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US20020046826A1 - CPU cooling structure - Google Patents

CPU cooling structure Download PDF

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Publication number
US20020046826A1
US20020046826A1 US09/982,016 US98201601A US2002046826A1 US 20020046826 A1 US20020046826 A1 US 20020046826A1 US 98201601 A US98201601 A US 98201601A US 2002046826 A1 US2002046826 A1 US 2002046826A1
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United States
Prior art keywords
cpu
heat sink
axial flow
center shaft
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/982,016
Inventor
Chao-Chih Kao
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Individual
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Individual
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Filing date
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Publication of US20020046826A1 publication Critical patent/US20020046826A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a CPU cooling structure adapted to lower the temperature of the CPU of a computer during its operation and, more particularly, to such a CPU cooling structure, which enables induced currents of air to pass toward the CPU and the surrounding electronic component parts to quickly dissipate heat from the CPU and the surrounding electronic component parts.
  • FIG. 13 shows a heat sink for use with a fan in a computer to dissipate heat from the CPU.
  • This structure of heat sink A comprises a flat base A 1 and a plurality of upright radiation fins A 11 arranged in parallel on the top side of the flat base A 1 .
  • the axial flow of air induced by the axial flow fan is stopped by the flat base A 1 of the heat sink A and forced sideways, i.e., the axial flow of air does not pass to the CPU and the surrounding electronic component parts. Due to this problem, the heat dissipation efficiency of the heat sink A is low.
  • the present invention has been accomplished to provide a CPU cooling structure, which eliminates the aforesaid drawbacks.
  • the CPU cooling structure comprises a heat sink and an axial flow fan.
  • the heat sink has a center shaft disposed in contact with the CPU to be cooled down and a plurality of radiation fins equiangularly radially arranged around the periphery of the center shaft.
  • the radiation fins may be curved in direction corresponding or reversed to the direction of rotation of the fan blade and hub assembly of the axial flow fan.
  • the center shaft of the heat sink can be made having a hollow structure filled with a heat transfer fluid for quick transfer of heat from the CPU to the radiation fins.
  • FIG. 1 is an elevational view of a heat sink for a CPU cooling structure according to a first embodiment of the present invention.
  • FIG. 2 is a side view in section of the heat sink shown in FIG. 1.
  • FIG. 3 is an exploded view of the CPU cooling structure according to the first embodiment of the present invention.
  • FIG. 4 is an installed view of FIG. 3.
  • FIG. 5 is a side view in section of FIG. 4.
  • FIG. 6 is a schematic drawing showing radiation fins of the heat sink curved in direction reversed to the direction of rotation of the axial flow fan according to the first embodiment of the present invention.
  • FIG. 7 is an exploded view of the CPU cooling structure according to the second embodiment of the present invention.
  • FIG. 8 is an installed view of the second embodiment of the present invention.
  • FIG. 9 is a schematic drawing showing radiation fins of the heat sink curved in direction corresponding to the direction of rotation of the axial flow fan according to the second embodiment of the present invention.
  • FIG. 10 is an installed view of the CPU cooling structure according to the third embodiment of the present invention.
  • FIG. 11 is a side view in section of FIG. 10.
  • FIG. 12 is a schematic drawing showing radiation fins of the heat sink curved in direction reversed to the direction of rotation of the axial flow fan according to the third embodiment of the present invention.
  • FIG. 13 is an elevational view of a heat sink according to the prior art.
  • a heat sink 1 comprising a hollow center shaft 11 , an enclosed fluid chamber 111 defined in the center shaft 11 , a heat transfer fluid 113 filled in the enclosed fluid chamber 111 , and a plurality of radiation fins 12 radially arranged around the periphery of the center shaft 11 .
  • the center shaft 11 has a flat bottom contact surface 112 .
  • the heat sink 1 is used with an axial flow fan 2 to cool the temperature of the CPU 31 in a motherboard 3 .
  • Tie screws 4 are mounted in respective mounting holes 21 of axial flow fan 2 and threaded into gaps 121 in between the radiation fins 12 to secure the axial flow fan 2 to the top side of the heat sink 1 .
  • the flat bottom contact surface 112 of the hollow center shaft 11 of the heat sink 1 is disposed in contact with the top surface of the CPU 31 .
