JPS59228743A - Ic module for ic card - Google Patents
Ic module for ic cardInfo
- Publication number
- JPS59228743A JPS59228743A JP58102906A JP10290683A JPS59228743A JP S59228743 A JPS59228743 A JP S59228743A JP 58102906 A JP58102906 A JP 58102906A JP 10290683 A JP10290683 A JP 10290683A JP S59228743 A JPS59228743 A JP S59228743A
- Authority
- JP
- Japan
- Prior art keywords
- card
- module
- chip
- static electricity
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 20
- 239000011241 protective layer Substances 0.000 claims description 7
- 230000005611 electricity Effects 0.000 abstract description 15
- 230000003068 static effect Effects 0.000 abstract description 15
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 8
- 239000011162 core material Substances 0.000 abstract description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052799 carbon Inorganic materials 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 abstract 1
- 230000006378 damage Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000013201 Stress fracture Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、識別カードなどのＩＣカードに用いるＩＣモ
ジュールに関し、特にＩＣカート“の帯電による静電破
壊を防止できるＩＣカード用ＩＣモジュールに関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an IC module used for an IC card such as an identification card, and more particularly to an IC module for an IC card that can prevent electrostatic damage due to charging of an IC cart.
磁気などの外界からの撹乱を受けず、他人が内容を読み
取ることが極めて困カ１ｔであり、信頼性が高く、さら
に記憶容量も磁気ストライプに比べ数１０〜１００倍と
多いので識別カードなどには最近磁気カードに代ってＩ
Ｃカードが用いられるようになった。ＩＣカート９を製
作するに当っては第１図に示す如く基板ｌにＩＣチップ
２を装着したＩＣモジュール３をカード素材４に予め設
けられた凹所５に嵌装して組み立てる。It is not subject to disturbance from the outside world such as magnetism, making it extremely difficult for others to read its contents, and is highly reliable.Furthermore, the storage capacity is several tens to hundreds of times larger than that of a magnetic stripe, so it can be used for identification cards, etc. has recently replaced magnetic cards.
C cards are now used. To manufacture the IC cart 9, as shown in FIG. 1, an IC module 3 having an IC chip 2 mounted on a substrate 1 is assembled by fitting it into a recess 5 previously provided in a card material 4.
ＩＣモジュール３の製造過程の例を説明すれば、先ずプ
ラスチック製の基板ｌの所定の位置ζこ外部端子６と、
この外部端子６の裏イ１１０の位置にリード７を設け、
両者の間をスルーホール８により電気的に接続する。To explain an example of the manufacturing process of the IC module 3, first, the external terminal 6 is placed at a predetermined position ζ on the plastic substrate l,
A lead 7 is provided at a position 110 on the back side of this external terminal 6,
A through hole 8 electrically connects the two.
次に基板ｌの裏面のほぼ中央にＩＣチップを固定し、Ｉ
Ｃチップ２のパッド９とリート９７の１８１をワイヤｌ
Ｏにより接続してボンディングを行なう。Next, the IC chip is fixed approximately in the center of the back surface of the board l, and
Connect pad 9 of C chip 2 and 181 of lead 97 to wire l.
Bonding is performed by connecting through O.
その後絶縁性封止樹脂により保楯層１１を形成してＩＣ
モジュール３が完成する。After that, a protective shield layer 11 is formed using an insulating sealing resin to seal the IC.
Module 3 is completed.
一方、ＩＣカードのカート９素材４に予め設けられた凹
所５に接着性のある充填材を入れたところに、完成した
ＩＣモジュール３を嵌装する。充填材は充填層１２とし
て空所を充填し、かつカード素材４に密着し、ＩＣカー
ドが完成する。又は、カード素材に嵌合部を設け、ＩＣ
モジュールを嵌合後表裏よりシート等でサンドイッチし
カード化する。On the other hand, the completed IC module 3 is fitted into the recess 5 previously provided in the IC card cart 9 material 4, into which an adhesive filler is filled. The filler fills the void as a filler layer 12 and adheres closely to the card material 4, completing the IC card. Alternatively, a mating part is provided on the card material, and the IC
After the modules are fitted, they are sandwiched with sheets etc. from the front and back to form a card.
