
したり、あるいは吸音剤を設けることにより、弾性表面
波素子裏面からの不要反射波を抑制し、周波数特性に優
れた弾性表面波素子実装回路を実現できる。As described above, according to the present invention, bumps made of gold or aluminum are formed on the electrode pad portion of the surface acoustic wave element, and the conductive adhesive is transferred and applied to the bumps.
The surface acoustic wave element and the substrate on which the electrode pattern is formed face each other, and after alignment, the conductive adhesive is heated and hardened, and the surface acoustic wave element is fixed to the substrate to achieve electrical continuity and further elasticity. The surface acoustic wave element is provided with a gap around the surface wave element or a part thereof by an insulating adhesive so that the comb-shaped electrode portion of the surface acoustic wave element does not come into contact with the substrate and is bonded to the substrate. By omitting the wire bonding step in the element mounting step, the size of the surface acoustic wave element itself can be reduced, and the mounting area on the circuit board can be minimized. Also,
The surface acoustic wave element has excellent reliability and can provide sufficient holding strength. Further, by providing the back surface of the surface acoustic wave element with unevenness or providing a sound absorbing agent, unnecessary reflected waves from the back surface of the surface acoustic wave element can be suppressed, and a surface acoustic wave element mounting circuit with excellent frequency characteristics can be realized. ..
【００３０】さらに、弾性表面波素子の電極パッド部に
金またはアルミニウムからなるバンプを形成し、さらに
バンプに導電性接着剤を転写塗布し、弾性表面波素子
と、電極パターンが形成された回路基板とを向い合わ
せ、位置合わせを行なった後導電性接着剤を加熱硬化さ
せ、弾性表面波素子を回路基板に固着することにより導
通を図り、さらに弾性表面波素子の周囲あるいはその一
部を、絶縁性接着剤により、弾性表面波素子の櫛形電極
部が回路基板に接触しないだけの空隙を設けて、回路基
板と接着することにより、他の能動素子あるいは受動素
子とを回路基板上に一体に集積化することにより、回路
全体の小型化、パッケージ材料の大幅な縮小が可能とな
る。Further, bumps made of gold or aluminum are formed on the electrode pad portions of the surface acoustic wave element, and a conductive adhesive is transferred and applied to the bumps to form a surface acoustic wave element and a circuit board on which an electrode pattern is formed. After aligning and aligning with each other, the conductive adhesive is heated and hardened, and the surface acoustic wave element is fixed to the circuit board to establish electrical continuity. In addition, the area around the surface acoustic wave element or part of it is insulated. The active adhesive or passive element is integrated on the circuit board by forming a space with the conductive adhesive to prevent the comb-shaped electrode section of the surface acoustic wave element from contacting the circuit board and adhering it to the circuit board. The miniaturization of the entire circuit and the drastic reduction of the package material can be achieved by making the structure smaller.
【００３１】また、弾性表面波素子の電極パッド部に金
またはアルミニウムからなるバンプを形成し、さらにバ
ンプに導電性接着剤を転写塗布し、弾性表面波素子と、
電極パターンが形成された基板とを向い合わせ、位置合
わせを行なった後導電性接着剤を加熱硬化させ、弾性表
面波素子を基板に固着することにより導通を図り、さら
に絶縁性接着剤により、弾性表面波素子の櫛形電極部に
絶縁性接着剤が接触しないようにして、周囲を覆うこと
により弾性表面波素子を保持するとともに、弾性表面波
素子の櫛形電極部の気密を保持した構成により、パッケ
ージを不要のものとし、小型軽量化を図ることができ
る。Further, bumps made of gold or aluminum are formed on the electrode pad portions of the surface acoustic wave element, and a conductive adhesive is transferred and applied to the bumps to form the surface acoustic wave element.
After facing the substrate on which the electrode pattern is formed and aligning it, the conductive adhesive is heated and hardened, and the surface acoustic wave element is fixed to the substrate for electrical conduction. The insulating adhesive does not come into contact with the comb-shaped electrode portion of the surface acoustic wave element, and the surface acoustic wave element is held by covering the periphery, and the airtightness of the comb-shaped electrode portion of the surface acoustic wave element is also maintained. Can be eliminated, and the size and weight can be reduced.