  • the radiation fin 12 of the heat sink 1 are smoothly arched and radially curved in direction reverse to the direction of rotation of the fan blade and hub assembly 22 of the axial flow fan 2 .
  • FIGS. from 7 through 9 show an alternate form of the present invention.
  • the radiation fins 12 are smoothly arched and radially curved in direction corresponding to the direction of rotation of the fan blade and hub assembly 22 of the axial flow fan 2 .
  • heat is transferred in proper order from the CPU 31 to the flat bottom contact surface 112 of the hollow center shaft 11 , the heat transfer fluid 113 , and the radiation fins 12 , and at the same time the axial flow of air induced by the axial flow fan 2 continuously passes through the gaps 121 in between the radiation fins 12 toward the top surface of the CPU 31 and the surrounding electronic component parts 32 to quickly dissipate heat from the heat sink 1 , the CPU 31 , and the surrounding electronic component parts 32 .
  • FIGS. from 10 through 12 show another alternate form of the present invention.
  • the center shaft 11 of the heat sink 1 is a solid shaft
  • the radiation fins 12 are smoothly arched and radially curved in direction reversed to the direction of rotation of the fan blade and hub assembly 22 of the axial flow fan 2 .
  • heat is transferred from the CPU 31 to the solid center shaft 11 and then the radiation fins 12 , and at the same time the axial flow of air induced by the axial flow fan 2 continuously passes through the gaps 121 in between the radiation fins 12 toward the top surface of the CPU 31 and the surrounding electronic component parts 32 to quickly dissipate heat from the heat sink 1 , the CPU 31 , and the surrounding electronic component parts 32 .
  • FIGS. 1 ⁇ 12 A prototype of heat sink has been constructed with the features of the annexed drawings of FIGS. 1 ⁇ 12 .
  • the heat sink functions smoothly to provide all of the features discussed earlier.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A CPU cooling structure includes a heat sink and an axial flow fan adapted to dissipate heat from the CPU of the motherboard in a computer, the heat sink having a hollow center shaft filled up with a heat transfer fluid and a plurality of radiation fins equiangularly radially arranged around the periphery of the center shaft and curved in direction corresponding or reversed to the direction of rotation of the fan blade and hub assembly of the axial flow fan.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to a CPU cooling structure adapted to lower the temperature of the CPU of a computer during its operation and, more particularly, to such a CPU cooling structure, which enables induced currents of air to pass toward the CPU and the surrounding electronic component parts to quickly dissipate heat from the CPU and the surrounding electronic component parts. [0001]
  • Advanced CPUs (central processing units) provide a high operational speed, and simultaneously produce a high temperature during its operation. In order to keep the CPU of the motherboard to function normally, a CPU cooling structure is needed. High performance and low manufacturing cost are important factors in designing a CPU cooling structure. FIG. 13 shows a heat sink for use with a fan in a computer to dissipate heat from the CPU. This structure of heat sink A comprises a flat base A[0002] 1 and a plurality of upright radiation fins A11 arranged in parallel on the top side of the flat base A1. When used with an axial flow fan, the axial flow of air induced by the axial flow fan is stopped by the flat base A1 of the heat sink A and forced sideways, i.e., the axial flow of air does not pass to the CPU and the surrounding electronic component parts. Due to this problem, the heat dissipation efficiency of the heat sink A is low.