このようなＩＣモジュールを装着したＩＣカードは常に
身につけられるものであり、ＩＣ，ＬＳＩは非常に小型
であるため、カードに埋没させたＩＣモジュールはカー
ドの帯電や外部の静電気の影響により回路が破壊される
可能性がある。IC cards equipped with such IC modules are always carried on the body, and since ICs and LSIs are very small, the circuitry of IC modules embedded in the card may be affected by the charge on the card or external static electricity. It may be destroyed.
しかし今後磁気カート°と同じようにクレジットカート
９やバンキングカードとして大量普及することが想定さ
れ、その場合には所持者の衣服等との摩擦による静電気
の発生によるクレームが充分に考えられる。人体等に発
生するＫｆ’ ＆気は非常に高く、ＩＣカードに内蔵さ
れているＩＣ，、ＬＳＩに対しその回路の静電破壊等の
悪影響を与える。However, it is expected that in the future they will be widely used as credit carts 9 and banking cards in the same way as magnetic carts, and in that case it is highly likely that complaints will arise due to the generation of static electricity due to friction with the wearer's clothing. The Kf'& qi generated in the human body is extremely high and has an adverse effect on ICs and LSIs built into IC cards, such as electrostatic damage to their circuits.
すなわち、ＩＣカードに部分的に発生した静電気が、Ｉ
Ｃとの間の絶縁体の耐圧を超えて絶縁破壊し、ＩＣを破
壊する。In other words, the static electricity generated partially on the IC card is
The voltage exceeds the withstand voltage of the insulator between the IC and the IC, resulting in dielectric breakdown and destruction of the IC.
このように従来のＩＣカードは静電気に対しては無防備
であり、ＩＣカードの普及に伴ない、どのような取扱い
を受けるかもしれず、静電気による障害を防止できない
欠点があった。As described above, conventional IC cards are vulnerable to static electricity, and as IC cards become more widespread, they may be handled in any way and have the disadvantage that they cannot prevent damage caused by static electricity.
本発明は以上のような従来の欠点を解消し、ＩＣカード
に発生した静電気によりＩＣデバイスが破壊されるのを
防止できるようにしたＩＣカード用ＩＣモジュールを提
供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide an IC module for an IC card that eliminates the above-mentioned conventional drawbacks and can prevent IC devices from being destroyed by static electricity generated in the IC card.
本発明は、基板の所定の位置に端子を、該端子の裏側の
位置にリードを設け、両者の間をスルーホールにより接
続し、前記基板の裏面にＩＣチップを固定し、ＩＣチッ
プのパッドとリードの間全接続してボンディングし、絶
縁性プラスチックにより保護層を形成したＩＣカード用
ＩＣモジュールにおいて、前記保護層を被う導電層を形
成したことを特徴とするＩＣカード用ＩＣモジュールで
ある。The present invention provides a terminal at a predetermined position on a substrate, a lead at a position on the back side of the terminal, connects them through a through hole, fixes an IC chip on the back side of the substrate, and connects the pad of the IC chip with the lead. An IC module for an IC card in which all leads are connected and bonded and a protective layer is formed of an insulating plastic, characterized in that a conductive layer is formed to cover the protective layer.
本発明の一実施例を第２図に示す。ｌは基板、２はＩＣ
チップ、６は外部端子、７はＩＪ−）”、８はスルーホ
ール、９はパッド、１０はボンディングのワイヤ、１３
は絶縁性プラスチックの保護層、１４は導電層である。An embodiment of the present invention is shown in FIG. l is the board, 2 is the IC
chip, 6 is an external terminal, 7 is IJ-)'', 8 is a through hole, 9 is a pad, 10 is a bonding wire, 13
14 is a protective layer made of insulating plastic, and 14 is a conductive layer.
