US20110232866A1 - Integral cold plate and honeycomb facesheet assembly - Google Patents
Integral cold plate and honeycomb facesheet assembly Download PDFInfo
- Publication number
- US20110232866A1 US20110232866A1 US12/748,549 US74854910A US2011232866A1 US 20110232866 A1 US20110232866 A1 US 20110232866A1 US 74854910 A US74854910 A US 74854910A US 2011232866 A1 US2011232866 A1 US 2011232866A1
- Authority
- US
- United States
- Prior art keywords
- sheet
- fluid path
- cold plate
- brazed
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates to a heat transfer device, and more particularly to a cold plate assembly.
- Heat removal provides, for example, lower operating temperatures, higher operating speeds, greater computing power and higher reliability.
- Cold plates are liquid cooled structures which provide a heat transfer function for components mounted thereto.
- a cold plate assembly includes a face sheet assembly with an integral cold plate and a structure mounted to the face sheet assembly.
- FIG. 1 is a general exploded view of a cold plate assembly
- FIG. 2 is a perspective view of the cold plate assembly of FIG. 1 ;
- FIG. 3 is a general exploded view of a cold plate assembly with exploded views of a first face sheet assembly and a second face sheet assembly;
- FIG. 4 is a general exploded view of a RELATED ART cold plate assembly with a separate self contained cold plate
- FIG. 5 is a general schematic view of a cold plate assembly attached to a structure.
- FIG. 1 schematically illustrates a cold plate assembly 20 .
- the cold plate assembly 20 generally includes a first face sheet assembly 22 A that has a face sheet 24 A with an integral cold plate 26 A and a second face sheet assembly 22 B that has a face sheet 24 B with an integral cold plate 26 B.
- the first face sheet assembly 22 A and the second face sheet assembly 22 B sandwich a structure S such as a frame 28 and a honeycomb core 30 typically through an adhesive. It should be understood that either or both of face sheets 24 A, 24 B may be a portion of any structure inclusive of an avionics component itself.
- the header assembly 32 communicates with a fluid system 38 as generally understood (illustrated schematically; FIG. 2 ).
- the first face sheet assembly 22 A generally includes a first end sheet 40 , a first parting sheet 42 , a fluid path B closure bar 46 , a fluid path B fin structure 44 (illustrated schematically), a middle parting sheet 48 , a fluid path A closure bar 52 , a fluid path A fin structure 50 , (illustrated schematically), a second parting sheet 54 and the face sheet 24 A.
- the first end sheet 40 may be manufactured of 3004 Aluminum with a nominal thickness of 0.04 inches (1 mm)
- the first parting sheet 42 may be manufactured of a braze material, such as CT-23, or a Multiclad alloy with a nominal thickness of 0.016 inches (0.4 mm)
- the fluid path B closure bar 46 may be manufactured of 6951 Aluminum with a nominal thickness of 0.05 inches (1.3 mm)
- the fluid path B fin structure 44 may be manufactured of 6951 Aluminum with a nominal thickness of 0.005 inches (0.13 mm)
- the middle parting sheet 48 may be manufactured of a braze material, such as CT-23, or a Multiclad alloy with a nominal thickness of 0.016 inches (0.4 mm)
- the fluid path A closure bar 52 may be manufactured of 6951 Aluminum with a nominal thickness of 0.05 inches (1.3 mm)
- the fluid path A fin structure 50 may be manufactured of 6951 Aluminum with a nominal thickness of 0.005 inches (0.13 mm)
- the second parting sheet 54 may
- the parting sheets 42 , 48 and 54 may include a braze alloy that melts during a brazing process that forms an integral assembly between the sheets 40 - 54 . It should be understood that other bonding or assembly methods may alternatively or additionally be utilized.
- the sheets 40 - 54 may be brazed to the face sheet 24 A as a unit to form the first face sheet assembly 22 A, however, it should be understood that other bonding or assembly methods may alternatively or additionally be utilized.