    • SUMMARY OF THE INVENTION
  • The present invention has been accomplished to provide a CPU cooling structure, which eliminates the aforesaid drawbacks. According to one aspect of the present invention, the CPU cooling structure comprises a heat sink and an axial flow fan. The heat sink has a center shaft disposed in contact with the CPU to be cooled down and a plurality of radiation fins equiangularly radially arranged around the periphery of the center shaft. The radiation fins may be curved in direction corresponding or reversed to the direction of rotation of the fan blade and hub assembly of the axial flow fan. During operation, the induced axial flow of air passes through the gaps in between the radiation fins of the heat sink toward the CPU and the surrounding electronic component parts to dissipate heat from the CPU and the surrounding electronic component parts. According to another aspect of the present invention, the center shaft of the heat sink can be made having a hollow structure filled with a heat transfer fluid for quick transfer of heat from the CPU to the radiation fins.[0003]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an elevational view of a heat sink for a CPU cooling structure according to a first embodiment of the present invention. [0004]
  • FIG. 2 is a side view in section of the heat sink shown in FIG. 1. [0005]
  • FIG. 3 is an exploded view of the CPU cooling structure according to the first embodiment of the present invention. [0006]
  • FIG. 4 is an installed view of FIG. 3. [0007]
  • FIG. 5 is a side view in section of FIG. 4. [0008]
  • FIG. 6 is a schematic drawing showing radiation fins of the heat sink curved in direction reversed to the direction of rotation of the axial flow fan according to the first embodiment of the present invention. [0009]
  • FIG. 7 is an exploded view of the CPU cooling structure according to the second embodiment of the present invention. [0010]
  • FIG. 8 is an installed view of the second embodiment of the present invention. [0011]
  • FIG. 9 is a schematic drawing showing radiation fins of the heat sink curved in direction corresponding to the direction of rotation of the axial flow fan according to the second embodiment of the present invention. [0012]
  • FIG. 10 is an installed view of the CPU cooling structure according to the third embodiment of the present invention. [0013]
  • FIG. 11 is a side view in section of FIG. 10. [0014]
  • FIG. 12 is a schematic drawing showing radiation fins of the heat sink curved in direction reversed to the direction of rotation of the axial flow fan according to the third embodiment of the present invention. [0015]
  • FIG. 13 is an elevational view of a heat sink according to the prior art.[0016]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIGS. 1 and 2, a [0017] heat sink 1 is shown comprising a hollow center shaft 11, an enclosed fluid chamber 111 defined in the center shaft 11, a heat transfer fluid 113 filled in the enclosed fluid chamber 111, and a plurality of radiation fins 12 radially arranged around the periphery of the center shaft 11. The center shaft 11 has a flat bottom contact surface 112.
  • Referring to FIGS. 3 and 4 and FIG. 2 again, the [0018] heat sink 1 is used with an axial flow fan 2 to cool the temperature of the CPU 31 in a motherboard 3. Tie screws 4 are mounted in respective mounting holes 21 of axial flow fan 2 and threaded into gaps 121 in between the radiation fins 12 to secure the axial flow fan 2 to the top side of the heat sink 1. The flat bottom contact surface 112 of the hollow center shaft 11 of the heat sink 1 is disposed in contact with the top surface of the CPU 31. Further, the radiation fin 12 of the heat sink 1 are smoothly arched and radially curved in direction reverse to the direction of rotation of the fan blade and hub assembly 22 of the axial flow fan 2.
  • Referring to FIGS. 5 and 6 and FIG. 4 again, during operation of the [0019] CPU 31, heat is transferred from the CPU 31 to the heat transfer fluid 113 through the flat bottom contact surface 112 of the hollow center shaft 11 of the heat sink 1, and then quickly transferred from the heat transfer fluid 113 to the radiation fins 12, the axial flow of air induced by the axial flow fan 2 continuously passes through the gaps 121 in between the radiation fins 12 toward the top surface of the CPU 31 and the surrounding electronic component parts 32 to quickly dissipate heat from the heat sink 1, the CPU 31, and the surrounding electronic component parts 32.
  • FIGS. from [0020] 7 through 9 show an alternate form of the present invention. According to this alternate form, the radiation fins 12 are smoothly arched and radially curved in direction corresponding to the direction of rotation of the fan blade and hub assembly 22 of the axial flow fan 2. During operation, heat is transferred in proper order from the CPU 31 to the flat bottom contact surface 112 of the hollow center shaft 11, the heat transfer fluid 113, and the radiation fins 12, and at the same time the axial flow of air induced by the axial flow fan 2 continuously passes through the gaps 121 in between the radiation fins 12 toward the top surface of the CPU 31 and the surrounding electronic component parts 32 to quickly dissipate heat from the heat sink 1, the CPU 31, and the surrounding electronic component parts 32.
