USD703208S1 - UICC apparatus - Google Patents
UICC apparatus Download PDFInfo
- Publication number
- USD703208S1 USD703208S1 US29/418,309 US201229418309F USD703208S US D703208 S1 USD703208 S1 US D703208S1 US 201229418309 F US201229418309 F US 201229418309F US D703208 S USD703208 S US D703208S
- Authority
- US
- United States
- Prior art keywords
- uicc apparatus
- uicc
- view
- ornamental design
- plan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Broken lines and portions contained within broken lines are not claimed.
Claims (1)
- We claim the ornamental design for a UICC apparatus, as shown and described.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/418,309 USD703208S1 (en) | 2012-04-13 | 2012-04-13 | UICC apparatus |
US29/418,619 USD702240S1 (en) | 2012-04-13 | 2012-04-18 | UICC apparatus |
CA 147626 CA147626S (en) | 2012-04-13 | 2012-09-28 | Device smart card |
CA 147625 CA147625S (en) | 2012-04-13 | 2012-09-28 | Device smart card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/418,309 USD703208S1 (en) | 2012-04-13 | 2012-04-13 | UICC apparatus |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/418,619 Continuation USD702240S1 (en) | 2012-04-13 | 2012-04-18 | UICC apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
USD703208S1 true USD703208S1 (en) | 2014-04-22 |
Family
ID=49179387
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/418,309 Active USD703208S1 (en) | 2012-04-13 | 2012-04-13 | UICC apparatus |
US29/418,619 Active USD702240S1 (en) | 2012-04-13 | 2012-04-18 | UICC apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/418,619 Active USD702240S1 (en) | 2012-04-13 | 2012-04-18 | UICC apparatus |
Country Status (2)
Country | Link |
---|---|
US (2) | USD703208S1 (en) |
CA (1) | CA147625S (en) |
Cited By (14)
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---|---|---|---|---|
USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
USD756317S1 (en) * | 2014-08-26 | 2016-05-17 | Féinics Amatech Teoranta | Layout for contact pads and connection bridges of a transponder chip module |
USD758372S1 (en) * | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD773466S1 (en) * | 2015-08-20 | 2016-12-06 | Isaac S. Daniel | Combined secure digital memory and subscriber identity module |
USD776070S1 (en) * | 2014-03-18 | 2017-01-10 | Sony Corporation | Non-contact type data carrier |
USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O |
US9769521B2 (en) | 2013-03-13 | 2017-09-19 | Nagrastar, Llc | Systems and methods for performing transport I/O |
USD798868S1 (en) * | 2015-08-20 | 2017-10-03 | Isaac S. Daniel | Combined subscriber identification module and storage card |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
USD868756S1 (en) * | 2016-11-10 | 2019-12-03 | GM Global Technology Operations LLC | Vehicle antenna |
USD930000S1 (en) * | 2018-10-12 | 2021-09-07 | Huawei Technologies Co., Ltd. | Memory card |
USD930001S1 (en) | 2018-02-01 | 2021-09-07 | Huawei Technologies Co., Ltd. | Card |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102103628B1 (en) | 2014-12-19 | 2020-04-23 | 마이론 워커 | Spoked solder pad to improve solderability and self-alignment of integrated circuit packages |
USD816135S1 (en) * | 2014-12-19 | 2018-04-24 | Myron Walker | Spoked solder pad |
Citations (532)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3373481A (en) | 1965-06-22 | 1968-03-19 | Sperry Rand Corp | Method of electrically interconnecting conductors |
US3676742A (en) | 1971-05-24 | 1972-07-11 | Signetics Corp | Means including a spark gap for protecting an integrated circuit from electrical discharge |
US3825353A (en) | 1972-06-06 | 1974-07-23 | Microsystems Int Ltd | Mounting leads and method of fabrication |
US3842189A (en) | 1973-01-08 | 1974-10-15 | Rca Corp | Contact array and method of making the same |
USD261760S (en) | 1978-12-22 | 1981-11-10 | Pitney Bowes Inc. | Electronic postal rate memory |
US4450024A (en) | 1980-08-07 | 1984-05-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Identification card with an IC-module and method for producing it |
US4535219A (en) | 1982-10-12 | 1985-08-13 | Xerox Corporation | Interfacial blister bonding for microinterconnections |
US4549247A (en) | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
US4591945A (en) | 1981-04-30 | 1986-05-27 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Device for protecting electronic circuits against electrostatic charges |
US4603249A (en) | 1981-12-24 | 1986-07-29 | Gao Gesellschaft Fur Automation Und Organisation Gmbh | Identification card having an IC module |
US4617605A (en) | 1981-07-31 | 1986-10-14 | Gao Gesellschaft Fur Automation Und Organisation | Carrier element for an IC module |
US4621190A (en) | 1983-06-09 | 1986-11-04 | Kabushiki Kaisha Toshiba | Card with an IC module |
US4625102A (en) | 1983-06-09 | 1986-11-25 | Flonic | Memory card manufacturing method and cards thus obtained |
US4639585A (en) | 1984-05-29 | 1987-01-27 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Data carrier with an IC module and a method for producing such a data carrier |
US4674175A (en) | 1985-04-02 | 1987-06-23 | Eta Sa Fabrique D'ebauches | Process for manufacturing electronic modules for microcircuit cards |
US4755661A (en) | 1986-01-10 | 1988-07-05 | Ruebsam Herrn H | Connection of electronic components in a card |
US4764803A (en) | 1986-03-17 | 1988-08-16 | Mitsubishi Denki Kabushiki Kaisha | Thin semiconductor card |
US4774633A (en) | 1985-06-26 | 1988-09-27 | Bull S.A. | Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device |
US4792843A (en) | 1983-10-24 | 1988-12-20 | Haghiri Tehrani Yahya | Data carrier having an integrated circuit and method for producing same |
US4803542A (en) | 1980-08-05 | 1989-02-07 | Gao Gessellschaft Fur Automation Und Organisation Mbh | Carrier element for an IC-module |
US4841134A (en) | 1985-07-27 | 1989-06-20 | Dai Nippon Insatsu Kabushika Kaisha | IC card |
US4860087A (en) | 1986-03-26 | 1989-08-22 | Hitachi, Ltd. | Semiconductor device and process for producing the same |
US4864383A (en) | 1985-10-11 | 1989-09-05 | Eurotechnique | Method of fabrication of a chip carrier package, a flush-contact chip carrier package and an application to cards containing components |
US4897534A (en) | 1986-11-20 | 1990-01-30 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Data carrier having an integrated circuit and a method for producing the same |
US4937653A (en) | 1988-07-21 | 1990-06-26 | American Telephone And Telegraph Company | Semiconductor integrated circuit chip-to-chip interconnection scheme |
US4942495A (en) | 1987-10-23 | 1990-07-17 | Gemplus Card International | Electrostatic protection device for electronic cards |
US4980802A (en) | 1988-05-09 | 1990-12-25 | Bull Cp8 | Flexible printed circuit |
US4994659A (en) | 1988-04-28 | 1991-02-19 | Citizen Watch Co., Ltd. | IC card |
US5027190A (en) | 1987-07-16 | 1991-06-25 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element to be incorporated into an identity card |
US5049728A (en) * | 1990-04-04 | 1991-09-17 | Rovin George H | IC card system with removable IC modules |
US5055907A (en) | 1989-01-25 | 1991-10-08 | Mosaic, Inc. | Extended integration semiconductor structure with wiring layers |
US5057460A (en) | 1988-11-29 | 1991-10-15 | Schlumberger Industries | Method of making an electronic module, for insertion into an electronic memory-card body |
US5067007A (en) | 1988-06-13 | 1991-11-19 | Hitachi, Ltd. | Semiconductor device having leads for mounting to a surface of a printed circuit board |
US5079673A (en) | 1989-04-06 | 1992-01-07 | Mitsubishi Denki Kabushiki Kaisha | Ic card module |
US5086216A (en) | 1988-06-28 | 1992-02-04 | Schlumberger Industries | Memory card with fuses and a system for handling such memory cards |
US5091618A (en) | 1989-05-23 | 1992-02-25 | Hitachi Maxell, Ltd. | Ic card reader/writer |
US5091769A (en) | 1991-03-27 | 1992-02-25 | Eichelberger Charles W | Configuration for testing and burn-in of integrated circuit chips |
US5122860A (en) | 1987-08-26 | 1992-06-16 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device and manufacturing method thereof |
US5126548A (en) | 1989-07-19 | 1992-06-30 | Kabushiki Kaisha Toshiba | Ic card with additional terminals and method of controlling the ic card |
USD327883S (en) * | 1990-02-09 | 1992-07-14 | Gemplus Card International | Connecting terminal for chip cards |
USD328599S (en) * | 1990-04-10 | 1992-08-11 | Gemplus Card International | Connecting terminal for chip cards |
US5149662A (en) | 1991-03-27 | 1992-09-22 | Integrated System Assemblies Corporation | Methods for testing and burn-in of integrated circuit chips |
US5150193A (en) | 1987-05-27 | 1992-09-22 | Hitachi, Ltd. | Resin-encapsulated semiconductor device having a particular mounting structure |
US5173055A (en) | 1991-08-08 | 1992-12-22 | Amp Incorporated | Area array connector |
USD331922S (en) * | 1989-02-02 | 1992-12-22 | Gemplus Card International | Connecting terminal for chip cards |
US5192682A (en) | 1990-05-10 | 1993-03-09 | Mitsubishi Denki Kabushiki Kaisha | Manufacturing method for thin semiconductor device assemblies |
US5192716A (en) | 1989-01-25 | 1993-03-09 | Polylithics, Inc. | Method of making a extended integration semiconductor structure |
US5208450A (en) | 1988-04-20 | 1993-05-04 | Matsushita Electric Industrial Co., Ltd. | IC card and a method for the manufacture of the same |
US5241456A (en) | 1990-07-02 | 1993-08-31 | General Electric Company | Compact high density interconnect structure |
US5250843A (en) | 1991-03-27 | 1993-10-05 | Integrated System Assemblies Corp. | Multichip integrated circuit modules |
US5255430A (en) | 1992-10-08 | 1993-10-26 | Atmel Corporation | Method of assembling a module for a smart card |
US5272374A (en) * | 1990-07-25 | 1993-12-21 | Mitsubishi Denki Kabushiki Kaisha | Production method for an IC card and its IC card |
US5280192A (en) | 1990-04-30 | 1994-01-18 | International Business Machines Corporation | Three-dimensional memory card structure with internal direct chip attachment |
US5289349A (en) * | 1991-04-15 | 1994-02-22 | Sony Corporation | Integrated circuit card |
US5296745A (en) | 1990-03-23 | 1994-03-22 | Kabushiki Kaisha Toshiba | Semiconductor device having a moisture barrier around periphery of device |
US5304513A (en) | 1987-07-16 | 1994-04-19 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame |
US5324687A (en) | 1992-10-16 | 1994-06-28 | General Electric Company | Method for thinning of integrated circuit chips for lightweight packaged electronic systems |
US5327834A (en) | 1992-05-28 | 1994-07-12 | Thiokol Corporation | Integrated field-effect initiator |
US5346576A (en) | 1990-03-26 | 1994-09-13 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing IC card |
US5360941A (en) | 1991-10-28 | 1994-11-01 | Cubic Automatic Revenue Collection Group | Magnetically permeable electrostatic shield |
US5371346A (en) | 1992-07-31 | 1994-12-06 | Inventio Ag | Programmable card actuated apparatus for vending newspapers |
USD353135S (en) * | 1991-11-27 | 1994-12-06 | Gemplus Card International | Connecting terminal for chip cards |
USD353136S (en) * | 1992-03-12 | 1994-12-06 | Gemplus Card International | Connecting terminal for chip cards |
US5399903A (en) | 1990-08-15 | 1995-03-21 | Lsi Logic Corporation | Semiconductor device having an universal die size inner lead layout |
USD357242S (en) * | 1991-11-04 | 1995-04-11 | Gemplus Card International | Connecting terminal for chip cards |
USD357909S (en) * | 1991-07-11 | 1995-05-02 | Gemplus Card International | Connecting terminal for chip cards |
USD358142S (en) * | 1992-03-02 | 1995-05-09 | Gemplus Card International | Connecting terminal for chip cards |
US5434395A (en) | 1990-03-05 | 1995-07-18 | Jean-Rene Storck | Method and device for effecting a transaction between a first and at least one second data carrier and carrier used for this purpose |
USD365092S (en) * | 1993-08-12 | 1995-12-12 | Siemens Aktiengesellschaft | Chipcard module |
US5486687A (en) | 1992-01-14 | 1996-01-23 | Gemplus Card International | Memory card having a recessed portion with contacts connected to an access card |
US5506499A (en) | 1995-06-05 | 1996-04-09 | Neomagic Corp. | Multiple probing of an auxilary test pad which allows for reliable bonding to a primary bonding pad |
USD369157S (en) | 1995-03-16 | 1996-04-23 | Kabushiki Kaisha Toshiba | IC card |
US5514862A (en) | 1994-05-20 | 1996-05-07 | At&T Corp. | Portable data carrier |
US5523697A (en) | 1993-09-03 | 1996-06-04 | Micron Technology, Inc. | Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof |
US5531145A (en) * | 1990-03-07 | 1996-07-02 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method for making IC card having severable mini chip card |
US5550406A (en) | 1992-06-04 | 1996-08-27 | Lsi Logic Corporation | Multi-layer tab tape having distinct signal, power and ground planes and wafer probe card with multi-layer substrate |
US5550402A (en) | 1992-11-27 | 1996-08-27 | Esec Sempac S.A. | Electronic module of extra-thin construction |
US5554940A (en) | 1994-07-05 | 1996-09-10 | Motorola, Inc. | Bumped semiconductor device and method for probing the same |
USD375303S (en) * | 1994-11-30 | 1996-11-05 | Solaic (Societe Anonyme) | Smart card with plural external contact regions |
US5581065A (en) * | 1993-08-02 | 1996-12-03 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
US5583733A (en) | 1994-12-21 | 1996-12-10 | Polaroid Corporation | Electrostatic discharge protection device |
US5598032A (en) | 1994-02-14 | 1997-01-28 | Gemplus Card International | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
US5599203A (en) | 1995-10-31 | 1997-02-04 | The Whitaker Corporation | Smart card and smart card connector |
US5612532A (en) | 1993-09-01 | 1997-03-18 | Kabushiki Kaisha Toshiba | Thin IC card and method for producing the same |
USD379006S (en) | 1995-05-30 | 1997-04-29 | Solaic (Societe Anonyme) | Smart card with m-shaped isolation region |
US5637858A (en) | 1993-12-23 | 1997-06-10 | Giesecke & Devrient Gmbh | Method for producing identity cards |
US5647122A (en) * | 1994-06-15 | 1997-07-15 | U.S. Philips Corporation | Manufacturing method for an integrated circuit card |
US5671525A (en) | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
USD384971S (en) | 1996-08-28 | 1997-10-14 | Transaction Technology, Inc. | Smart card with chip bearing a source identifier |
US5688716A (en) | 1994-07-07 | 1997-11-18 | Tessera, Inc. | Fan-out semiconductor chip assembly |
USD387746S (en) * | 1996-05-29 | 1997-12-16 | Kabushiki Kaisha Toshiba | IC module |
USD387747S (en) * | 1996-05-29 | 1997-12-16 | Kabushiki Kaisha Toshiba | IC module |
USD388066S (en) | 1996-05-29 | 1997-12-23 | Kabushiki Kaisha Toshiba | IC module |
USD389130S (en) * | 1996-05-29 | 1998-01-13 | Kabushiki Kaisha Toshiba | IC module |
US5710421A (en) | 1995-03-31 | 1998-01-20 | Tokai-Rika-Denki-Seisakusho Kabushiki Kaisha | IC card |
USD393458S (en) | 1995-06-19 | 1998-04-14 | Gemplus | Connecting terminal for chip cards |
US5776796A (en) | 1994-05-19 | 1998-07-07 | Tessera, Inc. | Method of encapsulating a semiconductor package |
US5796570A (en) | 1996-09-19 | 1998-08-18 | National Semiconductor Corporation | Electrostatic discharge protection package |
US5808758A (en) | 1994-12-23 | 1998-09-15 | Geisecke & Devrient, Gmbh | Data carrier with an optically variable element |
US5815426A (en) | 1996-08-13 | 1998-09-29 | Nexcom Technology, Inc. | Adapter for interfacing an insertable/removable digital memory apparatus to a host data part |
US5822190A (en) * | 1996-06-11 | 1998-10-13 | Kabushiki Kaisha Toshiba | Card type memory device and a method for manufacturing the same |
US5834755A (en) | 1994-12-08 | 1998-11-10 | Giesecke & Devrient Gmbh | Electronic module and a data carrier having an electronic module |
US5834340A (en) | 1993-06-01 | 1998-11-10 | Mitsubishi Denki Kabushiki Kaisha | Plastic molded semiconductor package and method of manufacturing the same |
US5850690A (en) * | 1995-07-11 | 1998-12-22 | De La Rue Cartes Et Systemes Sas | Method of manufacturing and assembling an integrated circuit card |
US5864463A (en) | 1992-11-13 | 1999-01-26 | Seiko Epson Corporation | Electronic device having connector with rows of terminals divided by ribs and ground or power terminal adjacent ribs |
USD405779S (en) * | 1996-10-25 | 1999-02-16 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard |
USD406822S (en) * | 1997-03-06 | 1999-03-16 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
US5888624A (en) | 1994-02-04 | 1999-03-30 | Giesecke & Devrient Gmbh | Data carrier with an electronic module and a method for producing the same |
US5891745A (en) | 1994-10-28 | 1999-04-06 | Honeywell Inc. | Test and tear-away bond pad design |
US5898223A (en) | 1997-10-08 | 1999-04-27 | Lucent Technologies Inc. | Chip-on-chip IC packages |
US5925445A (en) | 1996-07-12 | 1999-07-20 | Nec Corporation | Printed wiring board |
US5932866A (en) | 1995-05-19 | 1999-08-03 | Dai Nippon Printing Co., Ltd. | Optical card with a built-in IC module technical field |
US5965866A (en) | 1995-04-05 | 1999-10-12 | Orga Kartensysteme Gmbh | Pass card having a semiconductor chip module attached by a microencapsulated adhesive |
US5969951A (en) | 1997-03-13 | 1999-10-19 | Orga Kartensysteme Gmbh | Method for manufacturing a chip card and chip card manufactured in accordance with said method |
US5975420A (en) | 1995-04-13 | 1999-11-02 | Dai Nippon Printing Co., Ltd. | Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
USD416246S (en) | 1998-08-19 | 1999-11-09 | The Standard Register Company | Contact layout for a smart card |
US5995006A (en) | 1995-09-05 | 1999-11-30 | Intermec Ip Corp. | Radio frequency tag |
US6006987A (en) | 1996-12-20 | 1999-12-28 | Siemens Aktiengesellschaft | Removable card carrier assembly |
US6025997A (en) | 1995-11-03 | 2000-02-15 | Siemens Aktiengesellschaft | Chip module for semiconductor chips having arbitrary footprints |
US6027028A (en) | 1996-07-26 | 2000-02-22 | Koninklijke Kpn N.V. | Connector formed as a sleeve pushed over a standard chip card |
US6036099A (en) | 1995-10-17 | 2000-03-14 | Leighton; Keith | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
US6054774A (en) | 1994-03-22 | 2000-04-25 | Kabushiki Kaisha Toshiba | Thin type semiconductor package |
USD424043S (en) | 1998-04-13 | 2000-05-02 | Nihon Denshizairyo Kabushiki Kaisha | Ring for probe card |
USD424539S (en) | 1998-04-13 | 2000-05-09 | Nihon Denshizairyo Kabushiki Kaisha | Ring for probe card |
US6065681A (en) * | 1997-01-29 | 2000-05-23 | Orga Kartensysteme Gmbh | Method of producing data carriers |
US6072698A (en) | 1995-09-27 | 2000-06-06 | Siemens Aktiengesellschaft | Chip module with heat insulation for incorporation into a chip card |
US6081182A (en) | 1996-11-22 | 2000-06-27 | Matsushita Electric Industrial Co., Ltd. | Temperature sensor element and temperature sensor including the same |
USD427577S (en) * | 1997-12-12 | 2000-07-04 | Motorola, Inc. | Portable data carrier |
US6095423A (en) | 1996-08-14 | 2000-08-01 | Siemens Aktiengesellschaft | Method of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card module |
US6109530A (en) | 1998-07-08 | 2000-08-29 | Motorola, Inc. | Integrated circuit carrier package with battery coin cell |
