JPH0641745A - Vapor deposition method of aluminum on both surfaces of band-shaped substrate - Google Patents

Abstract

PURPOSE:To efficiently execute vapor deposition on both surfaces by drastically shortening the time for vapor deposition operation. CONSTITUTION:After the band-shaped substrate 12 is delivered from a feed tapered roller 18 in the state of inclining the band-shaped substrate at 45 deg. to a vapor deposition route above a target 6 to be evaporated by heating, the surface of the band-shaped substrate 12 is subjected to the vapor deposition, the band-shaped substrate 12 is twisted 90 deg. enroute in such a manner that the center of the twisted part is perpendicular. The rear surface 12b of the band- shaped substrate 12 is subjected to the vapor deposition in the state of inclining the band-shaped substrate 12 at 45 deg. opposite and the band-shaped substrate is received on a receiving tapered roller 19, by which both surfaces of the band- shaped substrate 12 are subjected to the vapor deposition at one time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for depositing aluminum on both sides of a strip-shaped substrate wound in a coil.

[0002]

2. Description of the Related Art Conventionally, a method for depositing aluminum on a strip-shaped substrate (thin plate coil material) wound in a coil shape is
As shown in FIG. 5, the feeding coil 41 to the strip-shaped substrate 4
2 is fed out and passed through a vapor deposition path above an aluminum target 44 which is electrically heated on a tungsten board 43 to be vaporized, and wound on a take-up reel 45 to vapor-deposit aluminum on one surface facing the aluminum target 44. When aluminum is vapor-deposited on both surfaces of the belt-shaped substrate 42, after the vapor deposition work on one side is completed, the vapor deposition path is extended and moved so that the remaining one side faces the aluminum target 44, and the vapor deposition work is repeated.

[0003]

However, in the above vapor deposition method, it takes time and labor to vapor deposit both surfaces, and the work efficiency is poor.

The present invention solves the above-mentioned problems and allows both sides to be vapor-deposited in a short time, and the vapor deposition work time can be greatly shortened, so that both sides can be vapor-deposited efficiently. The purpose is to provide.

[0005]

In order to solve the above-mentioned problems, the aluminum double-sided vapor deposition method for a strip-shaped substrate of the present invention is performed when the strip-shaped substrate is sent in the longitudinal direction on the vapor deposition path above the target to be heated and vaporized. The belt-shaped substrate is twisted in the range of 90 ° to 180 ° so that both surfaces face the target side.

[0006]

According to the above construction, on the vapor deposition path, for example, a strip-shaped substrate inclined 45 degrees from the upper left to the lower right in the traveling direction is twisted 90 degrees in the clockwise direction on the way to 45 from the upper right to the lower left. By tilting it at an angle, the surface facing the target can be inverted, and vapor deposition can be performed on both surfaces of the strip substrate at once. Also, by twisting the strip-shaped substrate along the horizontal plane 180 degrees midway and inverting the surface on the target side, vapor deposition can be performed on both sides of the strip-shaped substrate at one time.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of an aluminum double-sided vapor deposition apparatus according to the present invention will be described below with reference to FIGS. 1 and 2.

In FIG. 1, reference numeral 1 denotes a vapor deposition container having upper and lower exhaust ports 2, which are partitioned by a partition wall 3 into a lower evaporation chamber 4 and an upper material chamber 5, and the interior of the vapor deposition container 1 is 10 ^-4 to 10 ^-10.
It is kept in a vacuum atmosphere of ^-5 torr.

In the evaporation chamber 4, there is arranged a target container 8 in which aluminum as a target 6 is placed and heated and evaporated by a heater 7, and a shutter 9 capable of blocking aluminum vapor is provided above the target container 8. It is arranged to open and close freely.

In the material chamber 5, a material feeding device 13 for feeding a belt-shaped substrate 12 from a material roll 11 wound in a roll by being rotated in a direction of an arrow A by a rotation device (not shown), and a material feeding device. The belt-shaped substrate 12 having both surfaces vapor-deposited from the device 13 along the vapor-deposition window 14 formed on the partition wall 3 is rotated in the direction of arrow B by a rotation device (not shown) to move the product roll 15 to the product roll 15. A product winding device 16 to be formed is provided. A guide roller 17 and a feed taper roller 18 for guiding the strip-shaped substrate 12 fed from the material roll 11 are rotatably supported by the material feeding device 13 about a horizontal axis, and vapor deposition is performed on the product winding device 16. A receiving taper roller 19 and a guide roller 20 that receive the belt-shaped substrate 15 sent from the window 14 are rotatably supported around a horizontal axis.

The feed taper roller 18 and the receiving taper roller 19 are arranged point-symmetrically so that the taper angle is set to 45 degrees and the large diameter portion is in the opposite position. Further, the feed taper roller 18 side and the receiving taper roller are arranged. In FIG. 19, the strip-shaped substrate 12 is twisted by 90 degrees so that the strip-shaped substrate 12 is vertical at the center. For example, as shown in FIG. 2A, the belt-shaped substrate 1 inclined by α = 45 degrees from the upper left to the lower right in the traveling direction by the feed taper roller 18.
2 is twisted clockwise by 90 degrees so that it becomes vertical in the middle as shown in FIG. 2 (b), and is tilted from upper right to lower left by β = 45 degrees as shown in FIG. 2 (c). The bottom surface exposed to steam can be inverted.