導電層１４は、導電性樹脂を素材としてプラスチックの
絶縁層１３全体を被うように形成する。The conductive layer 14 is made of conductive resin and is formed to cover the entire plastic insulating layer 13 .
導電性樹脂としては例えばカーボン、′銅粉、銀を練り
込んだ樹脂を使用すればよい。また、金属薄膜を蒸着な
どの方法により保護層１３に形成してもよい。As the conductive resin, for example, a resin kneaded with carbon, copper powder, or silver may be used. Further, a metal thin film may be formed on the protective layer 13 by a method such as vapor deposition.
このようなＩＣモジュールをＩＣカードに装着した状態
を第３図に示す。１５はコア材、１６はオーバーレイフ
ィルムである。FIG. 3 shows a state in which such an IC module is mounted on an IC card. 15 is a core material, and 16 is an overlay film.
このようにＩＣカードにした場合、ＩＣカート９に静電
気が発生しても導電層１４によりＩＣモジュールは静電
じゃへいされ、ＩＣチップ２は静電破壊されない。When used as an IC card in this manner, even if static electricity is generated in the IC cart 9, the IC module is protected from static electricity by the conductive layer 14, and the IC chip 2 is not damaged by static electricity.
この場合に絶縁層１３を形成する合成樹脂および導電層
１４を形成する樹脂を硬質樹脂と軟質樹脂の組み合わせ
とすることにより、応力破壊を防止することもできる。In this case, stress fracture can also be prevented by using a combination of hard resin and soft resin as the synthetic resin forming the insulating layer 13 and the resin forming the conductive layer 14.
本発明の他の実施例を第４図に示す。第２図の実施例に
シールド９用端子１７を付加したものであり、導電層１
４とシールド用端子１７とはスルーホール１８によって
接続されている。Another embodiment of the invention is shown in FIG. A terminal 17 for the shield 9 is added to the embodiment shown in FIG. 2, and the conductive layer 1
4 and the shield terminal 17 are connected through a through hole 18.
第５図、第６図は、第４図の実施例をカード化したもの
である。コア材１５とオーバーレイフィルム１６の間に
導電層１９を設けたものである。5 and 6 are card versions of the embodiment shown in FIG. 4. A conductive layer 19 is provided between the core material 15 and the overlay film 16.
該導電層１９は導電性インキで印刷することにより、シ
ールｒ片端子１７からＩＣカードの側端面に至り、側端
面に露出するように設ける。The conductive layer 19 is printed with conductive ink to extend from the seal r piece terminal 17 to the side end surface of the IC card and is provided so as to be exposed on the side end surface.
あるいは透明の導電性インキでカー１の全面に印刷（は
夕刷）してもよいし、着色の導電性インキでカードの全
面に地紋、網目等の導通できる模様を印刷してもよい。Alternatively, transparent conductive ink may be printed on the entire surface of the card 1, or colored conductive ink may be used to print a conductive pattern such as a ground pattern or mesh on the entire surface of the card.
このようにすることによりＩＣモジュールが静電しやへ
いされると共に、カードに部分的に発生した静電気は導
電層１９を通して流れ、カードの側端面に露出した導電
層１９の末端から外部へ流出し、カード全体が同電位に
保たれるから発生した静電気がＩＣに流れ込むこともな
い。By doing this, the IC module is protected from static electricity, and the static electricity generated locally on the card flows through the conductive layer 19 and flows out from the end of the conductive layer 19 exposed on the side edge surface of the card. Since the entire card is kept at the same potential, static electricity generated does not flow into the IC.
本発明は、ＩＣカート′の帯電によるＩＣの静電破壊を
効果的に防止でき、従来のＩＣモジュールと比較して体
積は増加しないので、ＩＣカート９にコンパクトに実装
でき、実用上極めて大なる効果を奏する。The present invention can effectively prevent electrostatic damage to ICs caused by charging of the IC cart', and since the volume does not increase compared to conventional IC modules, it can be compactly mounted on the IC cart 9, and is extremely large in practical use. be effective.