- the assembly is brazed together such that: the first end sheet 40 is brazed to the first parting sheet 42 ; the first parting sheet 42 is brazed to the first end sheet 40 and the path B closure bar 46 and the fluid path B fin structure 44 ; the fluid path B closure bar 46 is brazed to the first parting sheet 42 and the middle parting sheet 48 ; the fluid path B fin structure 44 is brazed to the first parting sheet 42 and the middle parting sheet 48 ; the middle parting sheet 48 is brazed to the fluid path B fin structure 44 and to the fluid path B closure bar 46 and to the fluid path A fin structure 50 and to the fluid path A closure bar 52 ; the fluid path A closure bar 52 is brazed to the middle parting sheet 48 and to the second parting sheet 54 ; the fluid path A fin structure 50 is brazed to the middle parting sheet 48 and to the second parting sheet 54 ; and the second parting sheet 54 is brazed to the fluid path A fin structure 50 and to the fluid path A closure bar 52 and to the first face sheet
- the cold plate 26 A is integral to the first face sheet assembly 22 A so as to eliminate one end sheet from what would conventionally be a separate self-contained cold plate (RELATED ART; FIG. 4 ). That is, cold plate 26 A eliminates one end sheet which is now replaced by the respective face sheet 24 A.
- the face sheets 24 A, 24 B already includes the integral cold plate 26 A, 26 B.
- only one or more cold plate assemblies 20 may be utilized.
- one of the face sheet assemblies 22 A, 22 B need not actually include the respective integral cold plate 26 A, 26 B such that the face sheet assembly 22 A is on only one side of the structure S or the face sheet assembly 22 A′ forms one face of another structure S′ ( FIG. 5 ).
- a support panel is the example structure utilized to provide for the integral cold plate 26 A, 26 B any heat transfer device or structure inclusive of the electronic components themselves may alternatively benefit herefrom.
- the cold plate assembly 20 is formed with a reduced total part count through elimination of parts. Mounting hardware and/or structural adhesive for the cold plate 26 A, 26 B is eliminated. Weight, costs and additional processing steps are also thereby reduced as no mounting features need be machined or otherwise formed. Furthermore, a more structurally sound cold plate assembly 20 results.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
A cold plate assembly includes a face sheet assembly with an integral cold plate and a structure mounted to the face sheet assembly.
Description
- This invention was made with government support with the National Aeronautics and Space Administration under Contract No.: NNJ06TA25C. The government therefore has certain rights in this invention.
- The present disclosure relates to a heat transfer device, and more particularly to a cold plate assembly.
- Operation of high speed electronic components such as microprocessors, graphics processors and other modules produces heat. The heat may need to be removed for efficient operation. Heat removal provides, for example, lower operating temperatures, higher operating speeds, greater computing power and higher reliability.
- Cold plates are liquid cooled structures which provide a heat transfer function for components mounted thereto.
- A cold plate assembly according to an exemplary aspect of the present disclosure includes a face sheet assembly with an integral cold plate and a structure mounted to the face sheet assembly.
- Various features will become apparent to those skilled in the art from the following detailed description of the disclosed non-limiting embodiment. The drawings that accompany the detailed description can be briefly described as follows:
-
FIG. 1 is a general exploded view of a cold plate assembly; -
FIG. 2 is a perspective view of the cold plate assembly ofFIG. 1 ; -
FIG. 3 is a general exploded view of a cold plate assembly with exploded views of a first face sheet assembly and a second face sheet assembly; -
FIG. 4 is a general exploded view of a RELATED ART cold plate assembly with a separate self contained cold plate; and -
FIG. 5 is a general schematic view of a cold plate assembly attached to a structure. -
FIG. 1 schematically illustrates acold plate assembly 20. Thecold plate assembly 20 generally includes a firstface sheet assembly 22A that has aface sheet 24A with an integralcold plate 26A and a secondface sheet assembly 22B that has aface sheet 24B with an integralcold plate 26B. The firstface sheet assembly 22A and the secondface sheet assembly 22B sandwich a structure S such as aframe 28 and ahoneycomb core 30 typically through an adhesive. It should be understood that either or both offace sheets - A
header assembly 32 with aninlet port 34 and anoutlet port 36 communicates fluid through thecold plate assembly 20. Theheader assembly 32 communicates with a fluid system 38 as generally understood (illustrated schematically;FIG. 2 ). - Referring to