US6112997A (en) * | 1996-03-08 | 2000-09-05 | Robert Bosch Gmbh | Chip card and chip card reader |
US6141210A (en) | 1993-07-23 | 2000-10-31 | Kabushiki Kaisha Toshiba | External storage device |
US6145035A (en) | 1999-02-25 | 2000-11-07 | Dallas Semiconductor Corporation | Card cradle system and method |
US6142381A (en) | 1996-03-15 | 2000-11-07 | Finn; David | Contact or contactless chip card with brace |
US6161761A (en) | 1998-07-09 | 2000-12-19 | Motorola, Inc. | Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly |
US6175287B1 (en) | 1997-05-28 | 2001-01-16 | Raytheon Company | Direct backside interconnect for multiple chip assemblies |
US6184477B1 (en) | 1998-12-02 | 2001-02-06 | Kyocera Corporation | Multi-layer circuit substrate having orthogonal grid ground and power planes |
US6191951B1 (en) | 1997-03-03 | 2001-02-20 | Infineon Technologies Ag | Smart card module and smart card including a smart card module |
US6193163B1 (en) * | 1998-08-31 | 2001-02-27 | The Standard Register Company | Smart card with replaceable chip |
US6197688B1 (en) | 1998-02-12 | 2001-03-06 | Motorola Inc. | Interconnect structure in a semiconductor device and method of formation |
US6202931B1 (en) | 1996-06-07 | 2001-03-20 | Schlumberger Systemes | Memory card and method for producing same |
US6223989B1 (en) | 1996-08-05 | 2001-05-01 | Gemplus S.C.A. | Method for making smart cards, and resulting cards |
USD443298S1 (en) | 1999-09-01 | 2001-06-05 | American Express Travel Related Services Company, Inc. | Card with an ornamental rectangle, machine readable stripe and IC chip |
US20010005291A1 (en) | 1995-02-03 | 2001-06-28 | Kabushiki Kaisha Toshiba | Information storage apparatus and information processing apparatus using the same |
US20010011685A1 (en) | 1997-01-15 | 2001-08-09 | Manfred Fries | Smart card |
US20010012682A1 (en) | 1999-11-29 | 2001-08-09 | Georges Kayanakis | Manufacturing process of a hybrid contact-contactless smart card with an antenna support made of fibrous material |
US6276609B1 (en) | 1998-07-07 | 2001-08-21 | U.S. Philips Corporation | Data carrier provided data processing means and current peak pattern suppression means |
US6288904B1 (en) | 1996-09-30 | 2001-09-11 | Infineon Technologies Ag | Chip module, in particular for implantation in a smart card body |
US6293470B1 (en) | 1997-04-29 | 2001-09-25 | Swedish Advanced Technology Systems Ab | Smartcard and method for its manufacture |
US6313524B1 (en) | 1996-09-23 | 2001-11-06 | Infineon Technologies Ag | Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate |
USD450854S1 (en) * | 1999-11-04 | 2001-11-20 | Therasense, Inc. | Glucose strip |
US6320751B2 (en) * | 1997-06-23 | 2001-11-20 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier and method for producing the same |
US6326683B1 (en) | 1996-05-17 | 2001-12-04 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip |
US6329962B2 (en) * | 1998-08-04 | 2001-12-11 | Telefonaktiebolaget Lm Ericsson (Publ) | Multiple band, multiple branch antenna for mobile phone |
USD452243S1 (en) | 2000-06-07 | 2001-12-18 | Sandisk Corporation | Integrated circuit memory card |
USD452865S1 (en) | 1998-04-01 | 2002-01-08 | Sandisk Corporation | Removable memory card for use with portable electronic devices |
USD452864S1 (en) | 2000-06-12 | 2002-01-08 | Sandisk Corporation | Electronic memory card |
US6343364B1 (en) | 2000-07-13 | 2002-01-29 | Schlumberger Malco Inc. | Method and device for local clock generation using universal serial bus downstream received signals DP and DM |
US6351405B1 (en) | 1999-09-16 | 2002-02-26 | Samsung Electronics Co., Ltd. | Pad for integrated circuit device which allows for multiple probing and reliable bonding and integrated circuit device including the pad |
US20020023963A1 (en) * | 2000-08-31 | 2002-02-28 | Pacusma Company, Ltd. | Integrated circuit card with multiple integral electronic modules |
US6370029B1 (en) | 1997-01-15 | 2002-04-09 | Transaction Technology, Inc. | Method and system for creating and using an electrostatic discharge (ESD) protected logotype contact module with a smart card |
US6369407B1 (en) | 1999-02-09 | 2002-04-09 | Rohm Co., Ltd. | Semiconductor device |
US20020049887A1 (en) | 2000-08-31 | 2002-04-25 | Naomasa Takahashi | Information-processing apparatus, information-processing method, memory card and program storage medium |
US6378774B1 (en) | 1997-11-14 | 2002-04-30 | Toppan Printing Co., Ltd. | IC module and smart card |
USD456414S1 (en) * | 1995-06-19 | 2002-04-30 | Gemplus | Connecting terminal for chip cards |
US20020069392A1 (en) | 2000-12-05 | 2002-06-06 | Kazutaka Saitoh | Smart card and circuitry layout thereof |
US6402032B1 (en) | 1998-12-03 | 2002-06-11 | Integrated Technology Express Inc. | Integrated smart card reader and computer input/output IC system |
US6410355B1 (en) | 1998-06-11 | 2002-06-25 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
US6429112B1 (en) | 1994-07-07 | 2002-08-06 | Tessera, Inc. | Multi-layer substrates and fabrication processes |
US6433285B2 (en) | 2000-03-30 | 2002-08-13 | Matsushita Electronics Corporation | Printed wiring board, IC card module using the same, and method for producing IC card module |
US20020110955A1 (en) | 1999-06-15 | 2002-08-15 | Philippe Patrice | Electronic device including at least one chip fixed to a support and a method for manufacturing such a device |
US6439464B1 (en) | 2000-10-11 | 2002-08-27 | Stmicroelectronics, Inc. | Dual mode smart card and associated methods |
US6448638B1 (en) * | 1998-01-22 | 2002-09-10 | Gemplus | Integrated circuit contact card, comprising a detachable minicard |
US6454164B1 (en) | 1995-08-09 | 2002-09-24 | Hitachi, Ltd. | Pocket-size information transfer apparatus having dual IC card insertion slots and IC card using the same |
US6460773B1 (en) | 1999-10-12 | 2002-10-08 | Fujitsu Limited | Combination card having an IC chip module |
US6462273B1 (en) | 2001-03-16 | 2002-10-08 | Micron Technology, Inc. | Semiconductor card and method of fabrication |
US20020169943A1 (en) * | 1998-02-06 | 2002-11-14 | Thorwald Rabeler | Chip card with integrated circuit |
US6483038B2 (en) | 2000-05-23 | 2002-11-19 | Samsung Electronics Co., Ltd. | Memory card |
US20020170974A1 (en) * | 2001-05-16 | 2002-11-21 | Matsushita Electric Industrial Co., Ltd. | Hybrid IC card |
US20020177255A1 (en) * | 1998-10-02 | 2002-11-28 | Shinko Electric Industries Co., Ltd | Process for manufacturing ic card |
US6490667B1 (en) | 2000-09-18 | 2002-12-03 | Kabushiki Kaisha Toshiba | Portable electronic medium |
US20020186542A1 (en) | 2001-06-11 | 2002-12-12 | Samsung Electro-Mechanics Co., Ltd. | Heat sink of module with built-in IC |
US20030016116A1 (en) | 2001-07-23 | 2003-01-23 | Blaha Charles A. | Method of depositing a thin metallic film and related apparatus |
US20030016507A1 (en) | 2000-02-02 | 2003-01-23 | Jurgen Fischer | Portable data carrier |
US20030024995A1 (en) | 2001-07-27 | 2003-02-06 | Storcard, Inc. | Smart card with rotating storage |
US20030024996A1 (en) * | 2001-07-31 | 2003-02-06 | Koninklijke Philips Electronics N.V. | Data carrier comprising an array of contacts |
US6542444B1 (en) | 1999-03-29 | 2003-04-01 | Omd Productions Ag | Carrier card capable of storing information data in CD or DVD formats |
US6543690B2 (en) | 2000-12-04 | 2003-04-08 | Schlumberger Malco, Inc. | Method and apparatus for communicating with a host |
US20030085287A1 (en) | 2001-11-06 | 2003-05-08 | Gray Robert J | Smart card having additional connector pads |
US6568600B1 (en) | 1999-01-19 | 2003-05-27 | Bull Cp8 | Chip card equipped with a loop antenna, and associated micromodule |
US6572015B1 (en) | 2001-07-02 | 2003-06-03 | Bellsouth Intellectual Property Corporation | Smart card authorization system, apparatus and method |
US20030103301A1 (en) | 2001-12-03 | 2003-06-05 | Fechner Paul S. | On chip smart capacitors |
US20030102544A1 (en) | 2001-12-03 | 2003-06-05 | Masataka Nishikawa | Semiconductor module and production method therefor and module for IC cards and the like |
US6581122B1 (en) | 1998-03-26 | 2003-06-17 | Gemplus | Smart card which operates with the USB protocol |
US6581830B1 (en) * | 1996-06-17 | 2003-06-24 | Robert Bosch Gmbh | Card reader with multiple chip cards slot opening |
US20030116634A1 (en) | 2001-11-29 | 2003-06-26 | Masahiko Tanaka | Non-contact IC card |
US6585165B1 (en) | 1999-06-29 | 2003-07-01 | Sony Chemicals Corp. | IC card having a mica capacitor |
US6592042B1 (en) | 1998-02-13 | 2003-07-15 | Schlumberger Systemes | Method for making a card with integrated circuit |
US6601770B1 (en) | 1997-05-19 | 2003-08-05 | Rohm Co., Ltd. | Response device in contact/contactless IC card communication system |
US6612498B1 (en) | 1999-03-11 | 2003-09-02 | Nokia Mobile Phones Ltd. | Method and means for using additional cards in a mobile station |
US6618258B2 (en) | 2001-05-10 | 2003-09-09 | Hewlett-Packard Development, L.P. | Portable memory card system |
US6628240B2 (en) | 2000-11-08 | 2003-09-30 | American Pacific Technology | Method and apparatus for rapid staking of antennae in smart card manufacture |
US6632997B2 (en) | 2001-06-13 | 2003-10-14 | Amkor Technology, Inc. | Personalized circuit module package and method for packaging circuit modules |
US6634561B1 (en) | 1999-06-24 | 2003-10-21 | Sandisk Corporation | Memory card electrical contact structure |
US6642611B2 (en) | 1998-03-26 | 2003-11-04 | Kabushiki Kaisha Toshiba | Storage apparatus, card type storage apparatus, and electronic apparatus |
US20030213849A1 (en) * | 2002-05-20 | 2003-11-20 | Luu Daniel V. H. | Contactless transaction card and adapter therefor |
US20030224995A1 (en) | 2001-12-21 | 2003-12-04 | Khan Nisar Ahmed | Treatment of burns |
US6659355B1 (en) | 1999-08-19 | 2003-12-09 | Orga Kartensysteme Gmbh | Method for producing a multi-layer chip card |
US20030226901A1 (en) | 2002-06-11 | 2003-12-11 | Kim Deok-Heung | IC card and manufacturing method thereof |
US6669487B1 (en) | 2000-04-28 | 2003-12-30 | Hitachi, Ltd. | IC card |
US6694399B1 (en) | 2000-09-14 | 2004-02-17 | Schlumberger Malco, Inc. | Method and device for universal serial bus smart card traffic signaling |
US20040031857A1 (en) | 2002-08-15 | 2004-02-19 | Sony Corporation | Non-contact IC card |
US20040037145A1 (en) | 1999-05-28 | 2004-02-26 | Kenji Tagawa | Semiconductor memory card, apparatus for recording data onto the semiconductor memory card, and apparatus for reproducing data of the semiconductor memory card |
USD487747S1 (en) | 2003-01-08 | 2004-03-23 | C-One Technology Corporation | Removable electronic card |
US20040061234A1 (en) | 2002-09-27 | 2004-04-01 | Medtronic Minimed, Inc. | High reliability multlayer circuit substrates and methods for their formation |
US6717801B1 (en) | 2000-09-29 | 2004-04-06 | Hewlett-Packard Development Company, L.P. | Standardized RF module insert for a portable electronic processing device |
US6720927B2 (en) * | 2002-01-09 | 2004-04-13 | Agere Systems, Inc. | System for deploying an antenna of an integrated circuit card |
USD488818S1 (en) | 2001-06-27 | 2004-04-20 | Fluidigm Corporation | Fluidic rotary mixer square icon for a display screen |
US20040089717A1 (en) | 2002-11-13 | 2004-05-13 | Sandisk Corporation | Universal non-volatile memory card used with various different standard cards containing a memory controller |
US20040113265A1 (en) | 2002-12-17 | 2004-06-17 | Intel Corporation | Localized backside chip cooling with integrated smart valves |
US20040117317A1 (en) | 2002-04-18 | 2004-06-17 | Feinman Jason S. | Apparatus and methods for a united states postal service smart card system |
USD492688S1 (en) * | 2002-12-09 | 2004-07-06 | Sandisk Corporation | Memory card |
USD493798S1 (en) | 2003-10-13 | 2004-08-03 | C-One Technology Corporation | Memory card |
US6793144B2 (en) | 2003-01-10 | 2004-09-21 | Atmel Corporation | Means for communicating with USB smart cards using full-speed or high-speed transfers |
US20040194861A1 (en) | 2001-08-23 | 2004-10-07 | Dowa Mining Co., Ltd. | Radiation plate and power semiconductor module ic package |
US6803114B1 (en) | 1999-07-01 | 2004-10-12 | Schlumberger Systemes | Manufacturing process for laminated cards with intermediate PETG layer |
US6803666B2 (en) | 2001-03-27 | 2004-10-12 | Kabushiki Kaisha Toshiba | Semiconductor chip mounting substrate and semiconductor device using the same |
US20040211843A1 (en) * | 2003-01-30 | 2004-10-28 | Infineon Technologies Flash Gmbh & Co. Kg | Security memory card and production method |
US6811082B2 (en) * | 2001-09-18 | 2004-11-02 | Jacob Y. Wong | Advanced magnetic stripe bridge (AMSB) |
US6817533B2 (en) | 2003-01-15 | 2004-11-16 | Power Digital Card Co., Ltd. | Digital card-structure |
US20040232246A1 (en) * | 2001-09-05 | 2004-11-25 | Gilles Dhers | Chip card comprising a more or less rectangular flat support |
US20040238857A1 (en) | 2001-08-28 | 2004-12-02 | Tessera, Inc. | High frequency chip packages with connecting elements |
US20040245347A1 (en) | 2003-04-10 | 2004-12-09 | Sony Corporation | Method for making IC card |
US20040252070A1 (en) * | 2003-06-12 | 2004-12-16 | Huey-Ru Chuang | Printed dual dipole antenna |
US20040259423A1 (en) | 2001-09-24 | 2004-12-23 | Didier Elbaz | Dongle which is intended to be connected to a port of a telecommunications device |
US20050007744A1 (en) | 2003-07-10 | 2005-01-13 | Yoshitaka Okita | IC module and IC card |
US20050011671A1 (en) | 2003-07-17 | 2005-01-20 | Takiar Hem P. | Memory card with and without enclosure |
USD501560S1 (en) * | 2003-12-03 | 2005-02-01 | Diabetes Diagnostics, Inc. | Electrochemical test strip |
US6851618B2 (en) | 2001-09-14 | 2005-02-08 | Ask S.A. | Contactless or hybrid contact-contactless smart card with reinforced connection of the electronic module |
US6856235B2 (en) | 1996-04-18 | 2005-02-15 | Tessera, Inc. | Methods for manufacturing resistors using a sacrificial layer |
US20050035909A1 (en) * | 2003-08-16 | 2005-02-17 | Lin Wen Hsiung | Card device having S-shaped printed antenna |
US20050037540A1 (en) | 2001-10-30 | 2005-02-17 | Angel Pepe | Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers and a method of making the same |
US20050045729A1 (en) * | 2003-08-29 | 2005-03-03 | Semiconductor Energy Laboratory Co., Ltd. | IC card |
US6865086B2 (en) | 2002-07-09 | 2005-03-08 | Micron Technology, Inc. | Apparatus and method to secure an adaptor to a reduced-sized memory card |
US20050082636A1 (en) | 2001-03-30 | 2005-04-21 | Kyocera Corporation | Tunable thin film capacitor |
US20050099269A1 (en) | 2003-11-10 | 2005-05-12 | Diorio Christopher J. | Method and apparatus to configure an RFID system to be adaptable to a plurality of environmental conditions |
US6896189B2 (en) | 2000-05-03 | 2005-05-24 | Axalto Sa | Card comprising electrical contacts |
US6910635B1 (en) | 2002-10-08 | 2005-06-28 | Amkor Technology, Inc. | Die down multi-media card and method of making same |
US20050139489A1 (en) * | 2003-10-31 | 2005-06-30 | Davies Oliver William H. | Method of reducing the effect of direct and mediated interference current in an electrochemical test strip |
US20050156310A1 (en) | 2004-01-14 | 2005-07-21 | International Business Machines Corporation | Method and apparatus for providing optoelectronic communication with an electronic device |
US6922780B1 (en) | 2000-08-08 | 2005-07-26 | The Directv Group, Inc. | Dual chip smart card and method for using same |
US20050194453A1 (en) * | 2001-07-27 | 2005-09-08 | Storcard, Inc. | Enhanced smart card with rotating storage |
US20050197169A1 (en) | 2002-08-12 | 2005-09-08 | Chang-Bai Son | Battery pack having a dual-type smart card interface |
US20050202667A1 (en) | 2001-12-03 | 2005-09-15 | University Of Southern California | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
US20050212690A1 (en) | 2002-08-26 | 2005-09-29 | Dai Nippon Printing Co., Ltd. | Sim, sim holder, ic module, ic card and ic card holder |
US20050218235A1 (en) * | 2004-03-31 | 2005-10-06 | Industrial Technology Research Institute | Editable radio frequency identification device and system for editing the same |
US20050224588A1 (en) * | 2004-03-30 | 2005-10-13 | Infineon Technologies Ag | Transmission interface |
US20050231921A1 (en) * | 2002-05-24 | 2005-10-20 | Chie Noda | Chip card of reduced size with backward compatibility and adapter for a reduced size chip card |
US20050230485A1 (en) * | 2004-04-20 | 2005-10-20 | Ross Bruce E | Specially shaped smart card for compact applications |
US20050236490A1 (en) * | 2002-03-15 | 2005-10-27 | Jean-Pierre Fortune | Chip card device for transmitting digital information using acoustic means |
US20050247797A1 (en) * | 1998-04-17 | 2005-11-10 | Diebold, Incorporated | Multi-account card with magnetic stripe data and electronic ink display being changeable to correspond to a selected account |
US6964377B1 (en) * | 1999-02-17 | 2005-11-15 | Giesecke & Devrient Gmbh | Portable data support with a detachable mini chip card |
US20050252978A1 (en) * | 2004-05-11 | 2005-11-17 | Renesas Technology Corp. | IC card module |
US20050253239A1 (en) | 2004-04-26 | 2005-11-17 | Renesas Technology Corp. | Memory card |
USD512512S1 (en) * | 2003-05-21 | 2005-12-06 | Wachovia Bank, National Association | Blood glucose test strip |
US20050281010A1 (en) | 2004-06-18 | 2005-12-22 | Super Talent Electronics, Inc. | Contact pad arrangement for integrated SD/MMC system |
US6978940B2 (en) | 2001-11-06 | 2005-12-27 | Quadnovation, Inc. | Contactless SIM card carrier with detachable antenna and carrier therefor |
US20050287846A1 (en) * | 2004-06-29 | 2005-12-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film integrated circuit, and element substrate |
US20060000915A1 (en) * | 2004-07-01 | 2006-01-05 | Intermec Lp Corp. | RFID tag and method of manufacture |
US20060006241A1 (en) * | 2002-10-24 | 2006-01-12 | Alain Soyer | Data support having several electronic modules mounted on the same surface |
US6994263B2 (en) | 2002-06-28 | 2006-02-07 | Matsushita Electric Industrial Co., Ltd. | IC card |
USD516076S1 (en) | 2004-09-09 | 2006-02-28 | Samsung Electronics Co., Ltd. | Electrical flash memory card |
US20060047971A1 (en) * | 2004-08-25 | 2006-03-02 | Seiko Epson Corporation | Integrated circuit card |
US20060049263A1 (en) * | 2004-08-30 | 2006-03-09 | Smartdisplayer Technology Co., Ltd. | IC card with display panel but without batteries |
US20060054710A1 (en) * | 2003-04-10 | 2006-03-16 | Forster Ian J | RFID devices having self-compensating antennas and conductive shields |
US20060058065A1 (en) * | 2004-09-15 | 2006-03-16 | Inventec Appliances Corp. | Apparatus and a method for extending phone book records of a subscriber identification module (SIM) card |
USD517559S1 (en) | 2004-12-30 | 2006-03-21 | C-One Technology Corporation | Mixed interface integrated circuit card |
US7019981B2 (en) | 2001-08-10 | 2006-03-28 | Infineon Technologies Ag | Making contact with semiconductor chips in chip cards |
US7030316B2 (en) | 2004-01-30 | 2006-04-18 | Piranha Plastics | Insert molding electronic devices |
US7028910B2 (en) | 2001-02-02 | 2006-04-18 | Schlumberger, Systemes | Portable object with chip and antenna |
US20060097059A1 (en) * | 2004-11-08 | 2006-05-11 | Seiko Epson Corporation | IC card |
US7051429B2 (en) | 2003-04-11 | 2006-05-30 | Eastman Kodak Company | Method for forming a medium having data storage and communication capabilities |