【図１】（ａ）は本発明の第１の実施例における弾性表
面波素子実装回路の製造方法の概略を示す上面図 （ｂ）は本発明の第１の実施例における弾性表面波素子
実装回路の製造方法の概略を示す側面図FIG. 1A is a top view schematically showing a method of manufacturing a surface acoustic wave device mounting circuit according to a first embodiment of the present invention. FIG. 1B is a surface acoustic wave device mounting according to a first embodiment of the present invention. Side view showing the outline of the circuit manufacturing method
【図２】本発明の第２の実施例における弾性表面波素子
実装回路の製造方法の概略を示す上面図FIG. 2 is a top view showing an outline of a method of manufacturing a surface acoustic wave element mounted circuit according to a second embodiment of the present invention.
【図３】本発明の第３の実施例における弾性表面波素子
実装回路の製造方法の概略を示す側面図FIG. 3 is a side view showing an outline of a method of manufacturing a surface acoustic wave element mounted circuit according to a third embodiment of the present invention.
【図４】本発明の第１の実施例において、蓋部を設けた
弾性表面波素子実装回路の製造方法の概略を示す側面図FIG. 4 is a side view showing an outline of a method of manufacturing a surface acoustic wave element mounted circuit provided with a lid in the first embodiment of the present invention.
【図５】本発明の第１の実施例において、吸音材を設け
た弾性表面波素子実装回路の製造方法の概略を示す側面
図FIG. 5 is a side view schematically showing a method of manufacturing a surface acoustic wave element mounted circuit provided with a sound absorbing material in the first embodiment of the present invention.
【図６】従来の弾性表面波素子実装回路の製造方法によ
る弾性表面波素子実装回路の構成の概略を示す側面図FIG. 6 is a side view showing an outline of a configuration of a surface acoustic wave element mounting circuit according to a conventional method of manufacturing a surface acoustic wave element mounting circuit.
【図７】従来の弾性表面波素子実装回路の製造方法によ
る弾性表面波素子実装回路の構成の概略を示す側面図FIG. 7 is a side view schematically showing the configuration of a surface acoustic wave element mounting circuit according to a conventional method for manufacturing a surface acoustic wave element mounting circuit.
１１ 弾性表面波素子 １２ 電極パッド １３ セラミック基板 １４ 電極パタ−ン １５ 導電性バンプ １６ 絶縁性接着剤 11 surface acoustic wave element 12 electrode pad 13 ceramic substrate 14 electrode pattern 15 conductive bump 16 insulating adhesive
───────────────────────────────────────────────────── フロントページの続き (72)発明者 関 俊一 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 別所 芳宏 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shunichi Seki 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Yoshihiro Bessho, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.
Claims (14)
アルミニウムからなるバンプを形成し、さらに前記バン
プに導電性接着剤を転写塗布し、前記弾性表面波素子
と、電極パターンが形成された基板とを向い合わせ、位
置合わせを行なった後前記導電性接着剤を加熱硬化さ
せ、前記弾性表面波素子を前記基板に固着することによ
り導通を図り、さらに前記弾性表面波素子の周囲あるい
はその一部を、絶縁性接着剤により、前記弾性表面波素
子の櫛形電極部が前記基板に接触しないだけの空隙を設
けて、前記基板と接着したことを特徴とする弾性表面波
素子実装回路の製造方法。1. A bump made of gold or aluminum is formed on an electrode pad portion of a surface acoustic wave element, and a conductive adhesive is transfer-coated on the bump to form the surface acoustic wave element and an electrode pattern. After facing and aligning with the substrate, the conductive adhesive is heat-cured, and the surface acoustic wave element is fixed to the substrate to achieve electrical conduction. Part is bonded to the substrate by providing a gap with an insulating adhesive so that the comb-shaped electrode part of the surface acoustic wave device does not come into contact with the substrate, and is bonded to the substrate. ..
子と、それと接続される外部回路の入・出力部とのイン
ピーダンス整合回路を基板上に設けたことを特徴とする
請求項１記載の弾性表面波素子実装回路の製造方法。2. An impedance matching circuit for at least an input / output terminal of a surface acoustic wave element and an input / output section of an external circuit connected thereto is provided on a substrate. Method for manufacturing surface acoustic wave element mounted circuit.
縁性接着剤あるいは半田により基板と接着封止し、気密
を保持したことを特徴とする請求項１記載の弾性表面波
素子実装回路の製造方法。3. A method of manufacturing a surface acoustic wave element mounted circuit according to claim 1, wherein a lid made of ceramic or metal is adhered and sealed to the substrate with an insulating adhesive or solder to maintain airtightness. ..