第１図は従来のＩＣカードの部分断面図、第２図は本発
明の一実施例の断面図、第３図は第２図の実施例を装着
したＩＣカードの断面図、第４図は本発明の他の実施例
の断面図、第５図は第４図の実施例を装着したＩＣカー
ト９の断面図、第６図は同正面図である。
１・・・・・・基板、２・・・・・・ＩＣチップ−３・
・・・・・ＩＣモジュール、４・・・・・・カート９素
材、５・・・・・・凹所、６・・・・・・外部端子、７
・・・・・・＋）−ｙ、ｓ・・・・・・スルーホール、
９・・・・・・パッド、１０・・・・・・ワイヤ、１１
・・・・・・保護層、１２・・・・・・充填層、１３・
・・・・・絶縁層、１４・・・・・・導電層、１５・・
・・・・コア材、１６・・・・・・オーバーレイフィル
ム、１７−・−・・・シールド９用端子、１８・・・・
・・スルーホール、１９・・・・・・導電層。
特許出願人 共同印刷株式会社
代理人弁理士 千 １） 捻回 弁理士
丸 山 隆 夫FIG. 1 is a partial sectional view of a conventional IC card, FIG. 2 is a sectional view of an embodiment of the present invention, FIG. 3 is a sectional view of an IC card equipped with the embodiment of FIG. A sectional view of another embodiment of the present invention, FIG. 5 is a sectional view of the IC cart 9 equipped with the embodiment of FIG. 4, and FIG. 6 is a front view of the same. 1... Board, 2... IC chip-3.
...IC module, 4 ... Cart 9 Material, 5 ... Recess, 6 ... External terminal, 7
・・・・・・+)-y, s・・・Through hole,
9...Pad, 10...Wire, 11
...Protective layer, 12...Filled layer, 13.
...Insulating layer, 14...Conductive layer, 15...
... Core material, 16 ... Overlay film, 17 - ... Terminal for shield 9, 18 ...
...Through hole, 19... Conductive layer. Patent applicant Kyodo Printing Co., Ltd. Representative Patent Attorney 11) Twisting Patent Attorney
Takao Maruyama
Claims (1)
リート′を設け、両者の間をスルーホールにより接続し
、前記基板の裏面にＩＣチップを固定し、ＩＣチップの
パッドとリードの間を接続してボンディングし、絶縁性
プラスチックにより保護層を形成したＩＣカード用ＩＣ
モジュールにおいて、前記保護層を被う導電層を形成し
たことを特徴とするＩＣカード用ＩＣモジュール。 ２、前記導電層を前記端子のうちシールド用端子に接続
したことを特徴とする特許請求の範囲第１項記載のＩＣ
カート９用ＩＣモジユール。[Scope of Claims] (2) A terminal is provided at a predetermined position on the board, a LEAT is provided at the back side of the terminal, a through hole is used to connect the two, and an IC chip is fixed to the back side of the board; An IC for IC cards in which the pads and leads of the IC chip are connected and bonded, and a protective layer is formed using insulating plastic.
An IC module for an IC card, characterized in that the module includes a conductive layer covering the protective layer. 2. The IC according to claim 1, wherein the conductive layer is connected to a shielding terminal among the terminals.