US7059534B2 (en) | 2002-07-02 | 2006-06-13 | Konica Corporation | IC card |
USD523435S1 (en) | 2003-07-17 | 2006-06-20 | Sandisk Corporation | Memory card |
US7063538B2 (en) | 2004-11-12 | 2006-06-20 | Power Digital Card Co., Ltd. | Memory card structure |
US20060131429A1 (en) | 2004-05-04 | 2006-06-22 | Infineon Technologies Ag | Smart card |
US20060139901A1 (en) | 2004-12-28 | 2006-06-29 | Virgile Meireles | Double-sided electronic module for hybrid smart card |
US20060142063A1 (en) | 2002-08-30 | 2006-06-29 | Stmicroelectronics S.A. | Antenna communication method for a chip card and associated device |
US20060145929A1 (en) * | 2005-01-06 | 2006-07-06 | Hon Hai Precision Industry Co., Ltd. | UWB printed antenna |
US20060152417A1 (en) * | 2003-06-20 | 2006-07-13 | Zhinong Ying | Integrated antenna and speaker |
USD525248S1 (en) | 2003-07-17 | 2006-07-18 | Sandisk Corporation | Memory card |
US7083107B2 (en) | 2002-09-30 | 2006-08-01 | Matsushita Electric Industrial Co., Ltd. | Memory card |
USD525978S1 (en) | 2003-07-17 | 2006-08-01 | Sandisk Corporation | Memory card |
US7088006B2 (en) | 2004-01-28 | 2006-08-08 | Infineon Technologies Ag | Integrated circuit arrangement |
US20060175418A1 (en) * | 2005-02-04 | 2006-08-10 | Chun-Hsin Ho | Method for providing additional service based on dual UICC |
US20060175417A1 (en) * | 2005-02-04 | 2006-08-10 | Chun-Hsin Ho | Dual integrated circuit card system |
US7094106B2 (en) | 2003-03-10 | 2006-08-22 | Matsushita Electric Works, Ltd. | Adaptor for memory card |
US7094633B2 (en) | 2003-06-23 | 2006-08-22 | Sandisk Corporation | Method for efficiently producing removable peripheral cards |
US20060194479A1 (en) | 2005-02-28 | 2006-08-31 | Renesas Technology Corp. | Adapter for a memory card and a memory card |
US7102891B1 (en) | 2003-07-23 | 2006-09-05 | Amkor Technology, Inc. | Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor |
US20060202034A1 (en) | 2000-08-04 | 2006-09-14 | Wallace Robert F | Use of Small Electronic Circuit Cards With Different Interfaces in an Electronic System |
US20060205280A1 (en) | 2005-03-11 | 2006-09-14 | Renesas Technology Corp. | Semiconductor device and a method for manufacturing the same |
USD529031S1 (en) | 2004-07-27 | 2006-09-26 | Siliconware Precision Industries Co., Ltd. | IC card type circuit module |
USD533556S1 (en) | 2002-10-15 | 2006-12-12 | Matsushita Electric Industrial Co., Ltd. | IC memory card |
US20060278722A1 (en) * | 2005-06-13 | 2006-12-14 | Kabushiki Kaisha Toshiba | Semiconductor device, method of manufacturing the same, and information managing system for the same |
US20060288146A1 (en) | 2005-06-21 | 2006-12-21 | Power Digital Card Co., Ltd. | Dual connecting interface memory card |
US20060288145A1 (en) | 2005-06-21 | 2006-12-21 | Power Digital Card Co., Ltd. | Dual connecting interface memory card |
USD534537S1 (en) | 2004-01-06 | 2007-01-02 | Wildseed Ltd. | Connecting terminal for chip cards |
US20070013396A1 (en) | 2005-07-14 | 2007-01-18 | Dong-Han Kim | Universal pcb and smart card using the same |
US20070025092A1 (en) | 2005-08-01 | 2007-02-01 | Baik-Woo Lee | Embedded actives and discrete passives in a cavity within build-up layers |
US20070023532A1 (en) | 2005-07-18 | 2007-02-01 | Narendra Siva G | Electronic stripe cards |
US20070026740A1 (en) | 2005-07-27 | 2007-02-01 | Power Digital Card Co., Ltd. | Adapter card structure |
US20070032268A1 (en) * | 2005-08-02 | 2007-02-08 | Gotfried Bradley L | Communications device and card |
US7176060B2 (en) | 2003-09-10 | 2007-02-13 | Renesas Technology Corp. | Integrated circuit card and a method of manufacturing the same |
US7179129B1 (en) | 2006-07-12 | 2007-02-20 | Chin-Hwa Hwang | 2-in-1 SD type memory card adapter |
USD537081S1 (en) | 2003-07-17 | 2007-02-20 | Sandisk Corporation | Memory card |
US7193161B1 (en) | 2006-02-15 | 2007-03-20 | Sandisk Corporation | SiP module with a single sided lid |
US20070080869A1 (en) * | 2005-10-12 | 2007-04-12 | Benq Corporation | Antenna structure on circuit board |
US20070082703A1 (en) * | 2004-10-28 | 2007-04-12 | Koninklijke Kpn N.V. | Method and system for providing wireless identification |
US20070095910A1 (en) | 2005-10-31 | 2007-05-03 | Research In Motion Limited | Combined battery and smart card |
US20070108298A1 (en) * | 2005-11-14 | 2007-05-17 | Sebastien Kalck | Smart Card Body, Smart Card and Manufacturing Process for the Same |
US20070108521A1 (en) | 2003-07-04 | 2007-05-17 | Ronald Dekker | Flexible semiconductor device and identification label |
US20070108294A1 (en) * | 2003-09-29 | 2007-05-17 | Oberthur Card Systems Sa | Microcircuit card in several parts |
US7226318B1 (en) | 2006-07-19 | 2007-06-05 | Yun-Hsiu Lee | Card adapter structure |
US20070126099A1 (en) | 2005-12-02 | 2007-06-07 | Sony Corporation | Memory card |
US20070125866A1 (en) | 2004-02-20 | 2007-06-07 | Hirotaka Nishizawa | Ic card and a method of manufacturing the same |
US7233499B2 (en) | 2004-07-28 | 2007-06-19 | C-One Technology Corporation | Extended memory card |
US20070138301A1 (en) | 2005-10-14 | 2007-06-21 | Infineon Technologies Ag | Smart card module |
US7234644B2 (en) | 2000-01-25 | 2007-06-26 | Renesas Technology Corp. | IC card |
US20070145133A1 (en) | 2005-12-22 | 2007-06-28 | Lg Electronics Inc. | Method for a more efficient use of an interface between a smart card and a device, associated smart card and device |
US7239973B2 (en) | 2002-07-19 | 2007-07-03 | Thomson Licensing | Method and test adapter for testing an appliance having a smart card reader |
US20070152072A1 (en) | 2005-12-30 | 2007-07-05 | Incard S.A. | Ic card with improved plated module |
US20070153487A1 (en) | 2005-12-30 | 2007-07-05 | Incard S.A. | Plated module for an ic card |
US7242079B2 (en) | 2002-10-15 | 2007-07-10 | Axalto S.A. | Method of manufacturing a data carrier |
US20070164119A1 (en) * | 2006-01-16 | 2007-07-19 | Liu Kwang W | Electronic business card and data transceiver |
US20070213096A1 (en) * | 2004-04-21 | 2007-09-13 | Valter Bella | Subscriber Identification Card Performing Radio Transceiver Functionality for Long Range Applications |
USD552099S1 (en) | 2005-05-24 | 2007-10-02 | Renesas Technology Corporation | Memory card |
USD552098S1 (en) | 2005-05-24 | 2007-10-02 | Renesas Technology Corporation | Memory card |
US20070228536A1 (en) | 2006-03-29 | 2007-10-04 | Sony Corporation | Memory card |
US20070279312A1 (en) * | 2006-06-02 | 2007-12-06 | Hon Hai Precision Industry Co., Ltd. | Planar Antenna |
US20070290049A1 (en) * | 2006-06-19 | 2007-12-20 | Intelcard, Inc. | Interactive transaction cards |
US20080006703A1 (en) * | 2001-12-10 | 2008-01-10 | Ortigosa Vallejo Juan I | Contactless identification device |
US20080020800A1 (en) * | 2006-07-21 | 2008-01-24 | Yingzan Xu | Two-in-one connector for both sim card of mobile phone and memory card |
US20080054079A1 (en) * | 2005-05-09 | 2008-03-06 | Mullen Jeffrey D | Dynamic credit card with magnetic stripe and embedded encoder and methods for using the same to provide a copy-proof credit card |
US20080054493A1 (en) | 2006-08-31 | 2008-03-06 | Michael Leddige | Systems and arrangements for interconnecting integrated circuit dies |
US20080061150A1 (en) * | 2006-09-08 | 2008-03-13 | Simon Phillips | Identification token and method of making identification token |
US20080061151A1 (en) * | 2006-09-08 | 2008-03-13 | Simon Phillips | Identification of installable card |
US20080076474A1 (en) * | 2006-09-21 | 2008-03-27 | Taisys Technologies Co., Ltd. | Laminated card assembly |
US20080083831A1 (en) * | 2006-09-15 | 2008-04-10 | Sandisk Il Ltd. | Ternary SIM Card Delivery |
USD566723S1 (en) * | 2006-03-08 | 2008-04-15 | Disney Enterpises, Inc. | Portion of a computer screen with an icon image |
US7359204B1 (en) | 2006-02-15 | 2008-04-15 | Amkor Technology, Inc. | Multiple cover memory card |
US20080088038A1 (en) | 2006-10-11 | 2008-04-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Bond pad structures and integrated circuit chip having the same |
US20080099559A1 (en) | 2006-10-31 | 2008-05-01 | Macronix International Co., Ltd. | Dual Interface SIM Card Adapter with Detachable Antenna |
US20080099932A1 (en) | 2000-10-20 | 2008-05-01 | Silverbrook Research Pty Ltd. | Resilient carrier assembly for an integrated circuit |
US20080102895A1 (en) * | 2006-10-26 | 2008-05-01 | Sandisk Il Ltd. | Method Of Extracting A Smart Card From A Smart Card Socket |
US20080101986A1 (en) * | 2006-10-31 | 2008-05-01 | Selwayan Saini | Analytical test strip with electroluminescent module |
US7369982B2 (en) | 2003-06-04 | 2008-05-06 | Stmicroelectronics, Inc. | Multi-mode smart card emulator and related methods |
US20080112852A1 (en) * | 2002-04-25 | 2008-05-15 | Neel Gary T | Test Strips and System for Measuring Analyte Levels in a Fluid Sample |
US7374721B2 (en) * | 2002-12-31 | 2008-05-20 | Transpacific Ip, Ltd. | Chip with measuring reliability and a method thereof |
USD570800S1 (en) * | 2006-11-27 | 2008-06-10 | Uniband Electronic Corp. | ISM-band printed antenna for a portion of a circuit board |
US20080135626A1 (en) * | 2004-07-13 | 2008-06-12 | Axalto Sa | Mini-Plug Sim Card with Improved Positioning Capability |
US20080135625A1 (en) * | 2004-06-09 | 2008-06-12 | Volker Waschk | Method for Producing a Portable Data Carrier |
US7388455B2 (en) | 2003-10-30 | 2008-06-17 | Avago Technologies Wireless Ip Pte Ltd | Film acoustically-coupled transformer with increased common mode rejection |
US20080144650A1 (en) | 2006-12-19 | 2008-06-19 | Infineon Technologies Ag | Apparatus for contactless transmission of data from a memory |
US20080146280A1 (en) | 2006-12-14 | 2008-06-19 | Infineon Technologies Ag | Smart card; communication device; method for selecting a communication network to be used by a communication device; computer program product |
USD571810S1 (en) * | 2006-06-20 | 2008-06-24 | Kabushiki Kaisha Toshiba | Module with built-in integrated circuits for use with IC cards |
US20080149737A1 (en) * | 2006-12-25 | 2008-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor Device and Driving Method Thereof |
US20080164324A1 (en) | 2007-01-10 | 2008-07-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Input/output pads placement for a smart card chip |
USD573154S1 (en) | 2005-06-30 | 2008-07-15 | Microsoft Corporation | Icon for a portion of a display screen |
US20080182120A1 (en) | 2007-01-28 | 2008-07-31 | Lan Chu Tan | Bond pad for semiconductor device |
USD574384S1 (en) | 2006-04-27 | 2008-08-05 | Pari Pharma Gmbh | Chip card |
USD574835S1 (en) * | 2006-10-06 | 2008-08-12 | Taisys Technologies Co., Ltd. | Miniaturized card |
US7425464B2 (en) | 2006-03-10 | 2008-09-16 | Freescale Semiconductor, Inc. | Semiconductor device packaging |
US20080223937A1 (en) * | 2007-03-15 | 2008-09-18 | Joseph Frank Preta | Smart apparatus for making secure transactions |
US7433196B1 (en) | 2004-04-14 | 2008-10-07 | Super Talent Electronics, Inc. | Card-type electronic apparatus assembly using ultrasonic joining |
US20080245877A1 (en) * | 2000-11-28 | 2008-10-09 | Pascal Billebaud | Electronic Data Storage Medium |
US20080263363A1 (en) | 2007-01-22 | 2008-10-23 | Spyrus, Inc. | Portable Data Encryption Device with Configurable Security Functionality and Method for File Encryption |
US20080265038A1 (en) * | 2004-07-23 | 2008-10-30 | Fractus, S.A. | Antenna in Package with Reduced Electromagnetic Interaction with on Chip Elements |
US20080265039A1 (en) * | 2007-04-27 | 2008-10-30 | First Data Corporation | Protected Contactless Card |
US20080272197A1 (en) * | 2003-11-04 | 2008-11-06 | Hirotaka Nishizawa | Memory card and semiconductor device |
US20080277484A1 (en) | 2005-11-08 | 2008-11-13 | Oberthur Technologies | Smart Card Producing Method and a Smart Card in Particular Provided with a Magnetic Antenna |
US20080290160A1 (en) | 2005-11-04 | 2008-11-27 | Oberthur Technologies | Contactless Electronic Microcircuit Document and Proximity Sensor |
US7458519B2 (en) | 2005-07-26 | 2008-12-02 | Sony Corporation | Card tray |
US20080299860A1 (en) | 2007-05-31 | 2008-12-04 | Jae Hee Lee | Method of fabricating smart display card having liquid crystal display unit |
US20080308640A1 (en) * | 2007-06-12 | 2008-12-18 | Taisys Technologies Co., Ltd. | Contactless stand-alone assembly |
US20080308641A1 (en) | 2007-04-10 | 2008-12-18 | Advanced Microelectronic And Automation Technology Ltd. | Smart card with switchable matching antenna |
US7485562B2 (en) | 2002-08-27 | 2009-02-03 | Micron Technology, Inc. | Method of making multichip wafer level packages and computing systems incorporating same |
US7486520B2 (en) | 2007-05-25 | 2009-02-03 | Kingston Technology Corporation, Inc. | Modular flash memory card expansion system |
US20090032593A1 (en) | 2005-04-25 | 2009-02-05 | Henrik Ljungcrantz | Smart card and smart card reader |
US20090040116A1 (en) | 2005-05-25 | 2009-02-12 | Oberthur Card Systems Sa | Electronic entity with magnetic antenna |
US7494058B2 (en) | 2004-07-01 | 2009-02-24 | American Express Travel Related Services Company, Inc. | Smartcard transaction method and system using voiceprint recognition |
US20090061933A1 (en) | 2007-08-29 | 2009-03-05 | Mxtran Inc. | Multiple Interface Card In A Mobile Phone |
US20090057417A1 (en) * | 2007-08-29 | 2009-03-05 | Renesas Technology Corp. | Ic card |
USD588080S1 (en) * | 2007-09-26 | 2009-03-10 | Gem Services, Inc. | 2021-8J matrix leadframe |
US20090069052A1 (en) | 2007-09-12 | 2009-03-12 | Devicefidelity, Inc. | Receiving broadcast signals using intelligent covers for mobile devices |
US20090065587A1 (en) * | 2007-09-10 | 2009-03-12 | Simon Phillips | Identification token and method of making identification token |
US20090065591A1 (en) | 2007-09-12 | 2009-03-12 | Seiko Epson Corporation | Smart-card chip arrangement |
US20090079053A1 (en) | 2007-09-20 | 2009-03-26 | Samsung Electronics Co., Ltd. | Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card |
US7511365B2 (en) | 2005-04-21 | 2009-03-31 | Industrial Technology Research Institute | Thermal enhanced low profile package structure |
USD589471S1 (en) * | 2006-09-28 | 2009-03-31 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
US20090084858A1 (en) * | 2006-03-27 | 2009-04-02 | Fabrizio Borracci | Method For Making A Secure Personal Card And Its Working Process |
US20090111522A1 (en) * | 2006-03-09 | 2009-04-30 | Javier Canis Robles | Smart Card and Method for Manufacturing Said Card |
US20090108063A1 (en) | 2007-09-12 | 2009-04-30 | Deepak Jain | Wirelessly Communicating Radio Frequency Signals |
US20090127345A1 (en) | 2007-11-13 | 2009-05-21 | Oberthur Technologies | Smart card, telephone comprising such a card and method for executing a command in such a card |
US20090140443A1 (en) | 2007-11-29 | 2009-06-04 | Stichting Imec Nederland | Microstructure with Enlarged Mass and Electrode Area for Kinetic to Electrical Energy Conversion |
US20090156254A1 (en) * | 2005-10-10 | 2009-06-18 | Wavecom | Radio communication device comprising at least one radio communication module and one sim card, corresponding radio communication module and sim card |
US20090160071A1 (en) | 2007-12-20 | 2009-06-25 | Geng-Shin Shen | Die rearrangement package structure using layout process to form a compliant configuration |
US20090172279A1 (en) | 2007-12-28 | 2009-07-02 | Po Yuan | System For Accessing A Removable Non-Volatile Memory Card |
US20090166895A1 (en) | 2007-12-26 | 2009-07-02 | Sanyo Electric Co., Ltd. | Circuit substrate, circuit device and manufacturing process thereof |
US20090169013A1 (en) | 2007-11-26 | 2009-07-02 | Koolspan, Inc. | System for and method of cryptographic provisioning |
US7557436B2 (en) * | 2001-08-07 | 2009-07-07 | Renesas Technology Corp. | Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes |
US20090173793A1 (en) | 2006-03-30 | 2009-07-09 | Oji Paper Co., Ltd. | Ic module, ic inlet, and ic mounted body |
USD598126S1 (en) * | 2008-06-06 | 2009-08-11 | Lifescan Scotland Limited | Electrochemical test strip |
US20090200382A1 (en) * | 2004-06-16 | 2009-08-13 | Korea Minting & Security Printing Corporation | Combi-Card and Method for Making the Same |
US20090210569A1 (en) | 2006-07-05 | 2009-08-20 | Gemalto Sa | Multi-function peripheral device, corresponding method and electronic system having a peripheral and a host communicating via a single interface |
US20090216681A1 (en) | 2008-02-26 | 2009-08-27 | Battelle Energy Alliance, Llc | Systems and methods for performing wireless financial transactions |
USD599308S1 (en) * | 2008-05-20 | 2009-09-01 | Deka Products Limited Partnership | RFID antenna circuit board |
US7587756B2 (en) * | 2002-07-09 | 2009-09-08 | American Express Travel Related Services Company, Inc. | Methods and apparatus for a secure proximity integrated circuit card transactions |
US20090224888A1 (en) | 2006-09-11 | 2009-09-10 | Gemalto Sa | Method and system for optimized reading of a radio frequency communication transponder with the aid of a passive resonant circuit |
US20090235037A1 (en) | 2006-11-07 | 2009-09-17 | Oberthur Technologies | Method and device for customizing a portable electronic entity |
USD601168S1 (en) * | 2008-10-27 | 2009-09-29 | Microsoft Corporation | Icon for a display screen |
US20090242646A1 (en) * | 2005-04-22 | 2009-10-01 | Javier Perez Aznar | Personal identification card comprising a two-dimensional image of the user |
US20090245029A1 (en) | 2004-01-24 | 2009-10-01 | Kin Fai Kam | Activity reminder smart card |
USD601521S1 (en) * | 2006-09-28 | 2009-10-06 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
US7597266B2 (en) | 2003-03-28 | 2009-10-06 | Ask S.A. | Method for making a smart card antenna on a thermoplastic support and resulting smartcard |
US20090250523A1 (en) * | 2006-03-29 | 2009-10-08 | Stmicroelectronics, Inc. | System and method for sensing biometric and non-biometric smart card devices |
US7605453B2 (en) * | 2005-08-11 | 2009-10-20 | Infineon Technologies Ag | Chip module and chip card |
US7606042B2 (en) | 2004-09-03 | 2009-10-20 | Entorian Technologies, Lp | High capacity thin module system and method |
US7607583B2 (en) | 2001-07-10 | 2009-10-27 | American Express Travel Related Services Company, Inc. | Clear contactless card |
US20090272815A1 (en) * | 2006-09-06 | 2009-11-05 | Colin Tanner | Proximity payment card with printed indication of switch location |
US7615855B2 (en) | 2002-10-08 | 2009-11-10 | Renesas Technology Corp. | IC card and method of manufacturing the same |
US7616452B2 (en) | 2004-09-03 | 2009-11-10 | Entorian Technologies, Lp | Flex circuit constructions for high capacity circuit module systems and methods |
US7619901B2 (en) | 2007-06-25 | 2009-11-17 | Epic Technologies, Inc. | Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system |
US20090302119A1 (en) * | 2006-09-12 | 2009-12-10 | Dierk Dohmann | Chip Card, and Method for the Software-Based Modification of a Chip Card |
US20100001080A1 (en) * | 2006-10-31 | 2010-01-07 | Electronics And Telecommunications Research Institute | Tag antenna structure for wireless identification and wireless identification system using the tag antenna structure |
USD608770S1 (en) * | 2008-08-21 | 2010-01-26 | Panasonic Corporation | Antenna |
US7655501B2 (en) | 2006-12-13 | 2010-02-02 | Advanced Chip Engineering Technology Inc. | Wafer level package with good CTE performance |
US20100025480A1 (en) | 2006-09-27 | 2010-02-04 | Hirotaka Nishizawa | Ic card and ic card socket |