FIG. 3 , the firstface sheet assembly 22A generally includes afirst end sheet 40, afirst parting sheet 42, a fluid pathB closure bar 46, a fluid path B fin structure 44 (illustrated schematically), amiddle parting sheet 48, a fluid pathA closure bar 52, a fluid path Afin structure 50, (illustrated schematically), asecond parting sheet 54 and theface sheet 24A. - In one non-limiting embodiment, the
first end sheet 40 may be manufactured of 3004 Aluminum with a nominal thickness of 0.04 inches (1 mm), thefirst parting sheet 42 may be manufactured of a braze material, such as CT-23, or a Multiclad alloy with a nominal thickness of 0.016 inches (0.4 mm), the fluid pathB closure bar 46 may be manufactured of 6951 Aluminum with a nominal thickness of 0.05 inches (1.3 mm), the fluid path Bfin structure 44 may be manufactured of 6951 Aluminum with a nominal thickness of 0.005 inches (0.13 mm), themiddle parting sheet 48 may be manufactured of a braze material, such as CT-23, or a Multiclad alloy with a nominal thickness of 0.016 inches (0.4 mm), the fluid path Aclosure bar 52 may be manufactured of 6951 Aluminum with a nominal thickness of 0.05 inches (1.3 mm), the fluid path Afin structure 50 may be manufactured of 6951 Aluminum with a nominal thickness of 0.005 inches (0.13 mm) and thesecond parting sheet 54 may be manufactured of a braze material, such as CT-23, or a Multiclad alloy with a nominal thickness of 0.016 inches (0.4 mm). It should be understood that various materials and nominal thickness may alternatively be utilized. - The
parting sheets face sheet 24A as a unit to form the firstface sheet assembly 22A, however, it should be understood that other bonding or assembly methods may alternatively or additionally be utilized. - Generally, the assembly is brazed together such that: the
first end sheet 40 is brazed to thefirst parting sheet 42; thefirst parting sheet 42 is brazed to thefirst end sheet 40 and the pathB closure bar 46 and the fluid pathB fin structure 44; the fluid pathB closure bar 46 is brazed to thefirst parting sheet 42 and themiddle parting sheet 48; the fluid pathB fin structure 44 is brazed to thefirst parting sheet 42 and themiddle parting sheet 48; themiddle parting sheet 48 is brazed to the fluid path Bfin structure 44 and to the fluid pathB closure bar 46 and to the fluid path Afin structure 50 and to the fluid pathA closure bar 52; the fluid pathA closure bar 52 is brazed to themiddle parting sheet 48 and to thesecond parting sheet 54; the fluid path Afin structure 50 is brazed to themiddle parting sheet 48 and to thesecond parting sheet 54; and thesecond parting sheet 54 is brazed to the fluid path Afin structure 50 and to the fluid pathA closure bar 52 and to thefirst face sheet 24A. - The
cold plate 26A is integral to the firstface sheet assembly 22A so as to eliminate one end sheet from what would conventionally be a separate self-contained cold plate (RELATED ART;FIG. 4 ). That is,cold plate 26A eliminates one end sheet which is now replaced by therespective face sheet 24A. Thus when the structure S is fabricated, theface sheets cold plate cold plate assemblies 20 may be utilized. For example, one of theface sheet assemblies cold plate face sheet assembly 22A is on only one side of the structure S or theface sheet assembly 22A′ forms one face of another structure S′ (FIG. 5 ). Furthermore, it should be understood that although a support panel is the example structure utilized to provide for the integralcold plate - The
cold plate assembly 20 is formed with a reduced total part count through elimination of parts. Mounting hardware and/or structural adhesive for thecold plate cold plate assembly 20 results. - It should be understood that like reference numerals identify corresponding or similar elements throughout the several drawings. It should also be understood that although a particular component arrangement is disclosed in the illustrated embodiment, other arrangements will benefit herefrom.
- Although particular step sequences are shown, described, and claimed, it should be understood that steps may be performed in any order, separated or combined unless otherwise indicated and will still benefit from the present disclosure.
- The foregoing description is exemplary rather than defined by the limitations within. Various non-limiting embodiments are disclosed herein, however, one of ordinary skill in the art would recognize that various modifications and variations in light of the above teachings will fall within the scope of the appended claims. It is therefore to be understood that within the scope of the appended claims, the disclosure may be practiced other than as specifically described. For that reason the appended claims should be studied to determine true scope and content.
Claims (15)
1. A cold plate assembly comprising:
a face sheet assembly with an integral cold plate; and
a structure mounted to said face sheet assembly.
2. The cold plate assembly as recited in claim 1 , wherein said structure comprises a core within a frame.
3. The cold plate assembly as recited in claim 1 , wherein said face sheet assembly includes a face sheet brazed to a parting sheet of said integral cold plate.