  • FIGS. from [0021] 10 through 12 show another alternate form of the present invention. According to this embodiment, the center shaft 11 of the heat sink 1 is a solid shaft, and the radiation fins 12 are smoothly arched and radially curved in direction reversed to the direction of rotation of the fan blade and hub assembly 22 of the axial flow fan 2. During operation, heat is transferred from the CPU 31 to the solid center shaft 11 and then the radiation fins 12, and at the same time the axial flow of air induced by the axial flow fan 2 continuously passes through the gaps 121 in between the radiation fins 12 toward the top surface of the CPU 31 and the surrounding electronic component parts 32 to quickly dissipate heat from the heat sink 1, the CPU 31, and the surrounding electronic component parts 32.
  • A prototype of heat sink has been constructed with the features of the annexed drawings of FIGS. [0022] 1˜12. The heat sink functions smoothly to provide all of the features discussed earlier.
  • Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims. [0023]

Claims (3)

What the invention claimed is:
1. A CPU cooling structure comprising a heat sink disposed in contact with the surface of the CPU (central processing unit) of the motherboard in a computer, and an axial flow fan fastened to a top side of said heat sink and having a fan blade and hub assembly rotated to cause an axial flow of air toward said heat sink and said CPU and to dissipate heat from said heat sink and said CPU, wherein said heat sink comprises a center shaft and a plurality of radiation fins equiangularly radially arranged around the periphery of said center shaft and curved in direction reversed to the direction of rotation of the fan blade and hub assembly of said axial flow fan.
2. The CPU cooling structure as claimed in claim 1 wherein said center shaft comprises an enclosed fluid chamber and a heat transfer fluid filled in said enclosed fluid chamber.
3. A CPU cooling structure comprising a heat sink disposed in contact with the surface of the CPU (central processing unit) of the motherboard in a computer, and an axial flow fan fastened to a top side of said heat sink and having a fan blade and hub assembly rotated to cause an axial flow of air toward said heat sink and said CPU and to dissipate heat from said heat sink and said CPU, wherein said heat sink comprises a center shaft and a plurality of radiation fins equiangularly radially arranged around the periphery of said center shaft and curved in direction corresponding to the direction of rotation of the fan blade and hub assembly of said axial flow fan, said center shaft comprising an enclosed fluid chamber and a heat transfer fluid filled in said enclosed fluid chamber.
US09/982,016 2000-10-25 2001-10-19 CPU cooling structure Abandoned US20020046826A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
TW089122409 2000-10-25
TW89122409 2000-10-25
TW090203720 2001-03-13
TW90203720 2001-03-13
TW089122409A01 2001-07-26

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Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023853A2 (en) * 2001-09-10 2003-03-20 Intel Corporation Electronic assemblies with high capacity heat sinks and methods of manufacture
US20030189813A1 (en) * 2000-11-20 2003-10-09 Intel Corporation High performance heat sink configurations for use in high density packaging applications
US6657862B2 (en) 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US20040246676A1 (en) * 2003-06-05 2004-12-09 Barr Andrew Harvey System and method for heat dissipation and air flow redirection in a chassis
US20040261975A1 (en) * 2003-06-27 2004-12-30 Intel Corporation Radial heat sink with helical shaped fins
US20050061480A1 (en) * 2002-01-17 2005-03-24 Carter Daniel P. Heat sinks and method of formation
US20050061478A1 (en) * 2003-08-08 2005-03-24 Chu-Tsai Huang Circular heat sink assembly
US20060144569A1 (en) * 2004-12-31 2006-07-06 Crocker Michael T Systems for improved heat exchanger
US20070008701A1 (en) * 2005-07-06 2007-01-11 Delta Electronics, Inc. Heat-dissipating device