US20100033307A1 (en) | 2008-08-08 | 2010-02-11 | Narendra Siva G | Small rfid card with integrated inductive element |
US20100033310A1 (en) | 2008-08-08 | 2010-02-11 | Narendra Siva G | Power negotation for small rfid card |
US20100032487A1 (en) * | 2006-11-06 | 2010-02-11 | Bielomatik Leuze Gmbh & Co. Kg | Chip module for an rfid system |
US7663564B2 (en) | 1997-10-08 | 2010-02-16 | Gemalto, S.A. | Method for making smart cards capable of operating with and without contact |
US20100038435A1 (en) * | 2007-03-29 | 2010-02-18 | Kabushiki Kaisha Toshiba | Information storage medium |
US7667318B2 (en) | 2003-12-03 | 2010-02-23 | Advanced Chip Engineering Technology Inc. | Fan out type wafer level package structure and method of the same |
US20100049878A1 (en) | 2004-02-12 | 2010-02-25 | Super Talent Electronics, Inc. | Differential Data Transfer For Flash Memory Card |
USD611039S1 (en) * | 2008-08-21 | 2010-03-02 | Panasonic Corporation | Antenna |
US7675151B1 (en) | 2005-06-01 | 2010-03-09 | Rockwell Collins, Inc. | Silicon-based packaging for electronic devices |
US20100072284A1 (en) | 2006-12-20 | 2010-03-25 | Renesas Technology Corp. | Semiconductor device and adaptor for the same |
US20100072618A1 (en) | 2008-09-22 | 2010-03-25 | Stats Chippac, Ltd. | Semiconductor Device and Method of Forming a Wafer Level Package with Bump Interconnection |
US7686228B2 (en) * | 2001-12-20 | 2010-03-30 | Gemalto Sa | Smart card with extended surface module |
US20100078485A1 (en) * | 2008-09-29 | 2010-04-01 | Dynacard Co., Ltd. | Subscriber identity module card |
US20100078486A1 (en) * | 2008-09-30 | 2010-04-01 | Fujitsu Limited | Antenna and reader/writer device |
US20100140814A1 (en) | 2008-12-04 | 2010-06-10 | Freescale Semiconductor, Inc. | Rf device and method with trench under bond pad feature |
US20100176207A1 (en) * | 2007-09-07 | 2010-07-15 | Yoshishige Yoshikawa | Sim card ic module and sim card |
US7760513B2 (en) | 2004-09-03 | 2010-07-20 | Entorian Technologies Lp | Modified core for circuit module system and method |
US7763976B2 (en) | 2008-09-30 | 2010-07-27 | Freescale Semiconductor, Inc. | Integrated circuit module with integrated passive device |
US20100190528A1 (en) * | 2009-01-23 | 2010-07-29 | Phytrex Technology Corporation | Signal Processing Device |
US7768796B2 (en) | 2004-09-03 | 2010-08-03 | Entorian Technologies L.P. | Die module system |
US20100200661A1 (en) * | 2007-04-24 | 2010-08-12 | Guy Shafran | Electronic interface apparatus and method and system for manufacturing same |
US20100203870A1 (en) | 2008-01-04 | 2010-08-12 | Logomotion, S.R.O. | Systems and methods for contactless payment authorization |
US20100223403A1 (en) * | 1999-10-20 | 2010-09-02 | Spyrus, Inc. | Integrated circuit card interface device with multiple modes of operation |
US20100227644A1 (en) * | 2007-10-30 | 2010-09-09 | Nationz Technologies Inc. | Radio frequency ic card device with very high frequency |
US7807502B2 (en) | 2007-05-17 | 2010-10-05 | Micron Technology, Inc. | Method for fabricating semiconductor packages with discrete components |
US7810718B2 (en) | 2005-05-12 | 2010-10-12 | Cubic Corporation | Variable thickness data card body |
US7812434B2 (en) | 2007-01-03 | 2010-10-12 | Advanced Chip Engineering Technology Inc | Wafer level package with die receiving through-hole and method of the same |
US20100262840A1 (en) | 2007-11-02 | 2010-10-14 | Inside Contactless | Method and devices for protecting a microcircuit from attacks for obtaining secret data |
US20100285841A1 (en) * | 2006-05-24 | 2010-11-11 | Paul Jolivet | Method for reducing power consumption for detachable card and mobile communication terminal thereof |
US7837122B2 (en) * | 2004-07-08 | 2010-11-23 | Gemalto Sa | Method of manufacturing a substrate for a mini-UICC smart card with an associated plug-in UICC adapter, and a resulting substrate |
USD628202S1 (en) | 2009-10-20 | 2010-11-30 | Sandisk Corporation | MicroSD memory card with different color surfaces |
US20100312698A1 (en) | 2004-07-01 | 2010-12-09 | American Express Travel Related Services Company, Inc. | Smartcard transaction system and method |
US7862381B2 (en) | 2008-09-26 | 2011-01-04 | Sandisk Corporation | Connector block feature |
US7874491B2 (en) | 2006-04-07 | 2011-01-25 | Infineon Technologies Ag | Carrier arrangement with overvoltage protection |
US20110059773A1 (en) * | 2008-05-29 | 2011-03-10 | Peter Neumann | Personalising a sim by means of a unique personalized master sim |
US7909611B2 (en) | 2008-09-26 | 2011-03-22 | Sandisk Corporation | Method for preventing damage to a memory card |
US7909251B2 (en) | 2006-02-04 | 2011-03-22 | Samsung Electronics Co., Ltd. | Memory card pack |
US7914296B1 (en) | 2010-01-05 | 2011-03-29 | Exatron, Inc. | Interconnecting assembly with conductive lever portions on a support film |
US20110077051A1 (en) * | 2009-09-25 | 2011-03-31 | At&T Intellectual Property I, L.P. | UICC Control Over Devices Used to Obtain Service |
US20110111593A1 (en) * | 2009-11-09 | 2011-05-12 | Masahiro Kanno | Pattern formation method, pattern formation system, and method for manufacturing semiconductor device |
US20110117961A1 (en) * | 2008-08-08 | 2011-05-19 | Sk Teleom Co., Ltd. | System for interfacing between a terminal and a smart card, method for same, and smart card applied to same |
US20110115060A1 (en) | 2009-11-19 | 2011-05-19 | Advanced Semiconductor Engineering, Inc. | Wafer-Level Semiconductor Device Packages with Electromagnetic Interference Shielding |
USD638431S1 (en) | 2009-10-20 | 2011-05-24 | Sandisk Corporation | MicroSD memory card with a semi-transparent color surface |
US7946876B1 (en) | 2009-12-25 | 2011-05-24 | Chi Mei Communication Systems, Inc. | Smart card holder for portable electronic device |
US20110149533A1 (en) * | 2009-12-22 | 2011-06-23 | Mxtran Inc. | Integrated circuit film for smart card |
US20110147463A1 (en) * | 2007-08-14 | 2011-06-23 | Christoph Schiller | Data storage medium which is in the form of a card and has a raised area |
US20110147467A1 (en) * | 2009-12-18 | 2011-06-23 | Yu Yung Choi | Enhanced performance and security rfid device |
US20110157838A1 (en) | 2009-12-28 | 2011-06-30 | Sony Corporation | Card device |
US7975915B2 (en) | 2004-11-02 | 2011-07-12 | Gemalto Sa | Personalized USB-key type electronic device and method for making same |
US20110171996A1 (en) | 2008-08-08 | 2011-07-14 | Tyfone, Inc. | Smartcard performance enhancement circuits and systems |
US7980477B2 (en) | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
US20110182037A1 (en) | 2010-01-28 | 2011-07-28 | Sony Corporation | Card device |
US20110180599A1 (en) * | 2010-01-26 | 2011-07-28 | Chih-Kuei Hu | IC card |
US20110186641A1 (en) * | 2008-10-29 | 2011-08-04 | Murata Manufacturing Co., Ltd. | Radio ic device |
USD643040S1 (en) | 2010-10-26 | 2011-08-09 | Hon Hai Precision Ind. Co., Ltd. | Electrical card |
US20110194265A1 (en) | 2010-02-05 | 2011-08-11 | Advanced Semiconductor Engineering, Inc. | Embedded Component Substrate and Manufacturing Methods Thereof |
US8003513B2 (en) | 2002-09-27 | 2011-08-23 | Medtronic Minimed, Inc. | Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures |
US20110204147A1 (en) * | 2010-02-19 | 2011-08-25 | Cubic Corporation | Smartcard interconnect |
US20110210177A1 (en) * | 2008-11-28 | 2011-09-01 | Cyrille Pepin | Smart card comprising an electronic module supported on a card body provided with a means for authenticating the peering of the module with the body |
US20110233545A1 (en) | 2010-03-29 | 2011-09-29 | Samsung Electronics Co., Ltd. | Semiconductor Chip Having Double Bump Structure And Smart Card Including The Same |
US8030745B2 (en) * | 2004-03-04 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | ID chip and IC card |
US8030746B2 (en) | 2008-02-08 | 2011-10-04 | Infineon Technologies Ag | Integrated circuit package |
US20110253795A1 (en) * | 2009-01-09 | 2011-10-20 | Murata Manufacturing Co., Ltd. | Wireless ic device, wireless ic module and method of manufacturing wireless ic module |
US20110253793A1 (en) * | 2010-04-14 | 2011-10-20 | Technologies, Roi Llc | Radio frequency identification tags and methods employing ceramic components, which may be suitable for use in extreme environmental conditions |
US8061623B2 (en) | 2006-02-09 | 2011-11-22 | Vadim Evgenevich Balchaytis | Plastic card provided with electrical contacts |
US20110298585A1 (en) | 2010-06-08 | 2011-12-08 | Vodafone Holding Gmbh | Smart card and mobile communication device comprising the smart card |
US20110304060A1 (en) | 2010-06-09 | 2011-12-15 | Beijing Boe Optoelectronics Technology Co., Ltd. | Metal thin film connection structure, manufacturing method thereof and array substrate |
US8085547B2 (en) | 2007-04-29 | 2011-12-27 | Hon Hai Precision Industry Co., Ltd. | Electronic elements carrier |
USD651992S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
US8107246B2 (en) | 2005-05-11 | 2012-01-31 | Gemalto Sa | Adhesive format adapter for a storage device and method for the production thereof |
US8110916B2 (en) | 2009-06-19 | 2012-02-07 | Advanced Semiconductor Engineering, Inc. | Chip package structure and manufacturing methods thereof |
US8110434B2 (en) | 2006-03-31 | 2012-02-07 | Kabushiki Kaisha Toshiba | Semiconductor device and memory card using the same |
US20120048948A1 (en) * | 2010-08-26 | 2012-03-01 | Oberthur Technologies | Method for Manufacturing a Card Based on a Substrate |
US8127997B2 (en) | 2003-05-13 | 2012-03-06 | Nagraid S.A. | Method for mounting an electronic component on a substrate |
US8136732B2 (en) | 2005-02-22 | 2012-03-20 | Tyfone, Inc. | Electronic transaction card with contactless interface |
US8143713B2 (en) | 2009-04-28 | 2012-03-27 | Samsung Electronics Co., Ltd. | Chip-on-board package |
US8191788B2 (en) | 1999-09-07 | 2012-06-05 | American Express Travel Related Services Company, Inc. | Transaction card |
US20120161337A1 (en) | 2010-12-28 | 2012-06-28 | Kabushiki Kaisha Toshiba | Wiring method for semiconductor integrated circuit, semiconductor-circuit wiring apparatus and semiconductor integrated circuit |
US8231061B2 (en) | 2009-02-24 | 2012-07-31 | Tyfone, Inc | Contactless device with miniaturized antenna |
US20120225691A1 (en) * | 2009-09-14 | 2012-09-06 | Ingecom Sarl | Identification module with an active tag |
USD667442S1 (en) * | 2011-09-12 | 2012-09-18 | Microsoft Corporation | Display screen with icon |
US8268702B2 (en) * | 2002-12-27 | 2012-09-18 | Semiconductor Energy Laboratory Co., Ltd. | IC card and booking-account system using the IC card |
US20120256324A1 (en) | 2009-04-01 | 2012-10-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for Improving Performance of Etch Stop Layer |
USD669479S1 (en) | 2012-01-13 | 2012-10-23 | Research In Motion Limited | Device smart card |
USD669478S1 (en) | 2012-01-13 | 2012-10-23 | Research In Motion Limited | Device smart card |
US8297518B2 (en) * | 2003-12-26 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Paper money, coin, valuable instrument, certificates, tag, label, card, packing containers, documents, respectively installed with integrated circuit |
US8301915B2 (en) * | 2008-10-02 | 2012-10-30 | Renesas Electronics Corporation | Semiconductor integrated circuit device and IC card using the same |
US20120289196A1 (en) | 2011-04-29 | 2012-11-15 | Tang Yew Tan | Compact form factor integrated circuit card and methods |
US20120292395A1 (en) * | 2011-05-20 | 2012-11-22 | Mxtran Inc. | Integrated circuit film for smart card and mobile communication device |
US20130084918A1 (en) * | 2011-10-03 | 2013-04-04 | Broadcom Corporation | Wireless communication device with sim-to-sd adaptor |
US8422238B2 (en) | 2009-04-13 | 2013-04-16 | Phytrex Technology Corporation | Signal conversion device |
USD681640S1 (en) | 2010-12-03 | 2013-05-07 | Sony Computer Entertainment Inc. | Storage medium |
USD686214S1 (en) | 2011-07-28 | 2013-07-16 | Lifenexus, Inc. | Smartcard with iChip contact pad |
US8507377B2 (en) | 2002-03-15 | 2013-08-13 | Fujitsu Semiconductor Limited | Semiconductor device, method of manufacturing the same, and phase shift mask |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55166632A (en) | 1979-06-12 | 1980-12-25 | Olympus Optical Co Ltd | Finder for single-lens reflex camera |
-
2012
- 2012-04-13 US US29/418,309 patent/USD703208S1/en active Active
- 2012-04-18 US US29/418,619 patent/USD702240S1/en active Active
- 2012-09-28 CA CA 147625 patent/CA147625S/en not_active Expired - Lifetime
Patent Citations (627)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3373481A (en) | 1965-06-22 | 1968-03-19 | Sperry Rand Corp | Method of electrically interconnecting conductors |
US3676742A (en) | 1971-05-24 | 1972-07-11 | Signetics Corp | Means including a spark gap for protecting an integrated circuit from electrical discharge |
US3825353A (en) | 1972-06-06 | 1974-07-23 | Microsystems Int Ltd | Mounting leads and method of fabrication |
US3842189A (en) | 1973-01-08 | 1974-10-15 | Rca Corp | Contact array and method of making the same |
USD261760S (en) | 1978-12-22 | 1981-11-10 | Pitney Bowes Inc. | Electronic postal rate memory |
US4803542A (en) | 1980-08-05 | 1989-02-07 | Gao Gessellschaft Fur Automation Und Organisation Mbh | Carrier element for an IC-module |
US4450024A (en) | 1980-08-07 | 1984-05-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Identification card with an IC-module and method for producing it |
US4549247A (en) | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
US4591945A (en) | 1981-04-30 | 1986-05-27 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Device for protecting electronic circuits against electrostatic charges |
US4617605A (en) | 1981-07-31 | 1986-10-14 | Gao Gesellschaft Fur Automation Und Organisation | Carrier element for an IC module |
US4603249A (en) | 1981-12-24 | 1986-07-29 | Gao Gesellschaft Fur Automation Und Organisation Gmbh | Identification card having an IC module |
US4535219A (en) | 1982-10-12 | 1985-08-13 | Xerox Corporation | Interfacial blister bonding for microinterconnections |
US4625102A (en) | 1983-06-09 | 1986-11-25 | Flonic | Memory card manufacturing method and cards thus obtained |
US4621190A (en) | 1983-06-09 | 1986-11-04 | Kabushiki Kaisha Toshiba | Card with an IC module |
US4792843A (en) | 1983-10-24 | 1988-12-20 | Haghiri Tehrani Yahya | Data carrier having an integrated circuit and method for producing same |
US4639585A (en) | 1984-05-29 | 1987-01-27 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Data carrier with an IC module and a method for producing such a data carrier |
US4674175A (en) | 1985-04-02 | 1987-06-23 | Eta Sa Fabrique D'ebauches | Process for manufacturing electronic modules for microcircuit cards |
US4774633A (en) | 1985-06-26 | 1988-09-27 | Bull S.A. | Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device |
US4841134A (en) | 1985-07-27 | 1989-06-20 | Dai Nippon Insatsu Kabushika Kaisha | IC card |
US4864383A (en) | 1985-10-11 | 1989-09-05 | Eurotechnique | Method of fabrication of a chip carrier package, a flush-contact chip carrier package and an application to cards containing components |
US4755661A (en) | 1986-01-10 | 1988-07-05 | Ruebsam Herrn H | Connection of electronic components in a card |
US4764803A (en) | 1986-03-17 | 1988-08-16 | Mitsubishi Denki Kabushiki Kaisha | Thin semiconductor card |
US5031026A (en) * | 1986-03-17 | 1991-07-09 | Mitsubishi Denki Kabushiki Kaisha | Thin semiconductor card |
US4860087A (en) | 1986-03-26 | 1989-08-22 | Hitachi, Ltd. | Semiconductor device and process for producing the same |
US5055913A (en) | 1986-11-20 | 1991-10-08 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Terminal arrangement for integrated circuit device |
US4897534A (en) | 1986-11-20 | 1990-01-30 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Data carrier having an integrated circuit and a method for producing the same |
US5150193A (en) | 1987-05-27 | 1992-09-22 | Hitachi, Ltd. | Resin-encapsulated semiconductor device having a particular mounting structure |
US5304513A (en) | 1987-07-16 | 1994-04-19 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame |
US5027190A (en) | 1987-07-16 | 1991-06-25 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element to be incorporated into an identity card |
US5122860A (en) | 1987-08-26 | 1992-06-16 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device and manufacturing method thereof |
US4942495A (en) | 1987-10-23 | 1990-07-17 | Gemplus Card International | Electrostatic protection device for electronic cards |
US5208450A (en) | 1988-04-20 | 1993-05-04 | Matsushita Electric Industrial Co., Ltd. | IC card and a method for the manufacture of the same |
US4994659A (en) | 1988-04-28 | 1991-02-19 | Citizen Watch Co., Ltd. | IC card |
US4980802A (en) | 1988-05-09 | 1990-12-25 | Bull Cp8 | Flexible printed circuit |
US5067007A (en) | 1988-06-13 | 1991-11-19 | Hitachi, Ltd. | Semiconductor device having leads for mounting to a surface of a printed circuit board |
US5086216A (en) | 1988-06-28 | 1992-02-04 | Schlumberger Industries | Memory card with fuses and a system for handling such memory cards |
US4937653A (en) | 1988-07-21 | 1990-06-26 | American Telephone And Telegraph Company | Semiconductor integrated circuit chip-to-chip interconnection scheme |
USRE35119E (en) | 1988-07-21 | 1995-12-12 | At&T Corp. | Textured metallic compression bonding |
US5057460A (en) | 1988-11-29 | 1991-10-15 | Schlumberger Industries | Method of making an electronic module, for insertion into an electronic memory-card body |
US5192716A (en) | 1989-01-25 | 1993-03-09 | Polylithics, Inc. | Method of making a extended integration semiconductor structure |
US5055907A (en) | 1989-01-25 | 1991-10-08 | Mosaic, Inc. | Extended integration semiconductor structure with wiring layers |
USD344502S (en) * | 1989-02-02 | 1994-02-22 | Gemplus Card International | Connecting terminal for chip cards |
USD342728S (en) | 1989-02-02 | 1993-12-28 | Gemplus Card International | Connecting terminal for chip cards |
USD331922S (en) * | 1989-02-02 | 1992-12-22 | Gemplus Card International | Connecting terminal for chip cards |
USD335663S (en) | 1989-02-02 | 1993-05-18 | Gemplus Card International | Connecting terminal for chip cards |
US5079673A (en) | 1989-04-06 | 1992-01-07 | Mitsubishi Denki Kabushiki Kaisha | Ic card module |
US5091618A (en) | 1989-05-23 | 1992-02-25 | Hitachi Maxell, Ltd. | Ic card reader/writer |
US5126548A (en) | 1989-07-19 | 1992-06-30 | Kabushiki Kaisha Toshiba | Ic card with additional terminals and method of controlling the ic card |
USD327883S (en) * | 1990-02-09 | 1992-07-14 | Gemplus Card International | Connecting terminal for chip cards |
US5434395A (en) | 1990-03-05 | 1995-07-18 | Jean-Rene Storck | Method and device for effecting a transaction between a first and at least one second data carrier and carrier used for this purpose |
US5531145A (en) * | 1990-03-07 | 1996-07-02 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method for making IC card having severable mini chip card |
US5296745A (en) | 1990-03-23 | 1994-03-22 | Kabushiki Kaisha Toshiba | Semiconductor device having a moisture barrier around periphery of device |
US5346576A (en) | 1990-03-26 | 1994-09-13 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing IC card |