4. The cold plate assembly as recited in claim 3 , wherein said face sheet is larger than said integral cold plate.
5. The cold plate assembly as recited in claim 1 , further comprising a second face sheet assembly with a second integral cold plate, said second face sheet assembly mounted to said structure.
6. The cold plate assembly as recited in claim 5 , wherein said second face sheet is larger than a parting sheet of said second integral cold plate.
7. The cold plate assembly as recited in claim 5 , wherein said second face sheet assembly and said first face sheet assembly sandwich said structure.
8. The cold plate assembly as recited in claim 7 , wherein said structure comprises a core within a frame.
9. The cold plate assembly as recited in claim 1 , wherein said face sheet assembly further comprises:
a first end sheet;
a first parting sheet brazed to said first end sheet, said path B closure bar and said fluid path B fin structure;
a fluid path B closure bar brazed to said first parting sheet and said middle parting sheet;
a fluid path B fin structure brazed to said first parting sheet and said middle parting sheet;
a middle parting sheet brazed to said fluid path B fin structure, said fluid path B closure bar, said fluid path A fin structure and said fluid path A closure bar;
a fluid path A closure bar brazed to said middle parting sheet and said second parting sheet;
a fluid path A fin structure brazed to said middle parting sheet and to said second parting sheet; and
a second parting sheet brazed to said fluid path A fin structure, said fluid path A closure bar and a first face sheet.
10. The cold plate assembly as recited in claim 9 , further comprising a second face sheet assembly with a second integral cold plate, said second face sheet assembly mounted to said structure.
11. The cold plate assembly as recited in claim 10 , wherein said second face sheet assembly further comprises:
a second end sheet;
a second parting sheet brazed to said second end sheet, said path A closure bar and said fluid path A fin structure;
a fluid path A closure bar brazed to said second parting sheet and said middle parting sheet;
a fluid path A fin structure brazed to said second parting sheet and said middle parting sheet;
a middle parting sheet brazed to said fluid path A fin structure, said fluid path A closure bar, said fluid path B fin structure and said fluid path B closure bar;
a fluid path B closure bar brazed to said middle parting sheet and said first parting sheet;
a fluid path B fin structure brazed to said middle parting sheet and to said first parting sheet; and
a first parting sheet brazed to said fluid path B fin structure, said fluid path B closure bar and a first face sheet.
12. A cold plate assembly comprising:
a first end sheet;
a first parting sheet brazed to said first end sheet, said path B closure bar and said fluid path B fin structure;
a fluid path B closure bar brazed to said first parting sheet and said middle parting sheet;
a fluid path B fin structure brazed to said first parting sheet and said middle parting sheet;
a middle parting sheet brazed to said fluid path B fin structure, said fluid path B closure bar, said fluid path A fin structure and said fluid path A closure bar;
a fluid path A closure bar brazed to said middle parting sheet and said second parting sheet;
a fluid path A fin structure brazed to said middle parting sheet and to said second parting sheet;
a second parting sheet brazed to said fluid path A fin structure, said fluid path A closure bar and said first face sheet; and
a face sheet brazed to said second parting sheet.
13. The cold plate assembly as recited in claim 12 , wherein said face sheet is larger than said second parting sheet.
14. The cold plate assembly as recited in claim 12 , wherein said first parting sheet, said middle parting sheet and said second parting sheet are manufactured of a braze alloy.