US20070107880A1 (en) * 2005-11-17 2007-05-17 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink structure
US20080080137A1 (en) * 2006-10-02 2008-04-03 Nidec Corporation Heat sink and cooling apparatus
US20080156461A1 (en) * 2006-12-28 2008-07-03 Nidec Corporation Heat sink fan
US20080180912A1 (en) * 2007-01-15 2008-07-31 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
US20090262505A1 (en) * 2008-04-16 2009-10-22 Asia Vital Components Co., Ltd. Heat radiator
US20090266521A1 (en) * 2008-04-28 2009-10-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20090301694A1 (en) * 2008-06-04 2009-12-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
DE102010060261B3 (en) * 2010-10-29 2011-11-10 Institut für Luft- und Kältetechnik gemeinnützige Gesellschaft mbH CPU cooler
US8125776B2 (en) 2010-02-23 2012-02-28 Journée Lighting, Inc. Socket and heat sink unit for use with removable LED light module
CN103776292A (en) * 2014-01-30 2014-05-07 上海战古电子科技有限公司 Easy radiating and high-efficient heat dissipation device with large heat dissipation area
US20160187073A1 (en) * 2014-12-31 2016-06-30 Ningbo Singfun Electric Appliance Co., Ltd. Radiating fin with bent radiating portion and electrothermal oil heater using same
US9565782B2 (en) 2013-02-15 2017-02-07 Ecosense Lighting Inc. Field replaceable power supply cartridge
US9568665B2 (en) 2015-03-03 2017-02-14 Ecosense Lighting Inc. Lighting systems including lens modules for selectable light distribution
USD782093S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
USD782094S1 (en) 2015-07-20 2017-03-21 Ecosense Lighting Inc. LED luminaire having a mounting system
USD785218S1 (en) 2015-07-06 2017-04-25 Ecosense Lighting Inc. LED luminaire having a mounting system
US9651216B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Lighting systems including asymmetric lens modules for selectable light distribution
US9651227B2 (en) 2015-03-03 2017-05-16 Ecosense Lighting Inc. Low-profile lighting system having pivotable lighting enclosure
US9651232B1 (en) 2015-08-03 2017-05-16 Ecosense Lighting Inc. Lighting system having a mounting device
US9746159B1 (en) 2015-03-03 2017-08-29 Ecosense Lighting Inc. Lighting system having a sealing system
US9869450B2 (en) 2015-02-09 2018-01-16 Ecosense Lighting Inc. Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector
US10477636B1 (en) 2014-10-28 2019-11-12 Ecosense Lighting Inc. Lighting systems having multiple light sources
US11306897B2 (en) 2015-02-09 2022-04-19 Ecosense Lighting Inc. Lighting systems generating partially-collimated light emissions
USD962879S1 (en) * 2020-04-09 2022-09-06 Acer Incorporated Heat-dissipation unit

Cited By (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030189813A1 (en) * 2000-11-20 2003-10-09 Intel Corporation High performance heat sink configurations for use in high density packaging applications
US6845010B2 (en) 2000-11-20 2005-01-18 Intel Corporation High performance heat sink configurations for use in high density packaging applications
US20050280992A1 (en) * 2001-09-10 2005-12-22 Intel Corporation Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
WO2003023853A3 (en) * 2001-09-10 2003-11-13 Intel Corp Electronic assemblies with high capacity heat sinks and methods of manufacture
US6657862B2 (en) 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6671172B2 (en) 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US7911790B2 (en) 2001-09-10 2011-03-22 Intel Corporation Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
WO2003023853A2 (en) * 2001-09-10 2003-03-20 Intel Corporation Electronic assemblies with high capacity heat sinks and methods of manufacture
US7200934B2 (en) 2001-09-10 2007-04-10 Intel Corporation Electronic assemblies with high capacity heat sinks and methods of manufacture
US7120020B2 (en) 2001-09-10 2006-10-10 Intel Corporation Electronic assemblies with high capacity bent fin heat sinks
US20050061480A1 (en) * 2002-01-17 2005-03-24 Carter Daniel P. Heat sinks and method of formation
US8205666B2 (en) * 2002-01-17 2012-06-26 Intel Corporation Heat sinks and method of formation
US20100193173A1 (en) * 2002-01-17 2010-08-05 Intel Corporation Heat sinks and method of formation