US5049728A (en) * | 1990-04-04 | 1991-09-17 | Rovin George H | IC card system with removable IC modules |
USD328599S (en) * | 1990-04-10 | 1992-08-11 | Gemplus Card International | Connecting terminal for chip cards |
US5280192A (en) | 1990-04-30 | 1994-01-18 | International Business Machines Corporation | Three-dimensional memory card structure with internal direct chip attachment |
US5192682A (en) | 1990-05-10 | 1993-03-09 | Mitsubishi Denki Kabushiki Kaisha | Manufacturing method for thin semiconductor device assemblies |
US5241456A (en) | 1990-07-02 | 1993-08-31 | General Electric Company | Compact high density interconnect structure |
US5272374A (en) * | 1990-07-25 | 1993-12-21 | Mitsubishi Denki Kabushiki Kaisha | Production method for an IC card and its IC card |
US5399903A (en) | 1990-08-15 | 1995-03-21 | Lsi Logic Corporation | Semiconductor device having an universal die size inner lead layout |
US5250843A (en) | 1991-03-27 | 1993-10-05 | Integrated System Assemblies Corp. | Multichip integrated circuit modules |
US5091769A (en) | 1991-03-27 | 1992-02-25 | Eichelberger Charles W | Configuration for testing and burn-in of integrated circuit chips |
US5149662A (en) | 1991-03-27 | 1992-09-22 | Integrated System Assemblies Corporation | Methods for testing and burn-in of integrated circuit chips |
US5289349A (en) * | 1991-04-15 | 1994-02-22 | Sony Corporation | Integrated circuit card |
USD357909S (en) * | 1991-07-11 | 1995-05-02 | Gemplus Card International | Connecting terminal for chip cards |
US5173055A (en) | 1991-08-08 | 1992-12-22 | Amp Incorporated | Area array connector |
US5360941A (en) | 1991-10-28 | 1994-11-01 | Cubic Automatic Revenue Collection Group | Magnetically permeable electrostatic shield |
USD357242S (en) * | 1991-11-04 | 1995-04-11 | Gemplus Card International | Connecting terminal for chip cards |
USD353135S (en) * | 1991-11-27 | 1994-12-06 | Gemplus Card International | Connecting terminal for chip cards |
US5486687A (en) | 1992-01-14 | 1996-01-23 | Gemplus Card International | Memory card having a recessed portion with contacts connected to an access card |
USD358142S (en) * | 1992-03-02 | 1995-05-09 | Gemplus Card International | Connecting terminal for chip cards |
USD353136S (en) * | 1992-03-12 | 1994-12-06 | Gemplus Card International | Connecting terminal for chip cards |
US5327834A (en) | 1992-05-28 | 1994-07-12 | Thiokol Corporation | Integrated field-effect initiator |
US5639385A (en) * | 1992-06-04 | 1997-06-17 | Lsi Logic Corporation | Method of fabricating a wafer probe card for testing an integrated circuit die |
US5550406A (en) | 1992-06-04 | 1996-08-27 | Lsi Logic Corporation | Multi-layer tab tape having distinct signal, power and ground planes and wafer probe card with multi-layer substrate |
US5371346A (en) | 1992-07-31 | 1994-12-06 | Inventio Ag | Programmable card actuated apparatus for vending newspapers |
US5255430A (en) | 1992-10-08 | 1993-10-26 | Atmel Corporation | Method of assembling a module for a smart card |
US5324687A (en) | 1992-10-16 | 1994-06-28 | General Electric Company | Method for thinning of integrated circuit chips for lightweight packaged electronic systems |
US5864463A (en) | 1992-11-13 | 1999-01-26 | Seiko Epson Corporation | Electronic device having connector with rows of terminals divided by ribs and ground or power terminal adjacent ribs |
US5550402A (en) | 1992-11-27 | 1996-08-27 | Esec Sempac S.A. | Electronic module of extra-thin construction |
US6046071A (en) | 1993-06-01 | 2000-04-04 | Mitsubishi Denki Kabushiki Kaisha | Plastic molded semiconductor package and method of manufacturing the same |
US5834340A (en) | 1993-06-01 | 1998-11-10 | Mitsubishi Denki Kabushiki Kaisha | Plastic molded semiconductor package and method of manufacturing the same |
US6141210A (en) | 1993-07-23 | 2000-10-31 | Kabushiki Kaisha Toshiba | External storage device |
US6147860A (en) | 1993-07-23 | 2000-11-14 | Kabushiki Kaisha Toshiba | External storage device |
US6398114B1 (en) | 1993-08-02 | 2002-06-04 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
US5757116A (en) * | 1993-08-02 | 1998-05-26 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
US5581065A (en) * | 1993-08-02 | 1996-12-03 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
US6776347B2 (en) | 1993-08-02 | 2004-08-17 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
US20020050527A1 (en) * | 1993-08-02 | 2002-05-02 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
USD365092S (en) * | 1993-08-12 | 1995-12-12 | Siemens Aktiengesellschaft | Chipcard module |
US5612532A (en) | 1993-09-01 | 1997-03-18 | Kabushiki Kaisha Toshiba | Thin IC card and method for producing the same |
US5523697A (en) | 1993-09-03 | 1996-06-04 | Micron Technology, Inc. | Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof |
US5637858A (en) | 1993-12-23 | 1997-06-10 | Giesecke & Devrient Gmbh | Method for producing identity cards |
US5888624A (en) | 1994-02-04 | 1999-03-30 | Giesecke & Devrient Gmbh | Data carrier with an electronic module and a method for producing the same |
US5598032A (en) | 1994-02-14 | 1997-01-28 | Gemplus Card International | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
US6054774A (en) | 1994-03-22 | 2000-04-25 | Kabushiki Kaisha Toshiba | Thin type semiconductor package |
US5776796A (en) | 1994-05-19 | 1998-07-07 | Tessera, Inc. | Method of encapsulating a semiconductor package |
US5514862A (en) | 1994-05-20 | 1996-05-07 | At&T Corp. | Portable data carrier |
US5647122A (en) * | 1994-06-15 | 1997-07-15 | U.S. Philips Corporation | Manufacturing method for an integrated circuit card |
US5554940A (en) | 1994-07-05 | 1996-09-10 | Motorola, Inc. | Bumped semiconductor device and method for probing the same |
US5688716A (en) | 1994-07-07 | 1997-11-18 | Tessera, Inc. | Fan-out semiconductor chip assembly |
US6265765B1 (en) | 1994-07-07 | 2001-07-24 | Tessera, Inc. | Fan-out semiconductor chip assembly |
US6429112B1 (en) | 1994-07-07 | 2002-08-06 | Tessera, Inc. | Multi-layer substrates and fabrication processes |
US7166914B2 (en) | 1994-07-07 | 2007-01-23 | Tessera, Inc. | Semiconductor package with heat sink |
US5891745A (en) | 1994-10-28 | 1999-04-06 | Honeywell Inc. | Test and tear-away bond pad design |
USD375303S (en) * | 1994-11-30 | 1996-11-05 | Solaic (Societe Anonyme) | Smart card with plural external contact regions |
US5834755A (en) | 1994-12-08 | 1998-11-10 | Giesecke & Devrient Gmbh | Electronic module and a data carrier having an electronic module |
US5633780A (en) | 1994-12-21 | 1997-05-27 | Polaroid Corporation | Electrostatic discharge protection device |
US5583733A (en) | 1994-12-21 | 1996-12-10 | Polaroid Corporation | Electrostatic discharge protection device |
US5808758A (en) | 1994-12-23 | 1998-09-15 | Geisecke & Devrient, Gmbh | Data carrier with an optically variable element |
US20010005291A1 (en) | 1995-02-03 | 2001-06-28 | Kabushiki Kaisha Toshiba | Information storage apparatus and information processing apparatus using the same |
US5671525A (en) | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
USD369157S (en) | 1995-03-16 | 1996-04-23 | Kabushiki Kaisha Toshiba | IC card |
US5710421A (en) | 1995-03-31 | 1998-01-20 | Tokai-Rika-Denki-Seisakusho Kabushiki Kaisha | IC card |
US5965866A (en) | 1995-04-05 | 1999-10-12 | Orga Kartensysteme Gmbh | Pass card having a semiconductor chip module attached by a microencapsulated adhesive |
US5975420A (en) | 1995-04-13 | 1999-11-02 | Dai Nippon Printing Co., Ltd. | Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
US6076737A (en) | 1995-04-13 | 2000-06-20 | Dai Nippon Printing Co., Ltd. | Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
US5932866A (en) | 1995-05-19 | 1999-08-03 | Dai Nippon Printing Co., Ltd. | Optical card with a built-in IC module technical field |
USD379006S (en) | 1995-05-30 | 1997-04-29 | Solaic (Societe Anonyme) | Smart card with m-shaped isolation region |
US5506499A (en) | 1995-06-05 | 1996-04-09 | Neomagic Corp. | Multiple probing of an auxilary test pad which allows for reliable bonding to a primary bonding pad |
USD393458S (en) | 1995-06-19 | 1998-04-14 | Gemplus | Connecting terminal for chip cards |
USD425519S (en) | 1995-06-19 | 2000-05-23 | Gemplus | Connecting terminal for chip cards |
USD412164S (en) | 1995-06-19 | 1999-07-20 | Gemplus | Connecting terminal for chip cards |
USD456414S1 (en) * | 1995-06-19 | 2002-04-30 | Gemplus | Connecting terminal for chip cards |
US5850690A (en) * | 1995-07-11 | 1998-12-22 | De La Rue Cartes Et Systemes Sas | Method of manufacturing and assembling an integrated circuit card |
US6454164B1 (en) | 1995-08-09 | 2002-09-24 | Hitachi, Ltd. | Pocket-size information transfer apparatus having dual IC card insertion slots and IC card using the same |
US5995006A (en) | 1995-09-05 | 1999-11-30 | Intermec Ip Corp. | Radio frequency tag |
US6072698A (en) | 1995-09-27 | 2000-06-06 | Siemens Aktiengesellschaft | Chip module with heat insulation for incorporation into a chip card |
US6036099A (en) | 1995-10-17 | 2000-03-14 | Leighton; Keith | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
US6514367B1 (en) | 1995-10-17 | 2003-02-04 | Keith R. Leighton | Hot lamination process for the manufacture of a combination contact/contactless smart card |
US5599203A (en) | 1995-10-31 | 1997-02-04 | The Whitaker Corporation | Smart card and smart card connector |
US6025997A (en) | 1995-11-03 | 2000-02-15 | Siemens Aktiengesellschaft | Chip module for semiconductor chips having arbitrary footprints |
US6112997A (en) * | 1996-03-08 | 2000-09-05 | Robert Bosch Gmbh | Chip card and chip card reader |
US6142381A (en) | 1996-03-15 | 2000-11-07 | Finn; David | Contact or contactless chip card with brace |
US6856235B2 (en) | 1996-04-18 | 2005-02-15 | Tessera, Inc. | Methods for manufacturing resistors using a sacrificial layer |
US6326683B1 (en) | 1996-05-17 | 2001-12-04 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip |
USD388066S (en) | 1996-05-29 | 1997-12-23 | Kabushiki Kaisha Toshiba | IC module |
USD387747S (en) * | 1996-05-29 | 1997-12-16 | Kabushiki Kaisha Toshiba | IC module |
USD389130S (en) * | 1996-05-29 | 1998-01-13 | Kabushiki Kaisha Toshiba | IC module |
USD387746S (en) * | 1996-05-29 | 1997-12-16 | Kabushiki Kaisha Toshiba | IC module |
US6202931B1 (en) | 1996-06-07 | 2001-03-20 | Schlumberger Systemes | Memory card and method for producing same |
US5822190A (en) * | 1996-06-11 | 1998-10-13 | Kabushiki Kaisha Toshiba | Card type memory device and a method for manufacturing the same |
US6581830B1 (en) * | 1996-06-17 | 2003-06-24 | Robert Bosch Gmbh | Card reader with multiple chip cards slot opening |
US5925445A (en) | 1996-07-12 | 1999-07-20 | Nec Corporation | Printed wiring board |
US6027028A (en) | 1996-07-26 | 2000-02-22 | Koninklijke Kpn N.V. | Connector formed as a sleeve pushed over a standard chip card |
US6223989B1 (en) | 1996-08-05 | 2001-05-01 | Gemplus S.C.A. | Method for making smart cards, and resulting cards |
US5815426A (en) | 1996-08-13 | 1998-09-29 | Nexcom Technology, Inc. | Adapter for interfacing an insertable/removable digital memory apparatus to a host data part |
US6095423A (en) | 1996-08-14 | 2000-08-01 | Siemens Aktiengesellschaft | Method of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card module |
USD384971S (en) | 1996-08-28 | 1997-10-14 | Transaction Technology, Inc. | Smart card with chip bearing a source identifier |
US5796570A (en) | 1996-09-19 | 1998-08-18 | National Semiconductor Corporation | Electrostatic discharge protection package |
US6313524B1 (en) | 1996-09-23 | 2001-11-06 | Infineon Technologies Ag | Chip module with a plurality of flat contact elements mountable on either an external printed circuit board or an external circuit board substrate |
US6288904B1 (en) | 1996-09-30 | 2001-09-11 | Infineon Technologies Ag | Chip module, in particular for implantation in a smart card body |
USD405779S (en) * | 1996-10-25 | 1999-02-16 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard |
US6081182A (en) | 1996-11-22 | 2000-06-27 | Matsushita Electric Industrial Co., Ltd. | Temperature sensor element and temperature sensor including the same |
US6006987A (en) | 1996-12-20 | 1999-12-28 | Siemens Aktiengesellschaft | Removable card carrier assembly |
US6370029B1 (en) | 1997-01-15 | 2002-04-09 | Transaction Technology, Inc. | Method and system for creating and using an electrostatic discharge (ESD) protected logotype contact module with a smart card |
US20010011685A1 (en) | 1997-01-15 | 2001-08-09 | Manfred Fries | Smart card |
US6065681A (en) * | 1997-01-29 | 2000-05-23 | Orga Kartensysteme Gmbh | Method of producing data carriers |
US6191951B1 (en) | 1997-03-03 | 2001-02-20 | Infineon Technologies Ag | Smart card module and smart card including a smart card module |
USD406822S (en) * | 1997-03-06 | 1999-03-16 | Siemens Aktiengesellschaft | Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module |
US5969951A (en) | 1997-03-13 | 1999-10-19 | Orga Kartensysteme Gmbh | Method for manufacturing a chip card and chip card manufactured in accordance with said method |
US6293470B1 (en) | 1997-04-29 | 2001-09-25 | Swedish Advanced Technology Systems Ab | Smartcard and method for its manufacture |
US6601770B1 (en) | 1997-05-19 | 2003-08-05 | Rohm Co., Ltd. | Response device in contact/contactless IC card communication system |
US6175287B1 (en) | 1997-05-28 | 2001-01-16 | Raytheon Company | Direct backside interconnect for multiple chip assemblies |
US6320751B2 (en) * | 1997-06-23 | 2001-11-20 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier and method for producing the same |
US6581840B2 (en) | 1997-06-23 | 2003-06-24 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier and method for producing the same |
US5898223A (en) | 1997-10-08 | 1999-04-27 | Lucent Technologies Inc. | Chip-on-chip IC packages |
US7958622B1 (en) | 1997-10-08 | 2011-06-14 | Gemalto S.A. | Method for making smart cards |
US7663564B2 (en) | 1997-10-08 | 2010-02-16 | Gemalto, S.A. | Method for making smart cards capable of operating with and without contact |
US6378774B1 (en) | 1997-11-14 | 2002-04-30 | Toppan Printing Co., Ltd. | IC module and smart card |
USD427577S (en) * | 1997-12-12 | 2000-07-04 | Motorola, Inc. | Portable data carrier |
US6448638B1 (en) * | 1998-01-22 | 2002-09-10 | Gemplus | Integrated circuit contact card, comprising a detachable minicard |
US20020169943A1 (en) * | 1998-02-06 | 2002-11-14 | Thorwald Rabeler | Chip card with integrated circuit |
US6197688B1 (en) | 1998-02-12 | 2001-03-06 | Motorola Inc. | Interconnect structure in a semiconductor device and method of formation |
US6592042B1 (en) | 1998-02-13 | 2003-07-15 | Schlumberger Systemes | Method for making a card with integrated circuit |
US6642611B2 (en) | 1998-03-26 | 2003-11-04 | Kabushiki Kaisha Toshiba | Storage apparatus, card type storage apparatus, and electronic apparatus |
US6581122B1 (en) | 1998-03-26 | 2003-06-17 | Gemplus | Smart card which operates with the USB protocol |
USD452865S1 (en) | 1998-04-01 | 2002-01-08 | Sandisk Corporation | Removable memory card for use with portable electronic devices |
USD453934S1 (en) | 1998-04-01 | 2002-02-26 | Sandisk Corporation | Removable memory card for use with portable electronic devices |
USD424043S (en) | 1998-04-13 | 2000-05-02 | Nihon Denshizairyo Kabushiki Kaisha | Ring for probe card |
USD424539S (en) | 1998-04-13 | 2000-05-09 | Nihon Denshizairyo Kabushiki Kaisha | Ring for probe card |
US20050247797A1 (en) * | 1998-04-17 | 2005-11-10 | Diebold, Incorporated | Multi-account card with magnetic stripe data and electronic ink display being changeable to correspond to a selected account |
US6410355B1 (en) | 1998-06-11 | 2002-06-25 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
US6276609B1 (en) | 1998-07-07 | 2001-08-21 | U.S. Philips Corporation | Data carrier provided data processing means and current peak pattern suppression means |
US6109530A (en) | 1998-07-08 | 2000-08-29 | Motorola, Inc. | Integrated circuit carrier package with battery coin cell |
US6161761A (en) | 1998-07-09 | 2000-12-19 | Motorola, Inc. | Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly |
US6329962B2 (en) * | 1998-08-04 | 2001-12-11 | Telefonaktiebolaget Lm Ericsson (Publ) | Multiple band, multiple branch antenna for mobile phone |
USD416246S (en) | 1998-08-19 | 1999-11-09 | The Standard Register Company | Contact layout for a smart card |
US6193163B1 (en) * | 1998-08-31 | 2001-02-27 | The Standard Register Company | Smart card with replaceable chip |
US6797543B2 (en) * | 1998-10-02 | 2004-09-28 | Shinko Electric Industries Co., Ltd. | Process for manufacturing IC card |
US20020177255A1 (en) * | 1998-10-02 | 2002-11-28 | Shinko Electric Industries Co., Ltd | Process for manufacturing ic card |
US6184477B1 (en) | 1998-12-02 | 2001-02-06 | Kyocera Corporation | Multi-layer circuit substrate having orthogonal grid ground and power planes |
US6402032B1 (en) | 1998-12-03 | 2002-06-11 | Integrated Technology Express Inc. | Integrated smart card reader and computer input/output IC system |
US6568600B1 (en) | 1999-01-19 | 2003-05-27 | Bull Cp8 | Chip card equipped with a loop antenna, and associated micromodule |
US6369407B1 (en) | 1999-02-09 | 2002-04-09 | Rohm Co., Ltd. | Semiconductor device |
US6964377B1 (en) * | 1999-02-17 | 2005-11-15 | Giesecke & Devrient Gmbh | Portable data support with a detachable mini chip card |
US6145035A (en) | 1999-02-25 | 2000-11-07 | Dallas Semiconductor Corporation | Card cradle system and method |
US6612498B1 (en) | 1999-03-11 | 2003-09-02 | Nokia Mobile Phones Ltd. | Method and means for using additional cards in a mobile station |
US6542444B1 (en) | 1999-03-29 | 2003-04-01 | Omd Productions Ag | Carrier card capable of storing information data in CD or DVD formats |
US20040037145A1 (en) | 1999-05-28 | 2004-02-26 | Kenji Tagawa | Semiconductor memory card, apparatus for recording data onto the semiconductor memory card, and apparatus for reproducing data of the semiconductor memory card |
US20020110955A1 (en) | 1999-06-15 | 2002-08-15 | Philippe Patrice | Electronic device including at least one chip fixed to a support and a method for manufacturing such a device |
US6634561B1 (en) | 1999-06-24 | 2003-10-21 | Sandisk Corporation | Memory card electrical contact structure |
US6585165B1 (en) | 1999-06-29 | 2003-07-01 | Sony Chemicals Corp. | IC card having a mica capacitor |
US6803114B1 (en) | 1999-07-01 | 2004-10-12 | Schlumberger Systemes | Manufacturing process for laminated cards with intermediate PETG layer |
US6659355B1 (en) | 1999-08-19 | 2003-12-09 | Orga Kartensysteme Gmbh | Method for producing a multi-layer chip card |
USD443298S1 (en) | 1999-09-01 | 2001-06-05 | American Express Travel Related Services Company, Inc. | Card with an ornamental rectangle, machine readable stripe and IC chip |
US8191788B2 (en) | 1999-09-07 | 2012-06-05 | American Express Travel Related Services Company, Inc. | Transaction card |
US6351405B1 (en) | 1999-09-16 | 2002-02-26 | Samsung Electronics Co., Ltd. | Pad for integrated circuit device which allows for multiple probing and reliable bonding and integrated circuit device including the pad |
US6460773B1 (en) | 1999-10-12 | 2002-10-08 | Fujitsu Limited | Combination card having an IC chip module |
US20100223403A1 (en) * | 1999-10-20 | 2010-09-02 | Spyrus, Inc. | Integrated circuit card interface device with multiple modes of operation |