波を防ぐため、前記弾性表面波素子の裏面に凹凸加工を
施したり、あるいは前記弾性表面波素子の裏面に吸音材
を設けたことを特徴とする請求項１記載の弾性表面波素
子実装回路の製造方法。4. In order to prevent unnecessary reflected waves from the back surface of the surface acoustic wave element on the substrate, the back surface of the surface acoustic wave element is processed to have irregularities, or a sound absorbing material is provided on the back surface of the surface acoustic wave element. The method for manufacturing a surface acoustic wave element mounted circuit according to claim 1, wherein
剤を用い、絶縁性接着剤としてシリコン系接着剤を用い
たことを特徴とする請求項１記載の弾性表面波素子実装
回路の製造方法。5. The method for manufacturing a surface acoustic wave element mounted circuit according to claim 1, wherein an epoxy adhesive is used as the conductive adhesive, and a silicon adhesive is used as the insulating adhesive. ..
た金またはアルミニウムからなるバンプを有し、素子の
周囲あるいはその一部に絶縁性接着剤を有する弾性表面
波素子と、他の能動素子あるいは受動素子とを、電極パ
タ−ンが形成された回路基板上に一体に集積化したこと
を特徴とする弾性表面波素子実装回路。6. A surface acoustic wave device having bumps made of gold or aluminum to which a conductive adhesive is transfer-coated on an electrode pad portion and having an insulating adhesive around the device or a part thereof, and another active surface acoustic wave device. A surface acoustic wave device mounting circuit, wherein an element or a passive element is integrally integrated on a circuit board on which an electrode pattern is formed.
子と、それと接続される外部回路の入・出力部とのイン
ピーダンス整合回路を回路基板上に、あるいは同一回路
基板上の他の素子の入・出力部とのインピーダンス整合
回路を前記回路基板上に設けたことを特徴とする請求項
６記載の弾性表面波素子実装回路。7. An impedance matching circuit of at least an input / output terminal of a surface acoustic wave element and an input / output section of an external circuit connected to the surface acoustic wave element, on a circuit board, or on another element on the same circuit board. 7. The surface acoustic wave element mounting circuit according to claim 6, wherein an impedance matching circuit for the input / output section is provided on the circuit board.
縁性接着剤あるいは半田により基板と接着封止し、気密
を保持したことを特徴とする請求項６記載の弾性表面波
素子実装回路。8. The surface acoustic wave element mounting circuit according to claim 6, wherein a lid made of ceramic or metal is adhered and sealed to the substrate with an insulating adhesive or solder to maintain airtightness.
波を防ぐため、前記弾性表面波素子の裏面に凹凸加工を
施したり、あるいは前記弾性表面波素子の裏面に吸音材
を設けたことを特徴とする請求項６記載の弾性表面波素
子実装回路。9. In order to prevent unnecessary reflected waves from the back surface of the surface acoustic wave element on the substrate, the back surface of the surface acoustic wave element is processed to have irregularities, or a sound absorbing material is provided on the back surface of the surface acoustic wave element. The surface acoustic wave device mounting circuit according to claim 6, wherein
着剤を用い、絶縁性接着剤としてシリコン系接着剤を用
いたことを特徴とする請求項６記載の弾性表面波素子実
装回路。10. The surface acoustic wave element mounted circuit according to claim 6, wherein an epoxy adhesive is used as the conductive adhesive and a silicon adhesive is used as the insulating adhesive.
はアルミニウムからなるバンプを形成し、さらに前記バ
ンプに導電性接着剤を転写塗布し、前記弾性表面波素子
と、電極パターンが形成された基板とを向い合わせ、位
置合わせを行なった後前記導電性接着剤を加熱硬化さ
せ、前記弾性表面波素子を前記基板に固着することによ
り導通を図り、さらに絶縁性接着剤により、前記弾性表
面波素子の櫛形電極部に前記絶縁性接着剤が接触しない
ようにして、周囲を覆うことにより前記弾性表面波素子
を保持するとともに、前記弾性表面波の櫛形電極部の気
密を保持したことを特徴とする弾性表面波素子実装回路
の製造方法。11. A bump made of gold or aluminum is formed on an electrode pad portion of a surface acoustic wave element, and a conductive adhesive is transfer-coated on the bump to form the surface acoustic wave element and an electrode pattern. After facing and aligning with the substrate, the conductive adhesive is heat-cured, and the surface acoustic wave element is fixed to the substrate to achieve conduction. The insulating adhesive does not come into contact with the comb-shaped electrode portion of the element, and the surface acoustic wave element is held by covering the periphery, and the comb-shaped electrode portion of the surface acoustic wave is kept airtight. Method for manufacturing surface acoustic wave device mounted circuit.
端子と、それと接続される外部回路の入・出力部とのイ
ンピーダンス整合回路を基板上に設けたことを特徴とす
る請求項１１記載の弾性表面波素子実装回路の製造方
法。12. An impedance matching circuit for at least an input / output terminal of a surface acoustic wave device and an input / output portion of an external circuit connected to the same, provided on a substrate. Method for manufacturing surface acoustic wave element mounted circuit.