In the above structure, the material feeding device 13
The strip-shaped substrate 12 in an inclined state fed out from the material roll 11 through the guide roller 17 and the feed taper roller 18 in the direction of arrow C by the target 12 with the surface 12a facing downward in the first half of the vapor deposition path along the vapor deposition window 14. Container 8
Exposed to aluminum vapor evaporated from the surface 12a
An aluminum layer Al ₁ is vapor-deposited on the
By being twisted once, the back surface 1 of the strip substrate 12 is turned
2b is exposed to aluminum vapor and aluminum layer Al ₂
Is deposited. Then, it is guided by the receiving taper roller 19 and the guide roller 20 and is wound around the product roll 15.

According to the above structure, aluminum vapor can be vapor-deposited on the front surface 12a and the back surface 12b of the belt-shaped substrate 12 by a single vapor deposition operation, and the twisting angle is as small as 90 degrees. 12
Can also be applied to. The twist angle of the strip substrate 12 is 90.
Although vapor deposition on both surfaces is possible even at a temperature of less than 100 degrees, vapor deposition efficiency becomes low because the inclination angles α and β of the strip substrate 12 exposed to aluminum vapor become large.

FIGS. 3 and 4 show a second embodiment of the aluminum double-sided vapor deposition apparatus. The same members as those in the first embodiment are designated by the same reference numerals and their description is omitted. In this second embodiment, the strip substrate 1
2 is twisted by 180 degrees, and since the strip-shaped material 12 is exposed to aluminum vapor in a horizontal state, vapor deposition can be performed extremely efficiently. That is, the feed taper roller 18 of the material feeding device 13 of the first embodiment and the receiving taper roller 19 of the product winding device 16 are changed to the feeding parallel roller 31 and the receiving parallel roller 32, respectively.
As shown in FIG. 4, the strip-shaped substrate 12 unrolled from the receiving taper roller 19 is horizontally held in the first half of the vapor deposition path along the vapor deposition window 14 and the aluminum layer Al ₁ is vapor-deposited on the surface 12a thereof, and further in the center. The strip-shaped substrate 12 is turned upside down by being twisted by 180 degrees at the section, and the aluminum layer Al ₂ is deposited on the back surface 12b of the strip-shaped substrate 12 held horizontally.

Therefore, according to the second embodiment, the strip-shaped substrate 12 is exposed to the aluminum vapor in a horizontal state on both the front surface 12a and the rear surface 12b in the vapor deposition path above the target container 8 so that the vapor deposition on both surfaces is effectively performed. It can be performed.

[0016]

As described above, according to the present invention, since the strip-shaped substrate is twisted in the range of 90 to 180 degrees on the vapor deposition path to expose both sides to the target side, both sides of the strip-shaped substrate are vapor-deposited at one time. It is possible to perform the vapor deposition efficiently by significantly reducing the vapor deposition work time.

[Brief description of drawings]

FIG. 1 is a first double sided aluminum deposition apparatus according to the present invention.
It is a front sectional view showing the composition of an example.

FIG. 2 shows a posture of a belt-shaped substrate on a vapor deposition path in the aluminum double-sided vapor deposition apparatus, (a) of which is II shown in FIG.
2 is an end view, FIG. 1B is an end view taken along the line II-II shown in FIG. 1, and FIG. 3C is a end view taken along the line III-III shown in FIG.

FIG. 3 is a second aluminum double-sided vapor deposition apparatus according to the present invention.
It is a front sectional view showing the composition of an example.

FIG. 4 shows a posture of a strip-shaped substrate on a vapor deposition path in the aluminum double-sided vapor deposition apparatus, and (a) shows IV-IV shown in FIG.
3 is an end view, FIG. 3B is a V-V end view shown in FIG. 3, and FIG. 3C is a VI-VI end view shown in FIG.

FIG. 5 is a schematic configuration diagram illustrating a conventional vapor deposition method.

[Explanation of symbols]

 1 Vapor Deposition Container 4 Evaporation Chamber 5 Material Chamber 6 Target 7 Heater 8 Target Container 9 Shutter 11 Material Roll 12 Band Substrate 13 Material Feeding Device 14 Vapor Deposition Window 15 Product Roll 16 Product Winding Device 17 Guide Roller 18 Feed Taper Roller 19 Receiving Taper Roller 20 Guide roller 31 Feed parallel roller 32 Receiver parallel roller

Claims (1)

[Claims] 1. When the strip-shaped substrate is sent out in the lengthwise direction on the vapor deposition path above the target to be heated and vaporized, the strip-shaped substrate is twisted in the range of 90 ° to 180 ° so that both sides face the target side. A double-sided aluminum vapor deposition method on a strip substrate.