IC module for Cart 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58102906A JPS59228743A (en) | 1983-06-10 | 1983-06-10 | Ic module for ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58102906A JPS59228743A (en) | 1983-06-10 | 1983-06-10 | Ic module for ic card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59228743A true JPS59228743A (en) | 1984-12-22 |
| JPH0334658B2 JPH0334658B2 (en) | 1991-05-23 |
Family
ID=14339902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58102906A Granted JPS59228743A (en) | 1983-06-10 | 1983-06-10 | Ic module for ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59228743A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6339580U (en) * | 1986-09-02 | 1988-03-14 | ||
| US4849617A (en) * | 1986-03-17 | 1989-07-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor card which can be folded |
| US5122860A (en) * | 1987-08-26 | 1992-06-16 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device and manufacturing method thereof |
| DE4126874C1 (en) * | 1991-08-14 | 1992-08-13 | Orga Kartensysteme Gmbh, 6072 Dreieich, De | |
| US5278580A (en) * | 1991-02-06 | 1994-01-11 | Rohm Co., Ltd. | Thermal head |
| JPH06183189A (en) * | 1992-12-21 | 1994-07-05 | Toppan Printing Co Ltd | Ic module for ic card |
| US5526233A (en) * | 1991-12-19 | 1996-06-11 | Casio Computer Co., Ltd. | Adapter for integrated circuit device, and data transmission system using the same |
| US5544014A (en) * | 1992-08-12 | 1996-08-06 | Oki Electric Industry Co., Ltd. | IC card having a built-in semiconductor integrated circuit device |
| US5559370A (en) * | 1993-10-08 | 1996-09-24 | Gay Freres Vente Et Exportation S.A. | Electronic label and carriers therefor |
| US5637858A (en) * | 1993-12-23 | 1997-06-10 | Giesecke & Devrient Gmbh | Method for producing identity cards |
| JP2003526216A (en) * | 2000-03-10 | 2003-09-02 | シュラムバーガー システムズ | Reinforced integrated circuit |
| US11829826B2 (en) | 2016-07-27 | 2023-11-28 | Composecure, Llc | RFID device |
| US12086669B2 (en) | 2017-10-18 | 2024-09-10 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US12093772B2 (en) | 2018-01-30 | 2024-09-17 | Composecure, Llc | DI capacitive embedded metal card |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5660098A (en) * | 1979-10-23 | 1981-05-23 | Hokushin Electric Works | Method of electrostatically shielding electronic circuit |
-
1983
- 1983-06-10 JP JP58102906A patent/JPS59228743A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5660098A (en) * | 1979-10-23 | 1981-05-23 | Hokushin Electric Works | Method of electrostatically shielding electronic circuit |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4849617A (en) * | 1986-03-17 | 1989-07-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor card which can be folded |
| JPS6339580U (en) * | 1986-09-02 | 1988-03-14 | ||
| US5122860A (en) * | 1987-08-26 | 1992-06-16 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device and manufacturing method thereof |
| US5278580A (en) * | 1991-02-06 | 1994-01-11 | Rohm Co., Ltd. | Thermal head |
| DE4126874C1 (en) * | 1991-08-14 | 1992-08-13 | Orga Kartensysteme Gmbh, 6072 Dreieich, De | |
| EP0527437A2 (en) * | 1991-08-14 | 1993-02-17 | ORGA Kartensysteme GmbH | Record carrier with integrated circuit |
| US5526233A (en) * | 1991-12-19 | 1996-06-11 | Casio Computer Co., Ltd. | Adapter for integrated circuit device, and data transmission system using the same |
| US5544014A (en) * | 1992-08-12 | 1996-08-06 | Oki Electric Industry Co., Ltd. | IC card having a built-in semiconductor integrated circuit device |
| JPH06183189A (en) * | 1992-12-21 | 1994-07-05 | Toppan Printing Co Ltd | Ic module for ic card |
| US5559370A (en) * | 1993-10-08 | 1996-09-24 | Gay Freres Vente Et Exportation S.A. | Electronic label and carriers therefor |
| US5637858A (en) * | 1993-12-23 | 1997-06-10 | Giesecke & Devrient Gmbh | Method for producing identity cards |
| JP2003526216A (en) * | 2000-03-10 | 2003-09-02 | シュラムバーガー システムズ | Reinforced integrated circuit |
| US11829826B2 (en) | 2016-07-27 | 2023-11-28 | Composecure, Llc | RFID device |
| US12079681B2 (en) | 2016-07-27 | 2024-09-03 | Composecure, Llc | RFID device |
| US12086669B2 (en) | 2017-10-18 | 2024-09-10 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US12093772B2 (en) | 2018-01-30 | 2024-09-17 | Composecure, Llc | DI capacitive embedded metal card |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0334658B2 (en) | 1991-05-23 |
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