15. The cold plate assembly as recited in claim 14 , wherein said braze alloy melts during a brazing process to form an integral structure.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/748,549 US20110232866A1 (en) | 2010-03-29 | 2010-03-29 | Integral cold plate and honeycomb facesheet assembly |
JP2011052320A JP2011208932A (en) | 2010-03-29 | 2011-03-10 | Cold plate assembly |
EP11250368A EP2372757A3 (en) | 2010-03-29 | 2011-03-24 | Integral cold plate and honeycomb facesheet assembly |
CN2011100764350A CN102209453A (en) | 2010-03-29 | 2011-03-29 | Integral cold plate and honeycomb facesheet assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/748,549 US20110232866A1 (en) | 2010-03-29 | 2010-03-29 | Integral cold plate and honeycomb facesheet assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110232866A1 true US20110232866A1 (en) | 2011-09-29 |
Family
ID=44343113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/748,549 Abandoned US20110232866A1 (en) | 2010-03-29 | 2010-03-29 | Integral cold plate and honeycomb facesheet assembly |
Country Status (4)
Country | Link |
---|---|
US (1) | US20110232866A1 (en) |
EP (1) | EP2372757A3 (en) |
JP (1) | JP2011208932A (en) |
CN (1) | CN102209453A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105682413A (en) * | 2014-11-20 | 2016-06-15 | 深圳市欧德思控制技术有限公司 | End cover-type water-cooling plate and manufacturing method thereof |
US9660573B2 (en) | 2015-01-05 | 2017-05-23 | Globalfoundries Inc. | Passive solar panel cooling |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105823360B (en) * | 2016-04-22 | 2017-09-08 | 浙江大学 | Plate type heat exchanger containing wrong heat exhausting pipe array |
Citations (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3977206A (en) * | 1972-02-22 | 1976-08-31 | United Aircraft Products, Inc. | Heat transfer system |
US4478277A (en) * | 1982-06-28 | 1984-10-23 | The Trane Company | Heat exchanger having uniform surface temperature and improved structural strength |
US4498119A (en) * | 1980-11-03 | 1985-02-05 | Lockheed Corporation | Electronic circuit board and method and apparatus for thermal management thereof |
US4815534A (en) * | 1987-09-21 | 1989-03-28 | Itt Standard, Itt Corporation | Plate type heat exchanger |
US4958257A (en) * | 1989-03-29 | 1990-09-18 | Hughes Aircraft Company | Heat conducting interface for electronic module |
US5088005A (en) * | 1990-05-08 | 1992-02-11 | Sundstrand Corporation | Cold plate for cooling electronics |
US5429183A (en) * | 1992-06-17 | 1995-07-04 | Mitsubishi Denki Kabushiki Kaisha | Plate-type heat exchanger and method of producing the same |
US5495889A (en) * | 1993-02-10 | 1996-03-05 | Gec Alsthom Transport Sa | Cooling device for power electronic components |
US6029742A (en) * | 1994-01-26 | 2000-02-29 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
US6191945B1 (en) * | 1997-07-30 | 2001-02-20 | Hewlett-Packard Company | Cold plate arrangement for cooling processor and companion voltage regulator |
US6268049B1 (en) * | 1995-11-01 | 2001-07-31 | James J. Childress | Circulation system using column core |
US6508301B2 (en) * | 2000-04-19 | 2003-01-21 | Thermal Form & Function | Cold plate utilizing fin with evaporating refrigerant |
US6520252B1 (en) * | 2001-12-21 | 2003-02-18 | Hamilton Sundstrand | Heat exchanger assembly with core-reinforcing closure bars |
US20030066635A1 (en) * | 2000-12-18 | 2003-04-10 | Rhodes Eugene E. | Turbulator with offset louvers and method of making same |
US20040081797A1 (en) * | 2002-01-28 | 2004-04-29 | Simmons Richard A. | Structural polymer core assembly, method of manufacture and method of use |
US20050121173A1 (en) * | 2003-12-03 | 2005-06-09 | Mitsuharu Inagaki | Stacked type cooler |
US20050145379A1 (en) * | 2003-12-17 | 2005-07-07 | Andy Thomas | Flat tube cold plate assembly |
US20050178531A1 (en) * | 2004-02-16 | 2005-08-18 | Forward Electronics Co., Ltd. | Fluid passage arrangement of a heat absorber for use in a liquid-cooling type cooling apparatus |