USD450854S1 (en) * | 1999-11-04 | 2001-11-20 | Therasense, Inc. | Glucose strip |
US20010012682A1 (en) | 1999-11-29 | 2001-08-09 | Georges Kayanakis | Manufacturing process of a hybrid contact-contactless smart card with an antenna support made of fibrous material |
US7552876B2 (en) | 2000-01-25 | 2009-06-30 | Renesas Technology Corp. | IC card |
US7234644B2 (en) | 2000-01-25 | 2007-06-26 | Renesas Technology Corp. | IC card |
US20030016507A1 (en) | 2000-02-02 | 2003-01-23 | Jurgen Fischer | Portable data carrier |
US6778407B2 (en) | 2000-02-02 | 2004-08-17 | Infineon Technologies Ag | Portable data carrier |
US6433285B2 (en) | 2000-03-30 | 2002-08-13 | Matsushita Electronics Corporation | Printed wiring board, IC card module using the same, and method for producing IC card module |
US6669487B1 (en) | 2000-04-28 | 2003-12-30 | Hitachi, Ltd. | IC card |
US6896189B2 (en) | 2000-05-03 | 2005-05-24 | Axalto Sa | Card comprising electrical contacts |
US6483038B2 (en) | 2000-05-23 | 2002-11-19 | Samsung Electronics Co., Ltd. | Memory card |
USD452243S1 (en) | 2000-06-07 | 2001-12-18 | Sandisk Corporation | Integrated circuit memory card |
USD452864S1 (en) | 2000-06-12 | 2002-01-08 | Sandisk Corporation | Electronic memory card |
US6343364B1 (en) | 2000-07-13 | 2002-01-29 | Schlumberger Malco Inc. | Method and device for local clock generation using universal serial bus downstream received signals DP and DM |
US20060202034A1 (en) | 2000-08-04 | 2006-09-14 | Wallace Robert F | Use of Small Electronic Circuit Cards With Different Interfaces in an Electronic System |
US6922780B1 (en) | 2000-08-08 | 2005-07-26 | The Directv Group, Inc. | Dual chip smart card and method for using same |
US20020023963A1 (en) * | 2000-08-31 | 2002-02-28 | Pacusma Company, Ltd. | Integrated circuit card with multiple integral electronic modules |
US6641049B2 (en) | 2000-08-31 | 2003-11-04 | Pacusma Company, Ltd. | Integrated circuit card with multiple integral electronic modules |
US20020049887A1 (en) | 2000-08-31 | 2002-04-25 | Naomasa Takahashi | Information-processing apparatus, information-processing method, memory card and program storage medium |
US6694399B1 (en) | 2000-09-14 | 2004-02-17 | Schlumberger Malco, Inc. | Method and device for universal serial bus smart card traffic signaling |
US6490667B1 (en) | 2000-09-18 | 2002-12-03 | Kabushiki Kaisha Toshiba | Portable electronic medium |
US6717801B1 (en) | 2000-09-29 | 2004-04-06 | Hewlett-Packard Development Company, L.P. | Standardized RF module insert for a portable electronic processing device |
US6870733B2 (en) | 2000-09-29 | 2005-03-22 | Hewlett-Packard Development Company, L.P. | Standardized RF module insert for a portable electronic processing device |
US6439464B1 (en) | 2000-10-11 | 2002-08-27 | Stmicroelectronics, Inc. | Dual mode smart card and associated methods |
US20080099932A1 (en) | 2000-10-20 | 2008-05-01 | Silverbrook Research Pty Ltd. | Resilient carrier assembly for an integrated circuit |
US6628240B2 (en) | 2000-11-08 | 2003-09-30 | American Pacific Technology | Method and apparatus for rapid staking of antennae in smart card manufacture |
US20080245877A1 (en) * | 2000-11-28 | 2008-10-09 | Pascal Billebaud | Electronic Data Storage Medium |
US6543690B2 (en) | 2000-12-04 | 2003-04-08 | Schlumberger Malco, Inc. | Method and apparatus for communicating with a host |
US20020069392A1 (en) | 2000-12-05 | 2002-06-06 | Kazutaka Saitoh | Smart card and circuitry layout thereof |
US7028910B2 (en) | 2001-02-02 | 2006-04-18 | Schlumberger, Systemes | Portable object with chip and antenna |
US6462273B1 (en) | 2001-03-16 | 2002-10-08 | Micron Technology, Inc. | Semiconductor card and method of fabrication |
US6803666B2 (en) | 2001-03-27 | 2004-10-12 | Kabushiki Kaisha Toshiba | Semiconductor chip mounting substrate and semiconductor device using the same |
US20050082636A1 (en) | 2001-03-30 | 2005-04-21 | Kyocera Corporation | Tunable thin film capacitor |
US6618258B2 (en) | 2001-05-10 | 2003-09-09 | Hewlett-Packard Development, L.P. | Portable memory card system |
US6659356B2 (en) | 2001-05-16 | 2003-12-09 | Matsushita Electric Industrial Co., Ltd. | Hybrid IC card |
US20020170974A1 (en) * | 2001-05-16 | 2002-11-21 | Matsushita Electric Industrial Co., Ltd. | Hybrid IC card |
US20020186542A1 (en) | 2001-06-11 | 2002-12-12 | Samsung Electro-Mechanics Co., Ltd. | Heat sink of module with built-in IC |
US6632997B2 (en) | 2001-06-13 | 2003-10-14 | Amkor Technology, Inc. | Personalized circuit module package and method for packaging circuit modules |
USD488818S1 (en) | 2001-06-27 | 2004-04-20 | Fluidigm Corporation | Fluidic rotary mixer square icon for a display screen |
US6572015B1 (en) | 2001-07-02 | 2003-06-03 | Bellsouth Intellectual Property Corporation | Smart card authorization system, apparatus and method |
US7607583B2 (en) | 2001-07-10 | 2009-10-27 | American Express Travel Related Services Company, Inc. | Clear contactless card |
US20030016116A1 (en) | 2001-07-23 | 2003-01-23 | Blaha Charles A. | Method of depositing a thin metallic film and related apparatus |
US20030024995A1 (en) | 2001-07-27 | 2003-02-06 | Storcard, Inc. | Smart card with rotating storage |
US20050194453A1 (en) * | 2001-07-27 | 2005-09-08 | Storcard, Inc. | Enhanced smart card with rotating storage |
US6712279B2 (en) | 2001-07-31 | 2004-03-30 | Koninklijke Philips Electronics N.V. | Data carrier comprising an array of contacts |
US20030024996A1 (en) * | 2001-07-31 | 2003-02-06 | Koninklijke Philips Electronics N.V. | Data carrier comprising an array of contacts |
US7557436B2 (en) * | 2001-08-07 | 2009-07-07 | Renesas Technology Corp. | Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes |
US7019981B2 (en) | 2001-08-10 | 2006-03-28 | Infineon Technologies Ag | Making contact with semiconductor chips in chip cards |
US20040194861A1 (en) | 2001-08-23 | 2004-10-07 | Dowa Mining Co., Ltd. | Radiation plate and power semiconductor module ic package |
US7180176B2 (en) | 2001-08-23 | 2007-02-20 | Dowa Mining Co., Ltd. | Radiation plate and power semiconductor module IC package |
US20040238857A1 (en) | 2001-08-28 | 2004-12-02 | Tessera, Inc. | High frequency chip packages with connecting elements |
US20040232246A1 (en) * | 2001-09-05 | 2004-11-25 | Gilles Dhers | Chip card comprising a more or less rectangular flat support |
US7086601B2 (en) * | 2001-09-05 | 2006-08-08 | Gemplus | Chip card comprising a more or less rectangular flat support |
US6851618B2 (en) | 2001-09-14 | 2005-02-08 | Ask S.A. | Contactless or hybrid contact-contactless smart card with reinforced connection of the electronic module |
US6811082B2 (en) * | 2001-09-18 | 2004-11-02 | Jacob Y. Wong | Advanced magnetic stripe bridge (AMSB) |
US20040259423A1 (en) | 2001-09-24 | 2004-12-23 | Didier Elbaz | Dongle which is intended to be connected to a port of a telecommunications device |
US20050037540A1 (en) | 2001-10-30 | 2005-02-17 | Angel Pepe | Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers and a method of making the same |
US6817534B2 (en) | 2001-11-06 | 2004-11-16 | Litronic, Inc. | Smart card having additional connector pads |
US6634565B2 (en) | 2001-11-06 | 2003-10-21 | Litronic, Inc. | Smart card having additional connector pads |
US20030168515A1 (en) | 2001-11-06 | 2003-09-11 | Gray Robert J. | Smart card having additional connector pads |
US20030085287A1 (en) | 2001-11-06 | 2003-05-08 | Gray Robert J | Smart card having additional connector pads |
US6978940B2 (en) | 2001-11-06 | 2005-12-27 | Quadnovation, Inc. | Contactless SIM card carrier with detachable antenna and carrier therefor |
US20030116634A1 (en) | 2001-11-29 | 2003-06-26 | Masahiko Tanaka | Non-contact IC card |
US20050202667A1 (en) | 2001-12-03 | 2005-09-15 | University Of Southern California | Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates |
US20030102544A1 (en) | 2001-12-03 | 2003-06-05 | Masataka Nishikawa | Semiconductor module and production method therefor and module for IC cards and the like |
US20030103301A1 (en) | 2001-12-03 | 2003-06-05 | Fechner Paul S. | On chip smart capacitors |
US7135782B2 (en) | 2001-12-03 | 2006-11-14 | Sharp Kabushiki Kaisha | Semiconductor module and production method therefor and module for IC cards and the like |
US20080006703A1 (en) * | 2001-12-10 | 2008-01-10 | Ortigosa Vallejo Juan I | Contactless identification device |
US20090101722A1 (en) * | 2001-12-10 | 2009-04-23 | Juan Ignacio Ortigosa Vallejo | Contactless identification device |
US7686228B2 (en) * | 2001-12-20 | 2010-03-30 | Gemalto Sa | Smart card with extended surface module |
US20030224995A1 (en) | 2001-12-21 | 2003-12-04 | Khan Nisar Ahmed | Treatment of burns |
US6720927B2 (en) * | 2002-01-09 | 2004-04-13 | Agere Systems, Inc. | System for deploying an antenna of an integrated circuit card |
US8507377B2 (en) | 2002-03-15 | 2013-08-13 | Fujitsu Semiconductor Limited | Semiconductor device, method of manufacturing the same, and phase shift mask |
US20050236490A1 (en) * | 2002-03-15 | 2005-10-27 | Jean-Pierre Fortune | Chip card device for transmitting digital information using acoustic means |
US20040117317A1 (en) | 2002-04-18 | 2004-06-17 | Feinman Jason S. | Apparatus and methods for a united states postal service smart card system |
US20080112852A1 (en) * | 2002-04-25 | 2008-05-15 | Neel Gary T | Test Strips and System for Measuring Analyte Levels in a Fluid Sample |
US20030213849A1 (en) * | 2002-05-20 | 2003-11-20 | Luu Daniel V. H. | Contactless transaction card and adapter therefor |
US6991172B2 (en) * | 2002-05-20 | 2006-01-31 | Quadnovation, Inc. | Contactless transaction card and adapter therefor |
US20050231921A1 (en) * | 2002-05-24 | 2005-10-20 | Chie Noda | Chip card of reduced size with backward compatibility and adapter for a reduced size chip card |
US7559469B2 (en) * | 2002-05-24 | 2009-07-14 | Ntt Docomo, Inc. | Chip card of reduced size with backward compatibility and adapter for a reduced size chip card |
US20030226901A1 (en) | 2002-06-11 | 2003-12-11 | Kim Deok-Heung | IC card and manufacturing method thereof |
US6994263B2 (en) | 2002-06-28 | 2006-02-07 | Matsushita Electric Industrial Co., Ltd. | IC card |
US7059534B2 (en) | 2002-07-02 | 2006-06-13 | Konica Corporation | IC card |
US6865086B2 (en) | 2002-07-09 | 2005-03-08 | Micron Technology, Inc. | Apparatus and method to secure an adaptor to a reduced-sized memory card |
US7587756B2 (en) * | 2002-07-09 | 2009-09-08 | American Express Travel Related Services Company, Inc. | Methods and apparatus for a secure proximity integrated circuit card transactions |
US6970359B2 (en) | 2002-07-09 | 2005-11-29 | Micron Technology, Inc. | Reduced-sized memory card package, length-extending adaptor and method of forming adaptor |
US7239973B2 (en) | 2002-07-19 | 2007-07-03 | Thomson Licensing | Method and test adapter for testing an appliance having a smart card reader |
US7418272B2 (en) | 2002-08-12 | 2008-08-26 | Info Trust, Inc. | Battery pack having a dual-type smart card interface |
US20050197169A1 (en) | 2002-08-12 | 2005-09-08 | Chang-Bai Son | Battery pack having a dual-type smart card interface |
US20040031857A1 (en) | 2002-08-15 | 2004-02-19 | Sony Corporation | Non-contact IC card |
US20050212690A1 (en) | 2002-08-26 | 2005-09-29 | Dai Nippon Printing Co., Ltd. | Sim, sim holder, ic module, ic card and ic card holder |
US7485562B2 (en) | 2002-08-27 | 2009-02-03 | Micron Technology, Inc. | Method of making multichip wafer level packages and computing systems incorporating same |
US20060142063A1 (en) | 2002-08-30 | 2006-06-29 | Stmicroelectronics S.A. | Antenna communication method for a chip card and associated device |
US8003513B2 (en) | 2002-09-27 | 2011-08-23 | Medtronic Minimed, Inc. | Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures |
US20040061234A1 (en) | 2002-09-27 | 2004-04-01 | Medtronic Minimed, Inc. | High reliability multlayer circuit substrates and methods for their formation |
US7083107B2 (en) | 2002-09-30 | 2006-08-01 | Matsushita Electric Industrial Co., Ltd. | Memory card |
US7615855B2 (en) | 2002-10-08 | 2009-11-10 | Renesas Technology Corp. | IC card and method of manufacturing the same |
US6910635B1 (en) | 2002-10-08 | 2005-06-28 | Amkor Technology, Inc. | Die down multi-media card and method of making same |
US7242079B2 (en) | 2002-10-15 | 2007-07-10 | Axalto S.A. | Method of manufacturing a data carrier |
USD533556S1 (en) | 2002-10-15 | 2006-12-12 | Matsushita Electric Industrial Co., Ltd. | IC memory card |
US20060006241A1 (en) * | 2002-10-24 | 2006-01-12 | Alain Soyer | Data support having several electronic modules mounted on the same surface |
US20040089717A1 (en) | 2002-11-13 | 2004-05-13 | Sandisk Corporation | Universal non-volatile memory card used with various different standard cards containing a memory controller |
USD492688S1 (en) * | 2002-12-09 | 2004-07-06 | Sandisk Corporation | Memory card |
US20040113265A1 (en) | 2002-12-17 | 2004-06-17 | Intel Corporation | Localized backside chip cooling with integrated smart valves |
US20130015441A1 (en) * | 2002-12-27 | 2013-01-17 | Semiconductor Energy Laboratory Co., Ltd. | Ic card and booking-account system using the ic card |
US8268702B2 (en) * | 2002-12-27 | 2012-09-18 | Semiconductor Energy Laboratory Co., Ltd. | IC card and booking-account system using the IC card |
US7374721B2 (en) * | 2002-12-31 | 2008-05-20 | Transpacific Ip, Ltd. | Chip with measuring reliability and a method thereof |
USD487747S1 (en) | 2003-01-08 | 2004-03-23 | C-One Technology Corporation | Removable electronic card |
US6793144B2 (en) | 2003-01-10 | 2004-09-21 | Atmel Corporation | Means for communicating with USB smart cards using full-speed or high-speed transfers |
US6817533B2 (en) | 2003-01-15 | 2004-11-16 | Power Digital Card Co., Ltd. | Digital card-structure |
US7121473B2 (en) * | 2003-01-30 | 2006-10-17 | Infeneon Technologies Flash Gmbh & Co. | Security memory card and production method |
US20040211843A1 (en) * | 2003-01-30 | 2004-10-28 | Infineon Technologies Flash Gmbh & Co. Kg | Security memory card and production method |
US7094106B2 (en) | 2003-03-10 | 2006-08-22 | Matsushita Electric Works, Ltd. | Adaptor for memory card |
US7597266B2 (en) | 2003-03-28 | 2009-10-06 | Ask S.A. | Method for making a smart card antenna on a thermoplastic support and resulting smartcard |
US7137563B2 (en) | 2003-04-10 | 2006-11-21 | Sony Corporation | Method for making IC card |
US20060054710A1 (en) * | 2003-04-10 | 2006-03-16 | Forster Ian J | RFID devices having self-compensating antennas and conductive shields |
US20040245347A1 (en) | 2003-04-10 | 2004-12-09 | Sony Corporation | Method for making IC card |
US7051429B2 (en) | 2003-04-11 | 2006-05-30 | Eastman Kodak Company | Method for forming a medium having data storage and communication capabilities |
US8127997B2 (en) | 2003-05-13 | 2012-03-06 | Nagraid S.A. | Method for mounting an electronic component on a substrate |
USD512512S1 (en) * | 2003-05-21 | 2005-12-06 | Wachovia Bank, National Association | Blood glucose test strip |
US7369982B2 (en) | 2003-06-04 | 2008-05-06 | Stmicroelectronics, Inc. | Multi-mode smart card emulator and related methods |
US20040252070A1 (en) * | 2003-06-12 | 2004-12-16 | Huey-Ru Chuang | Printed dual dipole antenna |
US20060152417A1 (en) * | 2003-06-20 | 2006-07-13 | Zhinong Ying | Integrated antenna and speaker |
US7094633B2 (en) | 2003-06-23 | 2006-08-22 | Sandisk Corporation | Method for efficiently producing removable peripheral cards |
US20070108521A1 (en) | 2003-07-04 | 2007-05-17 | Ronald Dekker | Flexible semiconductor device and identification label |
US20050007744A1 (en) | 2003-07-10 | 2005-01-13 | Yoshitaka Okita | IC module and IC card |
US7064423B2 (en) | 2003-07-10 | 2006-06-20 | Sharp Kabushiki Kaisha | IC module and IC card |
USD538286S1 (en) | 2003-07-17 | 2007-03-13 | Sandisk Corporation | Memory card |
US20050011671A1 (en) | 2003-07-17 | 2005-01-20 | Takiar Hem P. | Memory card with and without enclosure |
US7336498B2 (en) | 2003-07-17 | 2008-02-26 | Sandisk Corporation | Memory card with push-push connector |
USD525978S1 (en) | 2003-07-17 | 2006-08-01 | Sandisk Corporation | Memory card |
USD525623S1 (en) | 2003-07-17 | 2006-07-25 | Sandisk Corporation | Memory card |
USD525248S1 (en) | 2003-07-17 | 2006-07-18 | Sandisk Corporation | Memory card |
USD537081S1 (en) | 2003-07-17 | 2007-02-20 | Sandisk Corporation | Memory card |
US20050148217A1 (en) | 2003-07-17 | 2005-07-07 | Takiar Hem P. | Memory card with chamfer |
USD523435S1 (en) | 2003-07-17 | 2006-06-20 | Sandisk Corporation | Memory card |
US20050105360A1 (en) | 2003-07-17 | 2005-05-19 | Takiar Hem P. | Memory card with adapter |
US20050111280A1 (en) | 2003-07-17 | 2005-05-26 | Takiar Hem P. | Memory card with push-push connector |
US7102891B1 (en) | 2003-07-23 | 2006-09-05 | Amkor Technology, Inc. | Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor |
US20050035909A1 (en) * | 2003-08-16 | 2005-02-17 | Lin Wen Hsiung | Card device having S-shaped printed antenna |
US7566001B2 (en) * | 2003-08-29 | 2009-07-28 | Semiconductor Energy Laboratory Co., Ltd. | IC card |
US8136725B2 (en) * | 2003-08-29 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | IC card |
US20050045729A1 (en) * | 2003-08-29 | 2005-03-03 | Semiconductor Energy Laboratory Co., Ltd. | IC card |
US7176060B2 (en) | 2003-09-10 | 2007-02-13 | Renesas Technology Corp. | Integrated circuit card and a method of manufacturing the same |
US20070108294A1 (en) * | 2003-09-29 | 2007-05-17 | Oberthur Card Systems Sa | Microcircuit card in several parts |
USD493798S1 (en) | 2003-10-13 | 2004-08-03 | C-One Technology Corporation | Memory card |
US7388455B2 (en) | 2003-10-30 | 2008-06-17 | Avago Technologies Wireless Ip Pte Ltd | Film acoustically-coupled transformer with increased common mode rejection |
US20050139489A1 (en) * | 2003-10-31 | 2005-06-30 | Davies Oliver William H. | Method of reducing the effect of direct and mediated interference current in an electrochemical test strip |
US20080272197A1 (en) * | 2003-11-04 | 2008-11-06 | Hirotaka Nishizawa | Memory card and semiconductor device |
US20050099269A1 (en) | 2003-11-10 | 2005-05-12 | Diorio Christopher J. | Method and apparatus to configure an RFID system to be adaptable to a plurality of environmental conditions |
USD501560S1 (en) * | 2003-12-03 | 2005-02-01 | Diabetes Diagnostics, Inc. | Electrochemical test strip |
US7667318B2 (en) | 2003-12-03 | 2010-02-23 | Advanced Chip Engineering Technology Inc. | Fan out type wafer level package structure and method of the same |
US8297518B2 (en) * | 2003-12-26 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Paper money, coin, valuable instrument, certificates, tag, label, card, packing containers, documents, respectively installed with integrated circuit |
USD534537S1 (en) | 2004-01-06 | 2007-01-02 | Wildseed Ltd. | Connecting terminal for chip cards |
US20050156310A1 (en) | 2004-01-14 | 2005-07-21 | International Business Machines Corporation | Method and apparatus for providing optoelectronic communication with an electronic device |
US20090245029A1 (en) | 2004-01-24 | 2009-10-01 | Kin Fai Kam | Activity reminder smart card |
US7088006B2 (en) | 2004-01-28 | 2006-08-08 | Infineon Technologies Ag | Integrated circuit arrangement |
US7030316B2 (en) | 2004-01-30 | 2006-04-18 | Piranha Plastics | Insert molding electronic devices |