射波を防ぐため、前記弾性表面波素子の裏面に凹凸加工
を施したり、あるいは前記弾性表面波素子の裏面に吸音
材を設けたことを特徴とする請求項１１記載の弾性表面
波素子実装回路の製造方法。13. In order to prevent unnecessary reflected waves from the back surface of the substrate of the surface acoustic wave element, the back surface of the surface acoustic wave element is processed to have irregularities, or a sound absorbing material is provided on the back surface of the surface acoustic wave element. The method for manufacturing a surface acoustic wave element mounted circuit according to claim 11,
着剤を用い、絶縁性接着剤としてシリコン系接着剤を用
いたことを特徴とする請求項１１記載の弾性表面波素子
実装回路の製造方法。14. A method of manufacturing a surface acoustic wave element mounted circuit according to claim 11, wherein an epoxy adhesive is used as the conductive adhesive, and a silicon adhesive is used as the insulating adhesive. ..
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9054892A JPH05291864A (en) | 1992-04-10 | 1992-04-10 | Sample-and hold circuit element mount circuit and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9054892A JPH05291864A (en) | 1992-04-10 | 1992-04-10 | Sample-and hold circuit element mount circuit and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05291864A true JPH05291864A (en) | 1993-11-05 |
Family
ID=14001472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9054892A Pending JPH05291864A (en) | 1992-04-10 | 1992-04-10 | Sample-and hold circuit element mount circuit and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05291864A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0736972A1 (en) * | 1995-04-03 | 1996-10-09 | Motorola, Inc. | Plastic encapsulated saw device and method |
| EP0896427A2 (en) * | 1997-08-05 | 1999-02-10 | Nec Corporation | Surface acoustic wave device |
| US6154940A (en) * | 1996-03-08 | 2000-12-05 | Matsushita Electric Industrial Co., Ltd. | Electronic part and a method of production thereof |
| US6369490B1 (en) * | 1999-04-28 | 2002-04-09 | Murata Manufacturing Co., Ltd | Surface acoustic wave device having bump electrodes |
| US6417026B2 (en) * | 1998-02-27 | 2002-07-09 | Tdk Corporation | Acoustic wave device face-down mounted on a substrate |
| JP2004156950A (en) * | 2002-11-05 | 2004-06-03 | Mitsubishi Materials Corp | Surface acoustic wave element module and method for manufacturing the same |
| US6754950B2 (en) * | 1995-06-30 | 2004-06-29 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
| US7854050B2 (en) * | 2007-10-12 | 2010-12-21 | Taiyo Yuden Co., Ltd. | Method of manufacturing a surface acoustic wave device |
| US8191228B2 (en) * | 2005-03-03 | 2012-06-05 | Seiko Epson Corporation | Package structure for surface acoustic wave device, and surface acoustic wave device |
-
1992
- 1992-04-10 JP JP9054892A patent/JPH05291864A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0736972A1 (en) * | 1995-04-03 | 1996-10-09 | Motorola, Inc. | Plastic encapsulated saw device and method |
| US6754950B2 (en) * | 1995-06-30 | 2004-06-29 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
| US6154940A (en) * | 1996-03-08 | 2000-12-05 | Matsushita Electric Industrial Co., Ltd. | Electronic part and a method of production thereof |
| EP0896427A2 (en) * | 1997-08-05 | 1999-02-10 | Nec Corporation | Surface acoustic wave device |
| US6417026B2 (en) * | 1998-02-27 | 2002-07-09 | Tdk Corporation | Acoustic wave device face-down mounted on a substrate |
| US6369490B1 (en) * | 1999-04-28 | 2002-04-09 | Murata Manufacturing Co., Ltd | Surface acoustic wave device having bump electrodes |
| JP2004156950A (en) * | 2002-11-05 | 2004-06-03 | Mitsubishi Materials Corp | Surface acoustic wave element module and method for manufacturing the same |
| US8191228B2 (en) * | 2005-03-03 | 2012-06-05 | Seiko Epson Corporation | Package structure for surface acoustic wave device, and surface acoustic wave device |
| US8513862B2 (en) | 2005-03-03 | 2013-08-20 | Seiko Epson Corporation | Surface acoustic wave device with reduced size and thickness |
| US7854050B2 (en) * | 2007-10-12 | 2010-12-21 | Taiyo Yuden Co., Ltd. | Method of manufacturing a surface acoustic wave device |
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