US7000684B2 (en) * | 2002-11-01 | 2006-02-21 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
US7017654B2 (en) * | 2003-03-17 | 2006-03-28 | Cooligy, Inc. | Apparatus and method of forming channels in a heat-exchanging device |
US7024874B2 (en) * | 2003-09-22 | 2006-04-11 | Hamilton Sundstrand | Aircraft galley chiller system |
US20060090886A1 (en) * | 2004-11-02 | 2006-05-04 | Calsonic Kansei Corporation | Plate-like heat exchanger |
US20060266508A1 (en) * | 2005-05-24 | 2006-11-30 | Johnson Scott T | Cold plate assembly |
US7156159B2 (en) * | 2003-03-17 | 2007-01-02 | Cooligy, Inc. | Multi-level microchannel heat exchangers |
US20070023168A1 (en) * | 2005-07-27 | 2007-02-01 | Behr Industry Gmbh & Co. Kg | Apparatus for cooling electronic components |
US7188488B2 (en) * | 2003-03-12 | 2007-03-13 | Hamilton Sundstrand | Pack and a half condensing cycle pack with combined heat exchangers |
US7188662B2 (en) * | 2004-06-04 | 2007-03-13 | Cooligy, Inc. | Apparatus and method of efficient fluid delivery for cooling a heat producing device |
US7243706B2 (en) * | 2004-05-28 | 2007-07-17 | Ixys Corporation | Heatsink for power devices |
US20070163765A1 (en) * | 2003-10-31 | 2007-07-19 | Patrick Rondier | Power-electronic-cooling device |
US7258161B2 (en) * | 2002-01-14 | 2007-08-21 | Emerson Network Power, Energy Systems, North America, Inc. | Cooling system for densely packed electronic components |
US7302998B2 (en) * | 2000-06-08 | 2007-12-04 | Mikros Manufacturing, Inc. | Normal-flow heat exchanger |
US7344363B2 (en) * | 2003-01-31 | 2008-03-18 | Cooligy Inc. | Remedies to prevent cracking in a liquid system |
US7353864B2 (en) * | 2005-12-23 | 2008-04-08 | Hamilton Sundstrand Corporation | Apparatus for reducing thermal fatigue in heat exchanger cores |
US7371615B2 (en) * | 2003-09-18 | 2008-05-13 | Fuji Electric Systems, Co., Ltd. | Heat sink and method for its production |
US20090107655A1 (en) * | 2007-10-25 | 2009-04-30 | Katsuyuki Kajiura | Semiconductor cooling apparatus |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62172986U (en) * | 1986-04-16 | 1987-11-02 | ||
JPS6316648A (en) * | 1986-07-08 | 1988-01-23 | Nec Corp | Temperature-detecting structure of integrated circuit package |
DE19528116B4 (en) * | 1995-08-01 | 2007-02-15 | Behr Gmbh & Co. Kg | Heat exchanger with plate sandwich structure |
EP1384271B1 (en) * | 2001-04-24 | 2005-11-09 | Top-Cool Holding B.V. | Electric cooling device |
JP4140549B2 (en) * | 2004-04-21 | 2008-08-27 | 株式会社デンソー | Cooler |
-
2010
- 2010-03-29 US US12/748,549 patent/US20110232866A1/en not_active Abandoned
-
2011
- 2011-03-10 JP JP2011052320A patent/JP2011208932A/en active Pending
- 2011-03-24 EP EP11250368A patent/EP2372757A3/en not_active Withdrawn
- 2011-03-29 CN CN2011100764350A patent/CN102209453A/en active Pending
Patent Citations (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3977206A (en) * | 1972-02-22 | 1976-08-31 | United Aircraft Products, Inc. | Heat transfer system |
US4498119A (en) * | 1980-11-03 | 1985-02-05 | Lockheed Corporation | Electronic circuit board and method and apparatus for thermal management thereof |
US4478277A (en) * | 1982-06-28 | 1984-10-23 | The Trane Company | Heat exchanger having uniform surface temperature and improved structural strength |
US4815534A (en) * | 1987-09-21 | 1989-03-28 | Itt Standard, Itt Corporation | Plate type heat exchanger |
US4958257A (en) * | 1989-03-29 | 1990-09-18 | Hughes Aircraft Company | Heat conducting interface for electronic module |
US5088005A (en) * | 1990-05-08 | 1992-02-11 | Sundstrand Corporation | Cold plate for cooling electronics |
US5429183A (en) * | 1992-06-17 | 1995-07-04 | Mitsubishi Denki Kabushiki Kaisha | Plate-type heat exchanger and method of producing the same |
US5644840A (en) * | 1992-06-17 | 1997-07-08 | Mitsubishi Denki Kabushiki Kaisha | Method of producing a plate-type heat exchanger |