US20100049878A1 (en) | 2004-02-12 | 2010-02-25 | Super Talent Electronics, Inc. | Differential Data Transfer For Flash Memory Card |
US20070125866A1 (en) | 2004-02-20 | 2007-06-07 | Hirotaka Nishizawa | Ic card and a method of manufacturing the same |
US8030745B2 (en) * | 2004-03-04 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | ID chip and IC card |
US20050224588A1 (en) * | 2004-03-30 | 2005-10-13 | Infineon Technologies Ag | Transmission interface |
US20050218235A1 (en) * | 2004-03-31 | 2005-10-06 | Industrial Technology Research Institute | Editable radio frequency identification device and system for editing the same |
US7433196B1 (en) | 2004-04-14 | 2008-10-07 | Super Talent Electronics, Inc. | Card-type electronic apparatus assembly using ultrasonic joining |
US20050230485A1 (en) * | 2004-04-20 | 2005-10-20 | Ross Bruce E | Specially shaped smart card for compact applications |
US20070213096A1 (en) * | 2004-04-21 | 2007-09-13 | Valter Bella | Subscriber Identification Card Performing Radio Transceiver Functionality for Long Range Applications |
US20050253239A1 (en) | 2004-04-26 | 2005-11-17 | Renesas Technology Corp. | Memory card |
US7291903B2 (en) | 2004-04-26 | 2007-11-06 | Renesas Technology Corp. | Memory card |
US20060131429A1 (en) | 2004-05-04 | 2006-06-22 | Infineon Technologies Ag | Smart card |
US20050252978A1 (en) * | 2004-05-11 | 2005-11-17 | Renesas Technology Corp. | IC card module |
US7296754B2 (en) | 2004-05-11 | 2007-11-20 | Renesas Technology Corp. | IC card module |
US20080257967A1 (en) * | 2004-05-11 | 2008-10-23 | Hirotaka Nishizawa | IC card module |
US7669773B2 (en) | 2004-05-11 | 2010-03-02 | Renesas Technology Corp. | IC card module |
US20080135625A1 (en) * | 2004-06-09 | 2008-06-12 | Volker Waschk | Method for Producing a Portable Data Carrier |
US20090200382A1 (en) * | 2004-06-16 | 2009-08-13 | Korea Minting & Security Printing Corporation | Combi-Card and Method for Making the Same |
US8181880B2 (en) | 2004-06-16 | 2012-05-22 | Korea Minting & Security Printing Corporation | Combi-card and method for making the same |
US20050281010A1 (en) | 2004-06-18 | 2005-12-22 | Super Talent Electronics, Inc. | Contact pad arrangement for integrated SD/MMC system |
US20050287846A1 (en) * | 2004-06-29 | 2005-12-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film integrated circuit, and element substrate |
US20100312698A1 (en) | 2004-07-01 | 2010-12-09 | American Express Travel Related Services Company, Inc. | Smartcard transaction system and method |
US20060000915A1 (en) * | 2004-07-01 | 2006-01-05 | Intermec Lp Corp. | RFID tag and method of manufacture |
US8016191B2 (en) | 2004-07-01 | 2011-09-13 | American Express Travel Related Services Company, Inc. | Smartcard transaction system and method |
US7494058B2 (en) | 2004-07-01 | 2009-02-24 | American Express Travel Related Services Company, Inc. | Smartcard transaction method and system using voiceprint recognition |
US7837122B2 (en) * | 2004-07-08 | 2010-11-23 | Gemalto Sa | Method of manufacturing a substrate for a mini-UICC smart card with an associated plug-in UICC adapter, and a resulting substrate |
US20080135626A1 (en) * | 2004-07-13 | 2008-06-12 | Axalto Sa | Mini-Plug Sim Card with Improved Positioning Capability |
US20080265038A1 (en) * | 2004-07-23 | 2008-10-30 | Fractus, S.A. | Antenna in Package with Reduced Electromagnetic Interaction with on Chip Elements |
USD529031S1 (en) | 2004-07-27 | 2006-09-26 | Siliconware Precision Industries Co., Ltd. | IC card type circuit module |
US7233499B2 (en) | 2004-07-28 | 2007-06-19 | C-One Technology Corporation | Extended memory card |
US20060047971A1 (en) * | 2004-08-25 | 2006-03-02 | Seiko Epson Corporation | Integrated circuit card |
US20060049263A1 (en) * | 2004-08-30 | 2006-03-09 | Smartdisplayer Technology Co., Ltd. | IC card with display panel but without batteries |
US7156313B2 (en) * | 2004-08-30 | 2007-01-02 | Smart Displayer Technology Co., Ltd. | IC card with display panel but without batteries |
US7606042B2 (en) | 2004-09-03 | 2009-10-20 | Entorian Technologies, Lp | High capacity thin module system and method |
US7616452B2 (en) | 2004-09-03 | 2009-11-10 | Entorian Technologies, Lp | Flex circuit constructions for high capacity circuit module systems and methods |
US7760513B2 (en) | 2004-09-03 | 2010-07-20 | Entorian Technologies Lp | Modified core for circuit module system and method |
US7768796B2 (en) | 2004-09-03 | 2010-08-03 | Entorian Technologies L.P. | Die module system |
USD516076S1 (en) | 2004-09-09 | 2006-02-28 | Samsung Electronics Co., Ltd. | Electrical flash memory card |
US20060058065A1 (en) * | 2004-09-15 | 2006-03-16 | Inventec Appliances Corp. | Apparatus and a method for extending phone book records of a subscriber identification module (SIM) card |
US20070082703A1 (en) * | 2004-10-28 | 2007-04-12 | Koninklijke Kpn N.V. | Method and system for providing wireless identification |
US7975915B2 (en) | 2004-11-02 | 2011-07-12 | Gemalto Sa | Personalized USB-key type electronic device and method for making same |
US20060097059A1 (en) * | 2004-11-08 | 2006-05-11 | Seiko Epson Corporation | IC card |
US7063538B2 (en) | 2004-11-12 | 2006-06-20 | Power Digital Card Co., Ltd. | Memory card structure |
US20060139901A1 (en) | 2004-12-28 | 2006-06-29 | Virgile Meireles | Double-sided electronic module for hybrid smart card |
USD517559S1 (en) | 2004-12-30 | 2006-03-21 | C-One Technology Corporation | Mixed interface integrated circuit card |
US20060145929A1 (en) * | 2005-01-06 | 2006-07-06 | Hon Hai Precision Industry Co., Ltd. | UWB printed antenna |
US20060175418A1 (en) * | 2005-02-04 | 2006-08-10 | Chun-Hsin Ho | Method for providing additional service based on dual UICC |
US20060175417A1 (en) * | 2005-02-04 | 2006-08-10 | Chun-Hsin Ho | Dual integrated circuit card system |
US7252242B2 (en) | 2005-02-04 | 2007-08-07 | Chun-Hsin Ho | Method for providing additional service based on dual UICC |
US7303137B2 (en) * | 2005-02-04 | 2007-12-04 | Chun-Hsin Ho | Dual integrated circuit card system |
US8573494B2 (en) | 2005-02-22 | 2013-11-05 | Tyfone, Inc. | Apparatus for secure financial transactions |
US8136732B2 (en) | 2005-02-22 | 2012-03-20 | Tyfone, Inc. | Electronic transaction card with contactless interface |
US20060194479A1 (en) | 2005-02-28 | 2006-08-31 | Renesas Technology Corp. | Adapter for a memory card and a memory card |
US20080153205A1 (en) | 2005-03-11 | 2008-06-26 | Hirotaka Nishizawa | Semiconductor device and a method for manufacturing the same |
US20060205280A1 (en) | 2005-03-11 | 2006-09-14 | Renesas Technology Corp. | Semiconductor device and a method for manufacturing the same |
US7352588B2 (en) | 2005-03-11 | 2008-04-01 | Renesas Technology Corp. | Semiconductor device and a method for manufacturing the same |
US7511365B2 (en) | 2005-04-21 | 2009-03-31 | Industrial Technology Research Institute | Thermal enhanced low profile package structure |
US20090242646A1 (en) * | 2005-04-22 | 2009-10-01 | Javier Perez Aznar | Personal identification card comprising a two-dimensional image of the user |
US20090032593A1 (en) | 2005-04-25 | 2009-02-05 | Henrik Ljungcrantz | Smart card and smart card reader |
US20080054079A1 (en) * | 2005-05-09 | 2008-03-06 | Mullen Jeffrey D | Dynamic credit card with magnetic stripe and embedded encoder and methods for using the same to provide a copy-proof credit card |
US20080302876A1 (en) * | 2005-05-09 | 2008-12-11 | Mullen Jeffrey D | Dynamic credit card with magnetic stripe and embedded encoder and methods for using the same to provide a copy-proof credit card |
US8107246B2 (en) | 2005-05-11 | 2012-01-31 | Gemalto Sa | Adhesive format adapter for a storage device and method for the production thereof |
US7810718B2 (en) | 2005-05-12 | 2010-10-12 | Cubic Corporation | Variable thickness data card body |
USD552099S1 (en) | 2005-05-24 | 2007-10-02 | Renesas Technology Corporation | Memory card |
USD556764S1 (en) | 2005-05-24 | 2007-12-04 | Renesas Technology Corporation | Memory card |
USD581932S1 (en) | 2005-05-24 | 2008-12-02 | Renesas Technology Corp. | Memory card |
USD552098S1 (en) | 2005-05-24 | 2007-10-02 | Renesas Technology Corporation | Memory card |
US20090040116A1 (en) | 2005-05-25 | 2009-02-12 | Oberthur Card Systems Sa | Electronic entity with magnetic antenna |
US7675151B1 (en) | 2005-06-01 | 2010-03-09 | Rockwell Collins, Inc. | Silicon-based packaging for electronic devices |
US20060278722A1 (en) * | 2005-06-13 | 2006-12-14 | Kabushiki Kaisha Toshiba | Semiconductor device, method of manufacturing the same, and information managing system for the same |
US20060288145A1 (en) | 2005-06-21 | 2006-12-21 | Power Digital Card Co., Ltd. | Dual connecting interface memory card |
US20060288146A1 (en) | 2005-06-21 | 2006-12-21 | Power Digital Card Co., Ltd. | Dual connecting interface memory card |
USD573154S1 (en) | 2005-06-30 | 2008-07-15 | Microsoft Corporation | Icon for a portion of a display screen |
US7630209B2 (en) | 2005-07-14 | 2009-12-08 | Samsung Electronics Co., Ltd. | Universal PCB and smart card using the same |
US20070013396A1 (en) | 2005-07-14 | 2007-01-18 | Dong-Han Kim | Universal pcb and smart card using the same |
US7855895B2 (en) | 2005-07-14 | 2010-12-21 | Samsung Electronics Co., Ltd. | Universal PCB and smart card using the same |
US20070023532A1 (en) | 2005-07-18 | 2007-02-01 | Narendra Siva G | Electronic stripe cards |
US7364092B2 (en) | 2005-07-18 | 2008-04-29 | Tyfone, Inc. | Electronic stripe cards |
US7458519B2 (en) | 2005-07-26 | 2008-12-02 | Sony Corporation | Card tray |
US20070026740A1 (en) | 2005-07-27 | 2007-02-01 | Power Digital Card Co., Ltd. | Adapter card structure |
US20070025092A1 (en) | 2005-08-01 | 2007-02-01 | Baik-Woo Lee | Embedded actives and discrete passives in a cavity within build-up layers |
US20070032268A1 (en) * | 2005-08-02 | 2007-02-08 | Gotfried Bradley L | Communications device and card |
US7605453B2 (en) * | 2005-08-11 | 2009-10-20 | Infineon Technologies Ag | Chip module and chip card |
US20090156254A1 (en) * | 2005-10-10 | 2009-06-18 | Wavecom | Radio communication device comprising at least one radio communication module and one sim card, corresponding radio communication module and sim card |
US20070080869A1 (en) * | 2005-10-12 | 2007-04-12 | Benq Corporation | Antenna structure on circuit board |
US20070138301A1 (en) | 2005-10-14 | 2007-06-21 | Infineon Technologies Ag | Smart card module |
US7475818B2 (en) | 2005-10-31 | 2009-01-13 | Research In Motion Limited | Combined battery and smart card |
US20090121020A1 (en) | 2005-10-31 | 2009-05-14 | Niall Gallagher | Combined battery and smart card |
US20070095910A1 (en) | 2005-10-31 | 2007-05-03 | Research In Motion Limited | Combined battery and smart card |
US20080290160A1 (en) | 2005-11-04 | 2008-11-27 | Oberthur Technologies | Contactless Electronic Microcircuit Document and Proximity Sensor |
US20080277484A1 (en) | 2005-11-08 | 2008-11-13 | Oberthur Technologies | Smart Card Producing Method and a Smart Card in Particular Provided with a Magnetic Antenna |
US20070108298A1 (en) * | 2005-11-14 | 2007-05-17 | Sebastien Kalck | Smart Card Body, Smart Card and Manufacturing Process for the Same |
US20070126099A1 (en) | 2005-12-02 | 2007-06-07 | Sony Corporation | Memory card |
US20070145133A1 (en) | 2005-12-22 | 2007-06-28 | Lg Electronics Inc. | Method for a more efficient use of an interface between a smart card and a device, associated smart card and device |
US20070153487A1 (en) | 2005-12-30 | 2007-07-05 | Incard S.A. | Plated module for an ic card |
US20070152072A1 (en) | 2005-12-30 | 2007-07-05 | Incard S.A. | Ic card with improved plated module |
US7719846B2 (en) | 2005-12-30 | 2010-05-18 | Incard Sa | Plated module for an IC card |
US20070164119A1 (en) * | 2006-01-16 | 2007-07-19 | Liu Kwang W | Electronic business card and data transceiver |
US7909251B2 (en) | 2006-02-04 | 2011-03-22 | Samsung Electronics Co., Ltd. | Memory card pack |
US8061623B2 (en) | 2006-02-09 | 2011-11-22 | Vadim Evgenevich Balchaytis | Plastic card provided with electrical contacts |
US7193161B1 (en) | 2006-02-15 | 2007-03-20 | Sandisk Corporation | SiP module with a single sided lid |
US7359204B1 (en) | 2006-02-15 | 2008-04-15 | Amkor Technology, Inc. | Multiple cover memory card |
USD566723S1 (en) * | 2006-03-08 | 2008-04-15 | Disney Enterpises, Inc. | Portion of a computer screen with an icon image |
US20090111522A1 (en) * | 2006-03-09 | 2009-04-30 | Javier Canis Robles | Smart Card and Method for Manufacturing Said Card |
US7425464B2 (en) | 2006-03-10 | 2008-09-16 | Freescale Semiconductor, Inc. | Semiconductor device packaging |
US20090084858A1 (en) * | 2006-03-27 | 2009-04-02 | Fabrizio Borracci | Method For Making A Secure Personal Card And Its Working Process |
US7560806B2 (en) | 2006-03-29 | 2009-07-14 | Sony Corporation | Memory card |
US20070228536A1 (en) | 2006-03-29 | 2007-10-04 | Sony Corporation | Memory card |
US20090250523A1 (en) * | 2006-03-29 | 2009-10-08 | Stmicroelectronics, Inc. | System and method for sensing biometric and non-biometric smart card devices |
US20090173793A1 (en) | 2006-03-30 | 2009-07-09 | Oji Paper Co., Ltd. | Ic module, ic inlet, and ic mounted body |
US8110434B2 (en) | 2006-03-31 | 2012-02-07 | Kabushiki Kaisha Toshiba | Semiconductor device and memory card using the same |
US7874491B2 (en) | 2006-04-07 | 2011-01-25 | Infineon Technologies Ag | Carrier arrangement with overvoltage protection |
USD574384S1 (en) | 2006-04-27 | 2008-08-05 | Pari Pharma Gmbh | Chip card |
US20100285841A1 (en) * | 2006-05-24 | 2010-11-11 | Paul Jolivet | Method for reducing power consumption for detachable card and mobile communication terminal thereof |
US20070279312A1 (en) * | 2006-06-02 | 2007-12-06 | Hon Hai Precision Industry Co., Ltd. | Planar Antenna |
US20070290049A1 (en) * | 2006-06-19 | 2007-12-20 | Intelcard, Inc. | Interactive transaction cards |
USD571810S1 (en) * | 2006-06-20 | 2008-06-24 | Kabushiki Kaisha Toshiba | Module with built-in integrated circuits for use with IC cards |
US20090210569A1 (en) | 2006-07-05 | 2009-08-20 | Gemalto Sa | Multi-function peripheral device, corresponding method and electronic system having a peripheral and a host communicating via a single interface |
US7179129B1 (en) | 2006-07-12 | 2007-02-20 | Chin-Hwa Hwang | 2-in-1 SD type memory card adapter |
US7226318B1 (en) | 2006-07-19 | 2007-06-05 | Yun-Hsiu Lee | Card adapter structure |
US20080020800A1 (en) * | 2006-07-21 | 2008-01-24 | Yingzan Xu | Two-in-one connector for both sim card of mobile phone and memory card |
US20080054493A1 (en) | 2006-08-31 | 2008-03-06 | Michael Leddige | Systems and arrangements for interconnecting integrated circuit dies |
US20090272815A1 (en) * | 2006-09-06 | 2009-11-05 | Colin Tanner | Proximity payment card with printed indication of switch location |
US20080061150A1 (en) * | 2006-09-08 | 2008-03-13 | Simon Phillips | Identification token and method of making identification token |
US20110259966A1 (en) * | 2006-09-08 | 2011-10-27 | Simon Phillips | Identification of installable card |
US8336784B2 (en) * | 2006-09-08 | 2012-12-25 | Mastercard International, Inc. | Identification of installable card |
US20080061151A1 (en) * | 2006-09-08 | 2008-03-13 | Simon Phillips | Identification of installable card |
US20090224888A1 (en) | 2006-09-11 | 2009-09-10 | Gemalto Sa | Method and system for optimized reading of a radio frequency communication transponder with the aid of a passive resonant circuit |
US20090302119A1 (en) * | 2006-09-12 | 2009-12-10 | Dierk Dohmann | Chip Card, and Method for the Software-Based Modification of a Chip Card |
US20080083831A1 (en) * | 2006-09-15 | 2008-04-10 | Sandisk Il Ltd. | Ternary SIM Card Delivery |
US20080076474A1 (en) * | 2006-09-21 | 2008-03-27 | Taisys Technologies Co., Ltd. | Laminated card assembly |
US20100025480A1 (en) | 2006-09-27 | 2010-02-04 | Hirotaka Nishizawa | Ic card and ic card socket |
USD601521S1 (en) * | 2006-09-28 | 2009-10-06 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
USD589471S1 (en) * | 2006-09-28 | 2009-03-31 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
USD574835S1 (en) * | 2006-10-06 | 2008-08-12 | Taisys Technologies Co., Ltd. | Miniaturized card |
US20080088038A1 (en) | 2006-10-11 | 2008-04-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Bond pad structures and integrated circuit chip having the same |
US20080102895A1 (en) * | 2006-10-26 | 2008-05-01 | Sandisk Il Ltd. | Method Of Extracting A Smart Card From A Smart Card Socket |
US20080099559A1 (en) | 2006-10-31 | 2008-05-01 | Macronix International Co., Ltd. | Dual Interface SIM Card Adapter with Detachable Antenna |
US20080101986A1 (en) * | 2006-10-31 | 2008-05-01 | Selwayan Saini | Analytical test strip with electroluminescent module |
US20100001080A1 (en) * | 2006-10-31 | 2010-01-07 | Electronics And Telecommunications Research Institute | Tag antenna structure for wireless identification and wireless identification system using the tag antenna structure |
US20100032487A1 (en) * | 2006-11-06 | 2010-02-11 | Bielomatik Leuze Gmbh & Co. Kg | Chip module for an rfid system |
US20090235037A1 (en) | 2006-11-07 | 2009-09-17 | Oberthur Technologies | Method and device for customizing a portable electronic entity |
USD570800S1 (en) * | 2006-11-27 | 2008-06-10 | Uniband Electronic Corp. | ISM-band printed antenna for a portion of a circuit board |
US7655501B2 (en) | 2006-12-13 | 2010-02-02 | Advanced Chip Engineering Technology Inc. | Wafer level package with good CTE performance |
US20080146280A1 (en) | 2006-12-14 | 2008-06-19 | Infineon Technologies Ag | Smart card; communication device; method for selecting a communication network to be used by a communication device; computer program product |
US20080144650A1 (en) | 2006-12-19 | 2008-06-19 | Infineon Technologies Ag | Apparatus for contactless transmission of data from a memory |
US20100072284A1 (en) | 2006-12-20 | 2010-03-25 | Renesas Technology Corp. | Semiconductor device and adaptor for the same |
US20080149737A1 (en) * | 2006-12-25 | 2008-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor Device and Driving Method Thereof |
US7812434B2 (en) | 2007-01-03 | 2010-10-12 | Advanced Chip Engineering Technology Inc | Wafer level package with die receiving through-hole and method of the same |
US8079528B2 (en) | 2007-01-10 | 2011-12-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Input/output pads placement for a smart card chip |
US20080164324A1 (en) | 2007-01-10 | 2008-07-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Input/output pads placement for a smart card chip |
US20080263363A1 (en) | 2007-01-22 | 2008-10-23 | Spyrus, Inc. | Portable Data Encryption Device with Configurable Security Functionality and Method for File Encryption |
US20080182120A1 (en) | 2007-01-28 | 2008-07-31 | Lan Chu Tan | Bond pad for semiconductor device |
US20080223937A1 (en) * | 2007-03-15 | 2008-09-18 | Joseph Frank Preta | Smart apparatus for making secure transactions |
US20100038435A1 (en) * | 2007-03-29 | 2010-02-18 | Kabushiki Kaisha Toshiba | Information storage medium |
US20080308641A1 (en) | 2007-04-10 | 2008-12-18 | Advanced Microelectronic And Automation Technology Ltd. | Smart card with switchable matching antenna |