US20070193718A1 (en) * 2002-01-17 2007-08-23 Carter Daniel P Heat sinks and method of formation
US20040246676A1 (en) * 2003-06-05 2004-12-09 Barr Andrew Harvey System and method for heat dissipation and air flow redirection in a chassis
US7079390B2 (en) * 2003-06-05 2006-07-18 Hewlett-Packard Development, L.P. System and method for heat dissipation and air flow redirection in a chassis
US20040261975A1 (en) * 2003-06-27 2004-12-30 Intel Corporation Radial heat sink with helical shaped fins
US6886627B2 (en) * 2003-06-27 2005-05-03 Intel Corporation Radial heat sink with helical shaped fins
US20050061478A1 (en) * 2003-08-08 2005-03-24 Chu-Tsai Huang Circular heat sink assembly
US7063130B2 (en) * 2003-08-08 2006-06-20 Chu-Tsai Huang Circular heat sink assembly
WO2006072105A1 (en) * 2004-12-31 2006-07-06 Intel Corporation Systems for improved heat exchanger
US7143820B2 (en) 2004-12-31 2006-12-05 Intel Corporation Systems for improved heat exchanger
US20060144569A1 (en) * 2004-12-31 2006-07-06 Crocker Michael T Systems for improved heat exchanger
CN100530617C (en) * 2004-12-31 2009-08-19 英特尔公司 Systems for improved heat exchanger
US20070008701A1 (en) * 2005-07-06 2007-01-11 Delta Electronics, Inc. Heat-dissipating device
US20070107880A1 (en) * 2005-11-17 2007-05-17 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink structure
US20080080137A1 (en) * 2006-10-02 2008-04-03 Nidec Corporation Heat sink and cooling apparatus
US7623348B2 (en) 2006-10-02 2009-11-24 Nidec Corporation Heat sink and cooling apparatus
US20080156461A1 (en) * 2006-12-28 2008-07-03 Nidec Corporation Heat sink fan
US8210241B2 (en) 2006-12-28 2012-07-03 Nidec Corporation Heat sink fan
US20080180912A1 (en) * 2007-01-15 2008-07-31 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
US8256258B2 (en) 2007-01-15 2012-09-04 Nidec Corporation Radiator, heat sink fan, and radiator manufacturing method
US20090262505A1 (en) * 2008-04-16 2009-10-22 Asia Vital Components Co., Ltd. Heat radiator
US8385071B2 (en) * 2008-04-16 2013-02-26 Asia Vital Components Co., Ltd. Heat radiator
US20090266521A1 (en) * 2008-04-28 2009-10-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN101573018B (en) * 2008-04-28 2012-03-21 富准精密工业(深圳)有限公司 Radiating device
US8347951B2 (en) * 2008-04-28 2013-01-08 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8245765B2 (en) * 2008-06-04 2012-08-21 Fu Zhun Precision Industry (Shen Zhen) Co., Lt. Heat dissipation device
US20090301694A1 (en) * 2008-06-04 2009-12-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US8125776B2 (en) 2010-02-23 2012-02-28 Journée Lighting, Inc. Socket and heat sink unit for use with removable LED light module
WO2012055402A1 (en) 2010-10-29 2012-05-03 Institut Für Luft- Und Kältetechnik Gemeinnützige Gmbh Cpu cooler
DE102010060261B3 (en) * 2010-10-29 2011-11-10 Institut für Luft- und Kältetechnik gemeinnützige Gesellschaft mbH CPU cooler
US9565782B2 (en) 2013-02-15 2017-02-07 Ecosense Lighting Inc. Field replaceable power supply cartridge
CN103776292A (en) * 2014-01-30 2014-05-07 上海战古电子科技有限公司 Easy radiating and high-efficient heat dissipation device with large heat dissipation area
US10477636B1 (en) 2014-10-28 2019-11-12 Ecosense Lighting Inc. Lighting systems having multiple light sources
US20160187073A1 (en) * 2014-12-31 2016-06-30 Ningbo Singfun Electric Appliance Co., Ltd. Radiating fin with bent radiating portion and electrothermal oil heater using same
US10190831B2 (en) * 2014-12-31 2019-01-29 Ningbo Singfun Electric Appliance Co., Ltd. Radiating fin with bent radiating portion and electrothermal oil heater using same
US9869450B2 (en) 2015-02-09 2018-01-16 Ecosense Lighting Inc. Lighting systems having a truncated parabolic- or hyperbolic-conical light reflector, or a total internal reflection lens; and having another light reflector
US11306897B2 (en) 2015-02-09 2022-04-19 Ecosense Lighting Inc. Lighting systems generating partially-collimated light emissions
US11614217B2 (en) 2015-02-09 2023-03-28 Korrus, Inc. Lighting systems generating partially-collimated light emissions
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