US5495889A (en) * | 1993-02-10 | 1996-03-05 | Gec Alsthom Transport Sa | Cooling device for power electronic components |
US6029742A (en) * | 1994-01-26 | 2000-02-29 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
US6268049B1 (en) * | 1995-11-01 | 2001-07-31 | James J. Childress | Circulation system using column core |
US6191945B1 (en) * | 1997-07-30 | 2001-02-20 | Hewlett-Packard Company | Cold plate arrangement for cooling processor and companion voltage regulator |
US6508301B2 (en) * | 2000-04-19 | 2003-01-21 | Thermal Form & Function | Cold plate utilizing fin with evaporating refrigerant |
US7302998B2 (en) * | 2000-06-08 | 2007-12-04 | Mikros Manufacturing, Inc. | Normal-flow heat exchanger |
US20030066635A1 (en) * | 2000-12-18 | 2003-04-10 | Rhodes Eugene E. | Turbulator with offset louvers and method of making same |
US6520252B1 (en) * | 2001-12-21 | 2003-02-18 | Hamilton Sundstrand | Heat exchanger assembly with core-reinforcing closure bars |
US7258161B2 (en) * | 2002-01-14 | 2007-08-21 | Emerson Network Power, Energy Systems, North America, Inc. | Cooling system for densely packed electronic components |
US20040081797A1 (en) * | 2002-01-28 | 2004-04-29 | Simmons Richard A. | Structural polymer core assembly, method of manufacture and method of use |
US7000684B2 (en) * | 2002-11-01 | 2006-02-21 | Cooligy, Inc. | Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device |
US7344363B2 (en) * | 2003-01-31 | 2008-03-18 | Cooligy Inc. | Remedies to prevent cracking in a liquid system |
US7188488B2 (en) * | 2003-03-12 | 2007-03-13 | Hamilton Sundstrand | Pack and a half condensing cycle pack with combined heat exchangers |
US7156159B2 (en) * | 2003-03-17 | 2007-01-02 | Cooligy, Inc. | Multi-level microchannel heat exchangers |
US7017654B2 (en) * | 2003-03-17 | 2006-03-28 | Cooligy, Inc. | Apparatus and method of forming channels in a heat-exchanging device |
US7371615B2 (en) * | 2003-09-18 | 2008-05-13 | Fuji Electric Systems, Co., Ltd. | Heat sink and method for its production |
US7024874B2 (en) * | 2003-09-22 | 2006-04-11 | Hamilton Sundstrand | Aircraft galley chiller system |
US7523622B2 (en) * | 2003-09-22 | 2009-04-28 | Hamilton Sundstrand Corporation | Aircraft galley chiller system |
US20070163765A1 (en) * | 2003-10-31 | 2007-07-19 | Patrick Rondier | Power-electronic-cooling device |
US20050121173A1 (en) * | 2003-12-03 | 2005-06-09 | Mitsuharu Inagaki | Stacked type cooler |
US20050145379A1 (en) * | 2003-12-17 | 2005-07-07 | Andy Thomas | Flat tube cold plate assembly |
US20050178531A1 (en) * | 2004-02-16 | 2005-08-18 | Forward Electronics Co., Ltd. | Fluid passage arrangement of a heat absorber for use in a liquid-cooling type cooling apparatus |
US7243706B2 (en) * | 2004-05-28 | 2007-07-17 | Ixys Corporation | Heatsink for power devices |
US7188662B2 (en) * | 2004-06-04 | 2007-03-13 | Cooligy, Inc. | Apparatus and method of efficient fluid delivery for cooling a heat producing device |
US20060090886A1 (en) * | 2004-11-02 | 2006-05-04 | Calsonic Kansei Corporation | Plate-like heat exchanger |
US20060266508A1 (en) * | 2005-05-24 | 2006-11-30 | Johnson Scott T | Cold plate assembly |
US20070023168A1 (en) * | 2005-07-27 | 2007-02-01 | Behr Industry Gmbh & Co. Kg | Apparatus for cooling electronic components |
US7353864B2 (en) * | 2005-12-23 | 2008-04-08 | Hamilton Sundstrand Corporation | Apparatus for reducing thermal fatigue in heat exchanger cores |
US20090107655A1 (en) * | 2007-10-25 | 2009-04-30 | Katsuyuki Kajiura | Semiconductor cooling apparatus |
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US9660573B2 (en) | 2015-01-05 | 2017-05-23 | Globalfoundries Inc. | Passive solar panel cooling |
Also Published As
Publication number | Publication date |
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EP2372757A2 (en) | 2011-10-05 |
JP2011208932A (en) | 2011-10-20 |
CN102209453A (en) | 2011-10-05 |
EP2372757A3 (en) | 2012-12-26 |
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