US20100293784A1 (en) | 2007-04-24 | 2010-11-25 | Oded Bashan | Electronic interface apparatus and method and system for manufacturing same |
US8333004B2 (en) | 2007-04-24 | 2012-12-18 | Smartrac Ip B.V. | Electronic interface apparatus and method and system for manufacturing same |
US20100200661A1 (en) * | 2007-04-24 | 2010-08-12 | Guy Shafran | Electronic interface apparatus and method and system for manufacturing same |
US20080265039A1 (en) * | 2007-04-27 | 2008-10-30 | First Data Corporation | Protected Contactless Card |
US8085547B2 (en) | 2007-04-29 | 2011-12-27 | Hon Hai Precision Industry Co., Ltd. | Electronic elements carrier |
US7980477B2 (en) | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
US8174105B2 (en) | 2007-05-17 | 2012-05-08 | Micron Technology, Inc. | Stacked semiconductor package having discrete components |
US7807502B2 (en) | 2007-05-17 | 2010-10-05 | Micron Technology, Inc. | Method for fabricating semiconductor packages with discrete components |
US7486520B2 (en) | 2007-05-25 | 2009-02-03 | Kingston Technology Corporation, Inc. | Modular flash memory card expansion system |
US20080299860A1 (en) | 2007-05-31 | 2008-12-04 | Jae Hee Lee | Method of fabricating smart display card having liquid crystal display unit |
US20080308640A1 (en) * | 2007-06-12 | 2008-12-18 | Taisys Technologies Co., Ltd. | Contactless stand-alone assembly |
US7619901B2 (en) | 2007-06-25 | 2009-11-17 | Epic Technologies, Inc. | Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system |
US20110147463A1 (en) * | 2007-08-14 | 2011-06-23 | Christoph Schiller | Data storage medium which is in the form of a card and has a raised area |
US20090057417A1 (en) * | 2007-08-29 | 2009-03-05 | Renesas Technology Corp. | Ic card |
US20090061933A1 (en) | 2007-08-29 | 2009-03-05 | Mxtran Inc. | Multiple Interface Card In A Mobile Phone |
US20100176207A1 (en) * | 2007-09-07 | 2010-07-15 | Yoshishige Yoshikawa | Sim card ic module and sim card |
US7922097B2 (en) * | 2007-09-07 | 2011-04-12 | Panasonic Corporation | SIM card IC module and SIM card |
US20090065587A1 (en) * | 2007-09-10 | 2009-03-12 | Simon Phillips | Identification token and method of making identification token |
US20090065591A1 (en) | 2007-09-12 | 2009-03-12 | Seiko Epson Corporation | Smart-card chip arrangement |
US20090065592A1 (en) | 2007-09-12 | 2009-03-12 | Seiko Epson Corporation | Smart card chip arrangement |
US20090069052A1 (en) | 2007-09-12 | 2009-03-12 | Devicefidelity, Inc. | Receiving broadcast signals using intelligent covers for mobile devices |
US20090108063A1 (en) | 2007-09-12 | 2009-04-30 | Deepak Jain | Wirelessly Communicating Radio Frequency Signals |
US7847380B2 (en) | 2007-09-20 | 2010-12-07 | Samsung Electronics Co., Ltd. | Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card |
US20090079053A1 (en) | 2007-09-20 | 2009-03-26 | Samsung Electronics Co., Ltd. | Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card |
USD588080S1 (en) * | 2007-09-26 | 2009-03-10 | Gem Services, Inc. | 2021-8J matrix leadframe |
US8061625B2 (en) * | 2007-10-30 | 2011-11-22 | Nationz Technologies Inc. | Radio frequency IC card device with very high frequency |
US20100273528A1 (en) * | 2007-10-30 | 2010-10-28 | Nationz Technologies Inc. | Radio frequency ic card device with very high frequency |
US20100227644A1 (en) * | 2007-10-30 | 2010-09-09 | Nationz Technologies Inc. | Radio frequency ic card device with very high frequency |
US8002196B2 (en) * | 2007-10-30 | 2011-08-23 | Nationz Technologies Inc. | Radio frequency IC card device with very high frequency |
US20100262840A1 (en) | 2007-11-02 | 2010-10-14 | Inside Contactless | Method and devices for protecting a microcircuit from attacks for obtaining secret data |
US20090127345A1 (en) | 2007-11-13 | 2009-05-21 | Oberthur Technologies | Smart card, telephone comprising such a card and method for executing a command in such a card |
US20090169013A1 (en) | 2007-11-26 | 2009-07-02 | Koolspan, Inc. | System for and method of cryptographic provisioning |
US20090140443A1 (en) | 2007-11-29 | 2009-06-04 | Stichting Imec Nederland | Microstructure with Enlarged Mass and Electrode Area for Kinetic to Electrical Energy Conversion |
US20090160071A1 (en) | 2007-12-20 | 2009-06-25 | Geng-Shin Shen | Die rearrangement package structure using layout process to form a compliant configuration |
US20100084759A1 (en) | 2007-12-20 | 2010-04-08 | Geng-Shin Shen | Die Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration |
US7662667B2 (en) | 2007-12-20 | 2010-02-16 | Chipmos Technologies Inc | Die rearrangement package structure using layout process to form a compliant configuration |
US20090166895A1 (en) | 2007-12-26 | 2009-07-02 | Sanyo Electric Co., Ltd. | Circuit substrate, circuit device and manufacturing process thereof |
US20090172279A1 (en) | 2007-12-28 | 2009-07-02 | Po Yuan | System For Accessing A Removable Non-Volatile Memory Card |
US20100203870A1 (en) | 2008-01-04 | 2010-08-12 | Logomotion, S.R.O. | Systems and methods for contactless payment authorization |
US8030746B2 (en) | 2008-02-08 | 2011-10-04 | Infineon Technologies Ag | Integrated circuit package |
US20090216681A1 (en) | 2008-02-26 | 2009-08-27 | Battelle Energy Alliance, Llc | Systems and methods for performing wireless financial transactions |
USD599308S1 (en) * | 2008-05-20 | 2009-09-01 | Deka Products Limited Partnership | RFID antenna circuit board |
US20110059773A1 (en) * | 2008-05-29 | 2011-03-10 | Peter Neumann | Personalising a sim by means of a unique personalized master sim |
USD598126S1 (en) * | 2008-06-06 | 2009-08-11 | Lifescan Scotland Limited | Electrochemical test strip |
US7961101B2 (en) | 2008-08-08 | 2011-06-14 | Tyfone, Inc. | Small RFID card with integrated inductive element |
US20110171996A1 (en) | 2008-08-08 | 2011-07-14 | Tyfone, Inc. | Smartcard performance enhancement circuits and systems |
US8072331B2 (en) | 2008-08-08 | 2011-12-06 | Tyfone, Inc. | Mobile payment device |
US20110125967A1 (en) | 2008-08-08 | 2011-05-26 | Sk Telecom. Co., Ltd | Interface system between a terminal and a smart card, method for same, and smart card applied to same |
US20110117961A1 (en) * | 2008-08-08 | 2011-05-19 | Sk Teleom Co., Ltd. | System for interfacing between a terminal and a smart card, method for same, and smart card applied to same |
US20100033307A1 (en) | 2008-08-08 | 2010-02-11 | Narendra Siva G | Small rfid card with integrated inductive element |
US20100033310A1 (en) | 2008-08-08 | 2010-02-11 | Narendra Siva G | Power negotation for small rfid card |
USD611039S1 (en) * | 2008-08-21 | 2010-03-02 | Panasonic Corporation | Antenna |
USD608770S1 (en) * | 2008-08-21 | 2010-01-26 | Panasonic Corporation | Antenna |
US20100072618A1 (en) | 2008-09-22 | 2010-03-25 | Stats Chippac, Ltd. | Semiconductor Device and Method of Forming a Wafer Level Package with Bump Interconnection |
US7862381B2 (en) | 2008-09-26 | 2011-01-04 | Sandisk Corporation | Connector block feature |
US7909611B2 (en) | 2008-09-26 | 2011-03-22 | Sandisk Corporation | Method for preventing damage to a memory card |
US8167659B2 (en) | 2008-09-26 | 2012-05-01 | Sandisk Technologies Inc. | Connector block feature |
US20100078485A1 (en) * | 2008-09-29 | 2010-04-01 | Dynacard Co., Ltd. | Subscriber identity module card |
US7763976B2 (en) | 2008-09-30 | 2010-07-27 | Freescale Semiconductor, Inc. | Integrated circuit module with integrated passive device |
US20100078486A1 (en) * | 2008-09-30 | 2010-04-01 | Fujitsu Limited | Antenna and reader/writer device |
US8301915B2 (en) * | 2008-10-02 | 2012-10-30 | Renesas Electronics Corporation | Semiconductor integrated circuit device and IC card using the same |
USD601168S1 (en) * | 2008-10-27 | 2009-09-29 | Microsoft Corporation | Icon for a display screen |
US20110186641A1 (en) * | 2008-10-29 | 2011-08-04 | Murata Manufacturing Co., Ltd. | Radio ic device |
US20110210177A1 (en) * | 2008-11-28 | 2011-09-01 | Cyrille Pepin | Smart card comprising an electronic module supported on a card body provided with a means for authenticating the peering of the module with the body |
US20100140814A1 (en) | 2008-12-04 | 2010-06-10 | Freescale Semiconductor, Inc. | Rf device and method with trench under bond pad feature |
US8342416B2 (en) | 2009-01-09 | 2013-01-01 | Murata Manufacturing Co., Ltd. | Wireless IC device, wireless IC module and method of manufacturing wireless IC module |
US20110253795A1 (en) * | 2009-01-09 | 2011-10-20 | Murata Manufacturing Co., Ltd. | Wireless ic device, wireless ic module and method of manufacturing wireless ic module |
US20100190528A1 (en) * | 2009-01-23 | 2010-07-29 | Phytrex Technology Corporation | Signal Processing Device |
US8231061B2 (en) | 2009-02-24 | 2012-07-31 | Tyfone, Inc | Contactless device with miniaturized antenna |
US20120256324A1 (en) | 2009-04-01 | 2012-10-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for Improving Performance of Etch Stop Layer |
US8422238B2 (en) | 2009-04-13 | 2013-04-16 | Phytrex Technology Corporation | Signal conversion device |
US8143713B2 (en) | 2009-04-28 | 2012-03-27 | Samsung Electronics Co., Ltd. | Chip-on-board package |
US8110916B2 (en) | 2009-06-19 | 2012-02-07 | Advanced Semiconductor Engineering, Inc. | Chip package structure and manufacturing methods thereof |
US20120104634A1 (en) | 2009-06-19 | 2012-05-03 | Advanced Semiconductor Engineering, Inc. | Chip package structure and manufacturing methods thereof |
US20120225691A1 (en) * | 2009-09-14 | 2012-09-06 | Ingecom Sarl | Identification module with an active tag |
US20110077051A1 (en) * | 2009-09-25 | 2011-03-31 | At&T Intellectual Property I, L.P. | UICC Control Over Devices Used to Obtain Service |
USD628202S1 (en) | 2009-10-20 | 2010-11-30 | Sandisk Corporation | MicroSD memory card with different color surfaces |
USD638431S1 (en) | 2009-10-20 | 2011-05-24 | Sandisk Corporation | MicroSD memory card with a semi-transparent color surface |
US20110111593A1 (en) * | 2009-11-09 | 2011-05-12 | Masahiro Kanno | Pattern formation method, pattern formation system, and method for manufacturing semiconductor device |
US20110115060A1 (en) | 2009-11-19 | 2011-05-19 | Advanced Semiconductor Engineering, Inc. | Wafer-Level Semiconductor Device Packages with Electromagnetic Interference Shielding |
US20110147467A1 (en) * | 2009-12-18 | 2011-06-23 | Yu Yung Choi | Enhanced performance and security rfid device |
US20110149533A1 (en) * | 2009-12-22 | 2011-06-23 | Mxtran Inc. | Integrated circuit film for smart card |
US7946876B1 (en) | 2009-12-25 | 2011-05-24 | Chi Mei Communication Systems, Inc. | Smart card holder for portable electronic device |
US20110157838A1 (en) | 2009-12-28 | 2011-06-30 | Sony Corporation | Card device |
US7914296B1 (en) | 2010-01-05 | 2011-03-29 | Exatron, Inc. | Interconnecting assembly with conductive lever portions on a support film |
US20110180599A1 (en) * | 2010-01-26 | 2011-07-28 | Chih-Kuei Hu | IC card |
US20110182037A1 (en) | 2010-01-28 | 2011-07-28 | Sony Corporation | Card device |
US20110194265A1 (en) | 2010-02-05 | 2011-08-11 | Advanced Semiconductor Engineering, Inc. | Embedded Component Substrate and Manufacturing Methods Thereof |
US20110204147A1 (en) * | 2010-02-19 | 2011-08-25 | Cubic Corporation | Smartcard interconnect |
US20110233545A1 (en) | 2010-03-29 | 2011-09-29 | Samsung Electronics Co., Ltd. | Semiconductor Chip Having Double Bump Structure And Smart Card Including The Same |
US20110253793A1 (en) * | 2010-04-14 | 2011-10-20 | Technologies, Roi Llc | Radio frequency identification tags and methods employing ceramic components, which may be suitable for use in extreme environmental conditions |
US20110298585A1 (en) | 2010-06-08 | 2011-12-08 | Vodafone Holding Gmbh | Smart card and mobile communication device comprising the smart card |
US20110304060A1 (en) | 2010-06-09 | 2011-12-15 | Beijing Boe Optoelectronics Technology Co., Ltd. | Metal thin film connection structure, manufacturing method thereof and array substrate |
USD651992S1 (en) * | 2010-08-17 | 2012-01-10 | Sumitomo Electric Industries, Ltd. | Semiconductor substrate |
US20120048948A1 (en) * | 2010-08-26 | 2012-03-01 | Oberthur Technologies | Method for Manufacturing a Card Based on a Substrate |
USD643040S1 (en) | 2010-10-26 | 2011-08-09 | Hon Hai Precision Ind. Co., Ltd. | Electrical card |
USD681640S1 (en) | 2010-12-03 | 2013-05-07 | Sony Computer Entertainment Inc. | Storage medium |
US20120161337A1 (en) | 2010-12-28 | 2012-06-28 | Kabushiki Kaisha Toshiba | Wiring method for semiconductor integrated circuit, semiconductor-circuit wiring apparatus and semiconductor integrated circuit |
US20120289196A1 (en) | 2011-04-29 | 2012-11-15 | Tang Yew Tan | Compact form factor integrated circuit card and methods |
US20120292395A1 (en) * | 2011-05-20 | 2012-11-22 | Mxtran Inc. | Integrated circuit film for smart card and mobile communication device |
USD686214S1 (en) | 2011-07-28 | 2013-07-16 | Lifenexus, Inc. | Smartcard with iChip contact pad |
USD667442S1 (en) * | 2011-09-12 | 2012-09-18 | Microsoft Corporation | Display screen with icon |
US20130084918A1 (en) * | 2011-10-03 | 2013-04-04 | Broadcom Corporation | Wireless communication device with sim-to-sd adaptor |
USD669478S1 (en) | 2012-01-13 | 2012-10-23 | Research In Motion Limited | Device smart card |
USD669479S1 (en) | 2012-01-13 | 2012-10-23 | Research In Motion Limited | Device smart card |
Non-Patent Citations (42)
Title |
---|
"3GPP TSG-CT6#55," Distributing mini-UICC as punch out from Plug-in or double punch-out from ID-1, Kyoto, Japan, May 11-14, 2010, 2 pages. |
"ETSI SCP TEC Meeting #40," Sophia Antipolis, France, Aug. 29-Sep. 1, 2011, 5 pages. |
"ETSI TC SCP Meeting #51," San Diego, CA, Jul. 21-22, 2011, 5 pages. |
"ETSI TC SCP TEC #40," Sophia-Antipolis, France, Aug. 26-Sep. 1, 2011, 1 page. |
"iPhone Teardown," © 2011 iFixit, 4 pages. |
Canadian Intellectual Property Office, "Office Action," issued in connection with Canadian application serial No. 145596, issued Oct. 26, 2012, 2 pages. |
Canadian Intellectual Property Office, Industrial Design Certificate of Registration, issued in connection with Canadian Patent Application No. 147625 on Sep. 18, 2013, 8 pages. |
Canadian Intellectual Property Office, Industrial Design Certificate of Registration, issued in connection with Canadian Patent Application No. 147626 on Sep. 18, 2013, 8 pages. |
Canadian Intellectual Property Office, Industrial Design Examiners Report, issued in connection with Canadian Patent Application No. 147627 on Sep. 19, 2013, 2 pages. |
ETSI, "ETSI TS 102 221," V9.2.0, Technical Specification, Oct. 2010, 179 pages. |
ETSI, ETSI TS 102 412, V11.0.0, Technical Specification, May 2011, 90 pages. |
ETSI, ETSI TS 102 600, V10.0.0, Techincal Specification, Oct. 2010, 26 pages. |
ETSI, ETSI TS 102 613, V9.2.0, Mar. 2011, 57 pages. |
ETSI, ETSI TS 102 671, V9.1.0, Sep. 2011, 21 pages. |
International Organization for Standardization, "Identification Cards-Integrated Circuit Cards," ISO/IEC 7816-1, Feb. 15, 2011, 8 pages. |
International Organization for Standardization, "Identification Cards-Integrated Circuit Cards," ISO/IEC 7816-2, Oct. 15, 2007, 14 pages. |
International Organization for Standardization, "Identification Cards-Integrated Circuit Cards," ISO/IEC 7816-3, Nov. 1, 2006, 58 pages. |
International Organization for Standardization, "Identification Cards-Physical Characteristics," ISO/IEC 7810, Nov. 1, 2003, 26 pages. |
Nokia, "Nokia 4FF Proposal and Rationale," based on the discussion and feedback from leading suppliers and manufacturers of SIM card connectors, Aug. 25, 2011, 5 pages. |
SMK, "Push-Push Style Micro SIM Memory Card Connector," retrieved from www.smkusa.com/usa/featured—products/mem/, Dec. 12, 2011, 4 pages. |
State Intellectual Property Office of P.R. China, "Office Action," with unverified redacted English translation, issued in connection with Chinese application serial No. 201230153596, issued Sep. 18, 2012, 2 pages. |
TE Connectivity, "Recommendations 4FF SIM for ETSI," Mar. 30, 2011, 9 pages. |
The United States Patent and Trademark Office, "Supplemental Notice of Allowance for a Design Application," issued in connection with Design U.S. Appl. No. 29/418,619, mailed Jan. 2, 2014, 4 pages. |
The United States Patent and Trademark Office, "Supplemental Notice of Allowance for a Design Application," issued in connection with Design U.S. Appl. No. 29/418,880, mailed Jan. 2, 2014, 4 pages. |
The United States Patent and Trademark Office, "Supplemental Notice of Allowance for a Design Application," issued in connection with Design U.S. Appl. No. 29/419,286, mailed Jan. 6, 2014, 5 pages. |
The United States Patent and Trademark Office, Notice of Allowance and Fee(s) Due, issued in connection with Design U.S. Appl. No. 29/418,619, mailed Nov. 14, 2013, 22 pages. |
The United States Patent and Trademark Office, Notice of Allowance and Fee(s) Due, issued in connection with Design U.S. Appl. No. 29/418,880, mailed Nov. 12, 2013, 21 pages. |
The United States Patent and Trademark Office, Notice of Allowance and Fee(s) Due, issued in connection with Design U.S. Appl. No. 29/419,286, mailed Nov. 12, 2013, 35 pages. |
United States Patent and Trademark Office, "Ex Parte Quayle Action," issued in connection with U.S. Appl. No. 29/418,619, issued Feb. 27, 2013, 6 page. |
United States Patent and Trademark Office, "Ex Parte Quayle Action," issued in connection with U.S. Appl. No. 29/418,619, mailed on Jun. 20, 2013. (49 pages). |
United States Patent and Trademark Office, "Ex Parte Quayle Action," issued in connection with U.S. Appl. No. 29/418,880, issued Feb. 7, 2013, 29 pages. |
United States Patent and Trademark Office, "Ex Parte Quayle Action," issued in connection with U.S. Appl. No. 29/418,880, mailed on Jun. 28, 2013. (22 pages). |
United States Patent and Trademark Office, "Ex Parte Quayle Action," issued in connection with U.S. Appl. No. 29/419,286, mailed on Jun. 20, 2013. (33 pages). |
United States Patent and Trademark Office, "Final Office Action," issued in connection with U.S. Appl. No. 29/405,848, issued Feb. 22, 2013, 11 pages. |
United States Patent and Trademark Office, "Final Rejection," issued in connection with U.S. Appl. No. 13/290,874, mailed on Jun. 18, 2013. (42 pages). |
United States Patent and Trademark Office, "Non-Final Office Action," issued in connection with U.S. Appl. No. 13/290,874, issued Feb. 28, 2013, 38 pages. |
United States Patent and Trademark Office, "Non-Final Office Action," issued in connection with U.S. Appl. No. 29/405,845, issued Sep. 27, 2012, 4 pages. |
United States Patent and Trademark Office, "Non-Final Office Action," issued in connection with U.S. Appl. No. 29/405,848, issued Oct. 2, 2012, 4 pages. |
United States Patent and Trademark Office, "Notice of Allowance and Fee(s) Due," issued in connection with U.S. Appl. No. 29/405,848, mailed on Jun. 25, 2013. (42 pages). |
United States Patent and Trademark Office, "Restriction Requirement," issued in connection with U.S. Appl. No. 29/418,619, mailed Jan. 17, 2013, 9 pages. |
United States Patent and Trademark Office, "Restriction Requirement," issued in connection with U.S. Appl. No. 29/418,880, mailed Dec. 20, 2012, 7 pages. |
United States Patent and Trademark Office, "Restriction Requirement," issued in connection with U.S. Appl. No. 29/419,286, issued Mar. 7, 2013, 9 pages. |
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